• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.36D no.5
• /
• pp.44-53
• /
• 1999

This paper are reported a methodology and application for extracting parasitic capacitances in a multi-level interconnect semiconductor structure by a numerical technique. To calculate the parasitic capacitances between the interconnect lines, we employed finite element method (FEM) and calculated the distrubution of electric potential in the inter-metal layer dielecric(ILD) by solving the Laplace equation. The three-dimensional multi-level interconnect structure is generated directly from two-dimensional mask layout data by specifying process sequences and dimension. An exemplary structure comprising two metal lines with a dimension of 8.0$\times$8.0$\times$5.0$\mu\textrm{m}^3/TEX>, which is embedded in three dielectric layer, was simulated to extract the parasitic capacitances. In this calculation, 1960 nodes with 8892 tetrahedra were used in ULTRA SPARC 1 workstation. The total CPU time for the simulation was 28 seconds, while the memory size of 4.4MB was required.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.46 no.10
• /
• pp.79-85
• /
• 2009

The design of a 3.2 Gb/s serial link receiver in $0.18{\mu}m$ CMOS process is presented. The major factors limiting the performance of high-speed links are transmission channel bandwidth, timing uncertainty. The design uses a multi-level signaling(4-PAM) to overcome these problems. Moreover, to increase data bit-rate and lower BER, we designed this circuit by using a current mode amplifier, Current-mode Logic(CML) sampling latches. The 4-PAM receiver achieves 3.2 Gb/s and BER is less than $1.0\;{\times}\;10^{-12}$. The $0.5\;{\times}\;0.6\;mm^2$ chip consumes 49 mA at 3.2 Gb/s from a 1.8-V supply.

• Korean Membrane Journal
• /
• v.8 no.1
• /
• pp.1-12
• /
• 2006

In semiconductor industries, dissolved oxygen is one of the most undesirable contaminants of ultrapure water. A method for dissolved oxygen removal (DOR) consists in the use of polymeric hollow fibres, loaded with a catalyst and fed with a reducing agent such as hydrogen. In this work, PVDF hollow fibres loaded with Pd were characterized by means of perporometry, scanning electron microscopy (SEM), energy dispersive X-ray (EDX). The hollow fibre analyzed shows a five-layer structure with remarkable morphological differences. An estimation of pore diameters and their distribution was performed giving a mean pore diameter of 100 nm. The permeance and selectivity of the fibres were measured using $H_2,\;N_2,\;O_2$ as single gases, at different operating conditions. An $H_2$ permeance of $37 mmol/m^2s$ was measured and $H_2/O_2$ and $H_2/N_2$ selectivities of ca. 3 were obtained. $H_2$ permeance was 1/3 when a water stream flows in the shell side. Catalytic fibrebehaviour was simulated using a mathematical model for a loop membrane reactor, considering only $O_2$ and $H_2$ diffusive transport inside the membrane and their catalytic reaction. Dimensionless parameters such as the Thiele modulus are employed to describe the system behaviour. The model agrees well with the experimental reaction data.

• Journal of Biomedical Engineering Research
• /
• v.16 no.4
• /
• pp.555-561
• /
• 1995

In this paper, the O-Ring Measurement System (O-R MS) has been designed to supplement such subectivity and apply to the diagnosis by constitution. A single chip microprocessor of Intel MCS-51 family has been used to control the O-R MS and process data with real time, and the O-R MS could measure the minute muscular strength, expanded width between fingers, and time of the measurement. Therefore the objective constitutional diagnosis is possible by the O-R MS. As a clinical testing for estimating credibility of O-R MS, the acupuncture points representing the constitution has been stimulated using a semiconductor laser stimulator and measure the muscular strength by the O-R MS. The result of clinical testing has been shown that the constitutional diagnosis with the O-R MS is proved highly precision of 96% and it is expected that the O-R MS can be used practically for the objective constitutional diagnosis.

• Journal of Information Processing Systems
• /
• v.8 no.2
• /
• pp.347-358
• /
• 2012

Recently, security researches have been processed on the method to cover a broader range of hacking attacks at the low level in the perspective of hardware. This system security applies not only to individuals' computer systems but also to cloud environments. "Cloud" concerns operations on the web. Therefore it is exposed to a lot of risks and the security of its spaces where data is stored is vulnerable. Accordingly, in order to reduce threat factors to security, the TCG proposed a highly reliable platform based on a semiconductor-chip, the TPM. However, there have been no technologies up to date that enables a real-time visual monitoring of the security status of a PC that is operated based on the TPM. And the TPB has provided the function in a visual method to monitor system status and resources only for the system behavior of a single host. Therefore, this paper will propose a m-TMS (Mobile Trusted Monitoring System) that monitors the trusted state of a computing environment in which a TPM chip-based TPB is mounted and the current status of its system resources in a mobile device environment resulting from the development of network service technology. The m-TMS is provided to users so that system resources of CPU, RAM, and process, which are the monitoring objects in a computer system, may be monitored. Moreover, converting and detouring single entities like a PC or target addresses, which are attack pattern methods that pose a threat to the computer system security, are combined. The branch instruction trace function is monitored using a BiT Profiling tool through which processes attacked or those suspected of being attacked may be traced, thereby enabling users to actively respond.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.362-365
• /
• 2005

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond retention. Strong cohesion between diamond grits and metal matrix prevents macro scratch on the wafer. If diamond retention is weak, the diamond will be pulled out of metal matrix. The pulled diamond grits are causative of macro scratch on wafer during CMP process. Firstly, some results will be reported of cohesion between diamond grits and metal matrix on the diamond tools prepared by three different manufacturing methods. A measuring instrument with sharp cemented carbide connected with a push-pull gauge was manufactured to measure the cohesion between diamond grits and metal matrix. The retention force of brazed diamond tool was stronger than the others. The retention force was also increased in proportion to the contact area of diamond grits and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of chrome in metal matrix and carbon which enhance the interfacial cohesion strength between diamond grits and metal matrix. Secondly, we measured real-time data of the coefficient of friction and the pad wear rate by using CMP tester (CETR, CP-4). CMP pad conditioner samples were manufactured by brazed, electro-plated and sintered methods. The coefficient of friction and the pad wear rate were shown differently according to the arranged diamond patterns. Consequently, the coefficient of friction is increased according as the space between diamonds is increased or the concentration of diamonds is decreased. The pad wear rate is increased according as the degree of diamond protrusion is increased.

• The Journal of Society for e-Business Studies
• /
• v.24 no.3
• /
• pp.99-110
• /
• 2019

As the 4th industrial revolution progressing, manufacturers are trying to apply intelligent information technologies such as IoT(internet of things) and machine learning. In the semiconductor/LCD/tire manufacturing process, schedule plan that minimizes setup change and due date violation is very important in order to ensure efficient production. Therefore, in this paper, we suggest the deep learning based scheduling generation model minimizes setup change and due date violation in parallel machines. The proposed model learns patterns of minimizing setup change and due date violation depending on considered order using the amount of historical data. Therefore, the experiment results using three dataset depending on levels of the order list, the proposed model outperforms compared to priority rules.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.24 no.8
• /
• pp.1030-1036
• /
• 2020

The DSRC method currently in use has a limitation in providing various ITS services by short-distance wireless communication. Therefore, the WAVE/DSRC hybrid wireless platform, which was developed by applying WAVE technology in-house, improved the data transmission speed and greatly expanded the transmission range. The summary H/W and S/W technologies are summarized in the text. In this paper, various services such as BSM, SPAT, MAP, and road video information related to ITS services have been implemented, and various tests are conducted based on scenarios considering the environment in the actual field by utilizing the previously developed WAVE/DSRC composite wireless platform. Through this emulation process in the real field, we were able to verify the excellence of the WAVE/DSRC composite wireless platform once again and predict the usefulness and potential of development services in real field operations.

• Journal of Adhesion and Interface
• /
• v.24 no.3
• /
• pp.86-94
• /
• 2023

To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm² and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.

• Journal of the Korean earth science society
• /
• v.34 no.6
• /
• pp.588-601
• /
• 2013

In geophysics and geophysical exploration fields, we can use information about inclination and azimuth in various ways. These include borehole deviation logging for inversion process, real-time data acquisition system, geophysical monitoring system, and so on. This type of information is also necessarily used in the directional drilling of shale gas fields. We thus need to develop a subminiature, low-powered, multi-functional inclination and azimuth measurement system for geophysical exploration fields. In this paper, to develop real-time measurement system, we adopt the high performance low power Micro Control Unit (made with state-of-the-art Complementary Metal Oxide Semiconductor technology) and newly released Micro Electro Mechanical Systems Attitude Heading Reference System sensors. We present test results on the development of a multifunctional real-time inclination and azimuth measurement system. The developed system has an ultra-slim body so as to be installed in 42mm sonde. Also, this system allows us to acquire data in real-time and to easily expand its application by synchronizing with a depth encoder or Differential Global Positioning System.