• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.75-80
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• 2013

According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.

• Earthquakes and Structures
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• v.11 no.6
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• pp.1077-1099
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• 2016

One of the main shortcomings in the current passive base isolation system is lack of adaptability. The recent research and development of a novel adaptive seismic isolator based on magnetorheological elastomer (MRE) material has created an opportunity to add adaptability to base isolation systems for civil structures. The new MRE based base isolator is able to significantly alter its shear modulus or lateral stiffness with the applied magnetic field or electric current, which makes it a competitive candidate to develop an adaptive base isolation system. This paper aims at exploring suitable control algorithms for such adaptive base isolation system by developing a close-loop semi-active control system for a building structure equipped with MRE base isolators. The MRE base isolator is simulated by a numerical model derived from experimental characterization based on the Bouc-Wen Model, which is able to describe the force-displacement response of the device accurately. The parameters of Bouc-Wen Model such as the stiffness and the damping coefficients are described as functions of the applied current. The state-space model is built by analyzing the dynamic property of the structure embedded with MRE base isolators. A Lyapunov-based controller is designed to adaptively vary the current applied to MRE base isolator to suppress the quake-induced vibrations. The proposed control method is applied to a widely used benchmark base-isolated structure by numerical simulation. The performance of the adaptive base isolation system was evaluated through comparison with optimal passive base isolation system and a passive base isolation system with optimized base shear. It is concluded that the adaptive base isolation system with proposed Lyapunov-based semi-active control surpasses the performance of other two passive systems in protecting the civil structures under seismic events.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.288-291
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• 2016

Recently, there has been a lot of researches related to two-dimensional (2D) materials due to their new properties and applications emerging upon 2D confinement. A new type of graphene like two-dimensional layer material, nitrogenated holey two-dimensional structure C2N-h2D, that is possession of evenly distributed holes and nitrogen atoms with proper bandgap has been synthesized. Previous calculation studies already have shown that the variance of the orbital interaction, band structure of few-layer C2N-h2D suggests that interlayer coupling does play an important role in its electronic properties. In this point, using first-principles density functional theory calculation, we here explore the effect of porous embedded iron atom and iron substrate on encapsulated few layer C2N-h2D. We show the atomic structures and the corresponding electronic structures of Fe@C2N to elucidate the effect of iron. Finally, this study demonstrates that embedded iron C2N has AA-stacking as most favorable stacked structure in contrast to pure C2N. In addition, iron substrate modifies its encapsulated C2N from semi-metallic states to metallic state.

• Smart Structures and Systems
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• v.17 no.1
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• pp.31-43
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• 2016

Applications of ultrasonic tomography to concrete structures have been reported for many years. However, practical and effective application of this tool for nondestructive assessment of internal concrete condition is hampered by time consuming transducer coupling that limits the amount of ultrasonic data that can be collected. This research aims to deploy recent developments in air-coupled ultrasonic measurements of solids, described in Part 1 of this paper set, to concrete in order to image internal inclusions. Ultrasonic signals are collected from concrete samples using a fully air-coupled (contactless) test configuration. These air coupled data are compared to those collected using partial semi-contact and full-contact test configurations. Two samples are considered: a 150 mm diameter cylinder with an internal circular void and a prism with $300mm{\times}300mm$ square cross-section that contains internal damaged regions and embedded reinforcement. The heterogeneous nature of concrete material structure complicates the application and interpretation of ultrasonic measurements and imaging. Volumetric inclusions within the concrete specimens are identified in the constructed velocity tomograms, but wave scattering at internal interfaces of the concrete disrupts the images. This disruption reduces defect detection accuracy as compared with tomograms built up of data collected from homogeneous solid samples (PVC) that are described in Part 1 of this paper set. Semi-contact measurements provide some improvement in accuracy through higher signal-to-noise ratio while still allowing for reasonably rapid data collection.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.192-199
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• 2001

Chemical mechanical planarization (CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There hale been serious problems in CMP in terms of repeatability and deflects in patterned wafers. Especial1y, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasives and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using CeO$_2$is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method fur developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Journal of the Korean Mathematical Society
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• v.57 no.5
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• pp.1167-1186
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• 2020

This paper considers the case of pricing discretely-sampled variance swaps under the class of equity-interest rate hybridization. Our modeling framework consists of the equity which follows the dynamics of the Heston stochastic volatility model, and the stochastic interest rate is driven by the Cox-Ingersoll-Ross (CIR) process with full correlation structure imposed among the state variables. This full correlation structure possesses the limitation to have fully analytical pricing formula for hybrid models of variance swaps, due to the non-affinity property embedded in the model itself. We address this issue by obtaining an efficient semi-closed form pricing formula of variance swaps for an approximation of the hybrid model via the derivation of characteristic functions. Subsequently, we implement numerical experiments to evaluate the accuracy of our pricing formula. Our findings confirm that the impact of the correlation between the underlying and the interest rate is significant for pricing discretely-sampled variance swaps.

• The Journal of Information Systems
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• v.14 no.3
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• pp.37-47
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• 2005

Mining of association rules is to find associations among data items that appear together in some transactions or business activities. As of today, algorithms for association rule mining, as well as for other data mining tasks, are mostly applied to relational databases. As XML being adopted as the universal format for data storage and exchange, mining associations from XML data becomes an area of attention for researchers and developers. The challenge is that the semi-structured data format in XML is not directly suitable for traditional data mining algorithms and tools. In this paper we present an encoding method to encode XML tree-nodes. This method is used to store the XML data in Value Table and Transaction Table that can be easily accessed via indexing. The hierarchical relationship in the original XML tree structure is embedded in the encoding. We applied this method to association rules mining of XML data that may have missing data.

• Geomechanics and Engineering
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• v.5 no.5
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• pp.379-399
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• 2013

In practice, analysis of laterally loaded piles is carried out using beams on non-linear Winkler springs model (often known as p-y method) due to its simplicity, low computational cost and the ability to model layered soils. In this approach, soil-pile interaction along the depth is characterized by a set of discrete non-linear springs represented by p-y curves where p is the pressure on the soil that causes a relative deformation of y. p-y curves are usually constructed based on semi-empirical correlations. In order to construct API/DNV proposed p-y curve for clay, one needs two values from the monotonic stress-strain test results i.e., undrained strength ($s_u$) and the strain at 50% yield stress (${\varepsilon}_{50}$). This approach may ignore various features for a particular soil which may lead to un-conservative or over-conservative design as not all the data points in the stress-strain relation are used. However, with the increasing ability to simulate soil-structure interaction problems using highly developed computers, the trend has shifted towards a more theoretically sound basis. In this paper, principles of Mobilized Strength Design (MSD) concept is used to construct a continuous p-y curves from experimentally obtained stress-strain relationship of the soil. In the method, the stress-strain graph is scaled by two coefficient $N_C$ (for stress) and $M_C$ (for strain) to obtain the p-y curves. $M_C$ and $N_C$ are derived based on Semi-Analytical Finite Element approach exploiting the axial symmetry where a pile is modelled as a series of embedded discs. An example is considered to show the application of the methodology.

• Geomechanics and Engineering
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• v.31 no.5
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• pp.477-488
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• 2022

Pile composite foundation (PCF) has been commonly applied in practice. Existing research has focused primarily on semi-infinite media having equal pile lengths with little attention given to the effects of inclined bedrock and dissimilar pile lengths. This investigation considers the effects of inclined bedrock on vertical loaded PCF with dissimilar pile lengths. The pile-soil system is decomposed into fictitious piles and extended soil. The Fredholm integral equation about the axial force along fictitious piles is then established based on the compatibility of axial strain between fictitious piles and extended soil. Then, an iterative procedure is induced to calculate the PCF characteristics with a rigid cap. The results agree well with two field load tests of a single pile and numerical simulation case. The settlement and load transfer behaviors of dissimilar 3-pile PCFs and the effects of inclined bedrock are analyzed, which shows that the embedded depth of the inclined bedrock significantly affects the pile-soil load sharing ratios, non-dimensional vertical stiffness N₀/wdE_s, and differential settlement for different length-diameter ratios of the pile l/d and pile-soil stiffness ratio k conditions. The differential settlement and pile-soil load sharing ratios are also influenced by the inclined angle of the bedrock for different k and l/d. The developed model helps better understand the PCF characteristics over inclined bedrock under vertical loading.