• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.236-240
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• 2012

Limiting thermal exposure time using rapid thermal processing(RTP) has emerged as promising simplified process for manufacturing of solar cell in a continuous way. This paper reports the simplification of co-firing using RTP. Actual temperature profile for co-firing after screen printing is a key issue for high-quality metal-semiconductor contact. The plateau time during the firing process were varied at $450^{\circ}C$ for 10~16 sec. Glass frit in Ag paste etch anti-reflection layer with plateau time. Glass frit in Ag paste is important for the Ag/Si contact formation and performances of crystalline Si solar cell. We achieved 17.14% efficiency with optimum conditions.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.35 no.4
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• pp.1-9
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• 2012

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1128-1129
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• 2006

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond cohesion. Strong cohesion between diamond and metal matrix prevents macro scratch on the wafer during CMP Process. Typically the diamond tool has been manufactured by sintered, brazed and electro-plated methods. In this paper, some results will be reported of cohesion between diamond and metal matrix of the diamond tools prepared by three different manufacturing methods. The cohesion force of brazed diamond tool is found stronger than the others. This cohesion force is increased in reverse proportion to the contact area of diamond and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of Cr in metal matrix and C in diamond, which enhance the interfacial cohesion strength between diamonds and metal matrix.

• Proceedings of the Korea Technology Innovation Society Conference
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• 2017.11a
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• pp.763-777
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• 2017

기술집약적 산업의 급격한 기술혁신 속도 및 환경변화에 따른 기술수명 주기의 단축, 기술간 경쟁을 통한 시장지배력의 우위를 선점하기 위해 기술융합을 통한 연구전략 수립은 중요한 이슈가 되고 있다. 최근 4차 산업혁명 기반의 반도체산업이 이러한 예이며, 이와 같은 기술집약적 산업의 기술융합이 매우 중요해짐에 따라, 관련 전략수립을 위한 다양한 방법이 시도되고 있다. 본 논문에서는 데이터 기반의 논문 특허 분석을 통해 반도체산업의 플라즈마 기술이슈의 기술융합 동향 및 특허 동향 분석과 이를 통한 특허 전략 수립 사례를 제시하고자 한다.

• Transactions of the Society of Information Storage Systems
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• v.7 no.2
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• pp.60-64
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• 2011

Chemical mechanical planarization is one of the core processes in fabrication of semiconductors, which are increasingly used for information storage devices like solid state drives. For higher data capacity in storage devices, CMP process is required to show ultimate precision and accuracy. In this work, 2-dimensional finite element models were developed to investigate the effects of the slurry particle impact on microscratch generation and the phenomena generated at pad-particle-wafer contact interface. The results revealed that no plastic deformation and corresponding material removal could be generated by simple impact of slurry particles under real CMP conditions. From the results of finite element simulations, it could be concluded that the pad-particle mixture formed in CMP process would be one of major factors leading to microscratch generation.

• Journal of the Korea Society for Simulation
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• v.9 no.3
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• pp.13-26
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• 2000

The scheduling rule for the fabrication process of the semiconductor manufacturing is suggested and tested on the simulation system which was developed based on the model to represent the main characteristics of wafer flows. The proper scheduling policies are necessary to meet the order change in the supply chain management. It was shown that the suggested rules which consider the wafer balance and the due date of the order, give good performances for the cycle time reduction and the rate of meeting due date as well. Also they are robust in the sense that performances are stable regardless of the order change rate and the input policies.

• Proceedings of the Korea Society for Simulation Conference
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• 1998.10a
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• pp.133-136
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• 1998

본 연구는 복잡하고 다양한 반도체 공저의 모델링을 통하여 반도체 공정 표준화 작업을 목적으로 하고 있다. 급변하는 세계 반도체 시장에서 국내 반도체 업체가 수위를 지킬 수 있는 방안은 공정의 표준화를 제시함으로써 생산업체에서의 신기술 개발에 따른 어려움을 해소하고 기술 개발과 더불어 생산관리 쪽으로의 이동에 대응할 수 있도록 하여 국제 경쟁력을 키워야 할 것이다. 본 연구의 기대효과로는 현장기술자와 장비운용자의 질적 향상을 위한 교육용 자료로의 활용이 가능하다는 것이다. Presentation Tool을 이용한 시청각 교육효과와 시뮬레이션을 이용한 Process Flow Wide View 증진은 현재 국내 반도체 업체들의 신입사원 교육 시 상당한 효과를 거둘 것이라 예상된다. 이는 생산업체에 국한되어지는 것만은 아니며 반도체 공정에 관련된 대학 학과목에서도 활용되어지리라 생각된다. 또한 Modeling & Simulation Tool을 사용하여 공정을 모델링함으로써 표준화를 만든 후 각 제조 업체들은 이러한 모델들은 이용하여 회사의 실정에 맞추어 자사에 대한 시뮬레이션을 손쉽게 수행함으로써 공정 최적화에 따른 경비 절감의 효과를 거둘 수 있을 것이다. 제품별 혹은 같은 제품이라도 Version이 다를 경우 FAB 공정가운데 약 10% 내외만이 바뀌는 점을 감안하면 본 연구를 통해 얻어지는 결과물인 Computer Model과 Simulator는 쉽게 생산현장에 적용할 수 있으리라 여겨진다.

• Ceramist
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• v.9 no.6
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• pp.7-11
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• 2006

The status of structural ceramics in Japan is presented. Use of ceramics for structural components had been limited due to their brittleness, and the successful application was wear resistant parts such as thread guides and ceramic cutting tools up to around 1980. Since then, considerable work has been done for applying ceramics to mechanical parts, and automotive components made of silicon nitride were developed and commercialized in 1980s. Unfortunately, the application of silicon nitride to automotive engines is not so popular in these days. Instead, a variety of structural ceramics such as alumina, silicon carbide and zirconia have recently extended the market, and the expanded application includes vacuum process parts for manufacturing semiconductor and liquid crystal devices, refractory tubes for casting aluminum alloy, and dies for optical lens forming. In addition, cordierite honeycombs and diesel particulate filters are widely used in automobiles. In the present review, the recent application of structural ceramics to automobiles and industries in Japan is summarized.

• Journal of Hydrogen and New Energy
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• v.25 no.1
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• pp.72-78
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• 2014

The study has been designed to develop water vapor supply for semiconductor industry, industrial gas manufacturing, impurities analysis, and fuel cell. Water concentration in air reached $1019{\mu}mol/mol$ at dew temp ($-20^{\circ}C$) and water concentration in CO2 reached $127{\mu}mol/mol$ at dew temp ($-40^{\circ}C$. Carbon dioxide needs more wet gas than air because interaction potential of carbon dioxide shows more strong attraction than air.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.225-226
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• 2007

In the semiconductor manufacturing industry, the heterodyne laser interferometer plays as an ultra-precise measurement system. However, the heterodyne laser interferometer has some unwanted environmental error which is caused from refraction in the air. This is an obstacle to improve the measurement accuracy in nanometer scale. In this paper we propose a compensation algorithm based on Data Fusion method which reduces the environmental error in the heterodyne laser interferometer. Through some experiments, we demonstrate the effectiveness of the proposed algorithm in measurement accuracy.