• Transactions on Electrical and Electronic Materials
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• v.14 no.5
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• pp.254-257
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• 2013

In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

• IE interfaces
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• v.20 no.3
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• pp.245-256
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• 2007

Toyota Production System (TPS) has been known a new production paradigm applicable to every type of manufacturing industry, not restricted to automobile assembly system. The basic framework of TPS has been studied and presented actively; many enterprises from all over the world including some of large domestic companies, have adopted and applied. This study analyzed the cases for TPS introduction and application process of LG Electronics and SAMSUNG Electronics, Semiconductor Division. On a different areas of business items, different strategic approaches are developed and implemented on a two comparable domestic companies. Key success factors for two companies are analysed, and some issues are also discussed.

• Journal of the KSME
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• v.33 no.2
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• pp.161-170
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• 1993

반도체 산업은 집적화와 제품의 원가절감 및 생산수율 향상에 상반되는 초청정 제어 기술의 한 계에 도전하고 있으며, 앞으로 이에 대한 기술축적이 없으면 반도체 산업의 발전은 이루어질수가 없을 만큼중요한 것이라고 사료된다. 초고집적회로의 본격적인 양산시대를 맞이하여, 오염제어 기술에서도 종래의 입자오염이외에, 유기물, 금속 및 가스상 오염물에 대한 복합적인 새로운 계측, 제어 기술이 개발되어져야 할 것이다. 그리고 공기청정화 환경기술뿐만 아니라, 온 . 습도, 기류, 정전기 및 진동제어 관한 극한기술도 예외가 될 수 없으며 큰 비중을 차지하게 될 것이다. 공조환경 제어기술에서 에너지 절감 및 운전비 절감에로의 연구와 함께 온 . 습도 제어 정도에 서도 보다 응답성 빠르고, 정밀도 높은 시스템 개발에 대한 연구가 병행되어야 할 것이다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.10
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• pp.1359-1367
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• 2000

In-situ particle monitors(ISPMs) are widely used for monitoring contaminant particles in vacuum-based semiconductor manufacturing equipment. In the present research, the performance of a Particle Measuring Systems(PMS) Vaculaz-2 ISPM at low pressures has been studied. We generated the uniform sized methylene blue particle beams using three identical aerodynamic lenses in the center of the vacuum line, and measured the detection efficiency of the ISPM. The effects of particle size, particle concentration, mass flow rate, system pressure, and arrangement of aerodynamic lenses on the detection efficiency of the ISPM were examined. Results show that the detection efficiency of the ISPM greatly depends on the mass flow rate, and the particle Stokes number. We also found that the optimum Stokes number ranges from 0.4 to 1.9 for the experimental conditions.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.39-39
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.29-38
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.49-55
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• 2000

The semiconductor industry relies on digital optical imaging for the overlay metrology of integrated circuit patterns. One critical performance demand in the particular application of digital imaging is placed on the edge resolution that is defined as the smallest detectable displacement of an edge from its image acquired in digital from. As the critical feature size of integrated circuit patterns reaches below 0.35 micrometers, the edge resolution is required to be less than 0.01 micrometers. This requirement is so stringent that fundamental behaviors of digital optical imaging need to be explored especially for the precision coordinate metrology. Our investigation reveals that the edge resolution shows quasi-random characteristics, not being simply deduced from relevant opto-electronic system parameters. Hence, a stochastic upper bound analysis is made to come up with the worst edge resolution that can statistically well predict actual indeterminate edge resolutions obtained with high magnification microscope objectives.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.3
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• pp.158-164
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• 2000

In recent year, desire and request fer micro automation are growing rapidly covering the whole range of the industry. This has been caused mainly by request of more accurate manufacturing process due to a higher density of integrated circuits in semiconductor industry. This paper presents a six d.o.f fine motion stage using magnetic levitation technique, which is one of actuating techniques that have the potential for achieving such a micro motion. There is no limit in motion resolution theoretically that the magnetically levitated part over a fixed stator can realize. In addition, it Is possible to manipulate the position and the force of the moving part at the same time. Then, the magnetic levitation technique is chosen into the actuating method. However, we discuss issues of design, kinematics, dynamics, and control of the proposed system. And a few experimental results fur step input are given.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.1028-1032
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• 1995

This paper describes the manufacture of spherical and aspherical surface on glass, superalloy and ceramic components. The rotationally symmetricallenses, and the ceramic or superalloy molds with spherical shapes are mainly generated by cutting processes on CNC lathe machine or 4,5 axis CNC machining centers. Recently, spherical shape parts require more precise and efficent machining technologies for wide material range such as optical lens of the lithography device in semiconductor manufacturing processes or the high precision mold machining of anti-chemical, anti-wear materials. In this paper, we introduce a newly developed infeed grinding machine with metal with metal bonded cup type wheel and its effects on spherical surface grinding.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.119.2-119.2
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• 2011

Dye-sensitized solar cells (DSSC) are currently attracting wide spread academic and commercial interest for the conversion of sunlight into electricity because of their easy manufacturing process and high efficiency. The solar energy conversion efficiencies of DSSC are strongly dependent on dye molecules adsorbed on the TiO2 surface which used for photosensitization of sun light, since an excited state of dye could inject an electron into the conduction band of semiconductor. We have developed novel organic dyes which have phenothiazine moieties as an electron donor in their charge-transfer chromophore for application of DSSCs. We had synthesized a series of phenothiazine derivatives which have different wave length absorbing chromophore in the molecule with high molar extinction coefficient. The photovoltaic performance of DSSC composed of organic chromophores with broad wavelength absorption property were measured and evaluated by comparison with that of pristine ruthenium dye.