• Title/Summary/Keyword: Self etching

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Employing of Metal Negative Ion in Halogen Plasmas (염소저온플라스마에서 금속음이온의 이용)

  • Choi, Young-Il;Lee, Bong-Ju;Lee, Kyung-Sub
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.05a
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    • pp.35-37
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    • 2001
  • The Al etching was studied employing negative ions generated in the downstream $Cl_2$ plasma. In order to etch the Al film practically on an insulator covered electrode coupled with RF power, reduction of the negative self bias voltage (Vdc) was examined using a magnetic filter which trapped electrons. Addition of $SF_6$ and $H_2$ to a $Cl_2/BCl_3$ mixture reduced significantly Vdc.

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The influence of moisture control on bond strength of self-etching primer

  • Jin, Myoung-Uk;Park, Jeong-Won;Kim, Sung-Kyo
    • Proceedings of the KACD Conference
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    • 2001.11a
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    • pp.587.2-587
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    • 2001
  • The purpose of this study is to evaluate influence of moisture control on bond strength of self-etching primer by measuring enamel and dentin shear bond strengths. 96 extracted human molars were divided into 8 groups. Group 1 (Enamel 30min Dry), Group 2 (E. 5s air dry), Group 3 (E. 1s air dry), Group 4 (E. blot dry), Group 5 (Dentin 30min Dry), Group 6 (D. 5s air dry), Group 7 (D. 1s air dry), Group 8 (D. blot dry) were divided.(omitted)

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Reactive Ion Etching Characteristics of Aluminum Oxide Films Prepared by PECVD in $CCl_4$ Dry Etch Plasma (플라즈마 화학증착한 알루미늄 산화박막의 $CCl_4$ 플라즈마에서의 반응성 이온식각 특성)

  • 김재환;김형석;이원종
    • Journal of the Korean Ceramic Society
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    • v.31 no.5
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    • pp.485-490
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    • 1994
  • The reactive ion etching characteristics of aluminum oxide films, prepared by PECVD, were investigated in the CCl4 plasma. The atomic chlorine concentration and the DC self bias were determined at various etching conditions, and their effects on the etch rate of aluminum oxide film were studied. The bombarding energy of incident particles was found to play the more important role in determining the etch rate of aluminum oxide rather than the atomic chlorine concentration. It is considered to be because the bombardment of ions or neutral atoms breaks the strong Al-O bonds of aluminum oxide to help activate the formation reaction of AlCl3 which is the volatile etch product.

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The effects of total-etch, wet-bonding, and light-curing of adhesive on the apical seal of a resin-based root canal filling system (접착제의 접착변수가 레진계 근관충전제의 근단밀폐효과에 미치는 영향)

  • Ryu, Won-Il;Shon, Won-Jun;Baek, Seung-Ho;Lee, In-Han;Cho, Byeong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.36 no.5
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    • pp.385-396
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    • 2011
  • Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

Contact block copolymer technique을 이용한 실리콘 나노-필라 구조체 제작방법

  • Kim, Du-San;Kim, Hwa-Seong;Park, Jin-U;Yun, Deok-Hyeon;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.189-189
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    • 2015
  • Plasmonics, sensor, field effect transistors, solar cells 등 다양한 적용분야를 가지는 실리콘 구조체는 제작공정에 의해 전기적 및 광학적 특성이 달라지기 때문에 적합한 나노구조 제작방법이 요구되고 있다. 나노구조체 제작방법으로는 Photo lithography, Extreme ultraviolet lithography (EUV), Nano imprinting lithography (NIL), Block copolymer (BCP) 방식의 방법들이 연구되고 있으며, 특히 BCP는 direct self-assembly 특성을 가지고 있으며 가격적인 면에서도 큰 장점을 가진다. 하지만 BCP를 mask로 사용하여 식각공정을 진행할 경우 BCP가 버티지 못하고 변형되어 mask로서의 역할을 하지 못한다. 이러한 문제를 해결하기 위하여 본 논문에서는 BCP와 질화막을 이용한 double mask 방법을 사용하였다. 기판 위에 BCP를 self-assembly 시키고 mask로 사용하여 hole 부분으로 노출된 기판을 Ion gun을 통해 질화 시킨 후에 BCP를 제거한다. 기판 위에 hole 모양의 질화막 표면은 BCP와 다르게 etching 공정 중 변형되지 않는다. 이러한 질화막 표면을 mask로 사용하여 pillar pattern의 실리콘 나노구조체를 제작하였다. 질화막 mask로 사용되는 template은 PS와 PMMA로 구성된 BCP를 사용하였다. 140kg/mol의 polystyrene과 65kg/mol의 PMMA를 톨루엔으로 용해시키고 실리콘 표면 위에 spin coating으로 도포하였다. Spin coat 후 230도에서 40시간 동안 열처리를 진행하여 40nm의 직경을 가진 PS-b-PMMA self-assembled hole morphology를 형성하였다. 질화막 형성 및 etching을 위한 장비로 low-energy Ion beam system을 사용하였다. Reactive Ion beam은 ICP와 3-grid system으로 구성된 Ion gun으로부터 형성된다. Ion gun에 13.56 MHz의 frequency를 갖는 200W 전력을 인가하였다. Plasma로부터 나오는 Ion은 $2{\Phi}$의 직경의 hole을 가지는 3-grid hole로 추출된다. 10~70 voltage 범위의 전위를 plasma source 바로 아래의 1st gird에 인가하고, 플럭스 조절을 위해 -150V의 전위를 2nd grid에 인가한다. 그리고 3rd grid는 접지를 시켰다. chamber내의 질화 및 식각가스 공급은 2mTorr로 유지시켰다. 그리고 기판의 온도는 냉각칠러를 이용하여 -20도로 냉각을 진행하였다. 이와 같은 공정 결과로 100 nm 이상의 높이를 갖는 40 nm직경의 균일한 Silicon pillar pattern을 형성 할 수 있었다.

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Real-Time Spacer Etch-End Point Detection (SE-EPD) for Self-aligned Double Patterning (SADP) Process

  • Han, Ah-Reum;Lee, Ho-Jae;Lee, Jun-Yong;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.436-437
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    • 2012
  • Double patterning technology (DPT) has been suggested as a promising candidates of the next generation lithography technology in FLASH and DRAM manufacturing in sub-40nm technology node. DPT enables to overcome the physical limitation of optical lithography, and it is expected to be continued as long as e-beam lithography takes place in manufacturing. Several different processes for DPT are currently available in practice, and they are litho-litho-etch (LLE), litho-etch-litho-etch (LELE), litho-freeze-litho-etch (LFLE), and self-aligned double patterning (SADP) [1]. The self-aligned approach is regarded as more suitable for mass production, but it requires precise control of sidewall space etch profile for the exact definition of hard mask layer. In this paper, we propose etch end point detection (EPD) in spacer etching to precisely control sidewall profile in SADP. Conventional etch EPD notify the end point after or on-set of a layer being etched is removed, but the EPD in spacer etch should land-off exactly after surface removal while the spacer is still remained. Precise control of real-time in-situ EPD may help to control the size of spacer to realize desired pattern geometry. To demonstrate the capability of spacer-etch EPD, we fabricated metal line structure on silicon dioxide layer and spacer deposition layer with silicon nitride. While blanket etch of the spacer layer takes place in inductively coupled plasma-reactive ion etching (ICP-RIE), in-situ monitoring of plasma chemistry is performed using optical emission spectroscopy (OES), and the acquired data is stored in a local computer. Through offline analysis of the acquired OES data with respect to etch gas and by-product chemistry, a representative EPD time traces signal is derived. We found that the SE-EPD is useful for precise control of spacer etching in DPT, and we are continuously developing real-time SE-EPD methodology employing cumulative sum (CUSUM) control chart [2].

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SHEAR BOND STRENGTH OF SELF-ETCHING ADHESIVES TO DENTIN AND SEM ANALYSIS (상아질에 대한 자가 산부식 접착제의 전단결합강도와 SEM 분석 비교)

  • Cho, Young-Gon;Roh, Kee-Sun;Kim, Soo-Mee;Lee, Young-Gon;Jeong, Jin-Ho;Ki, Young-Jae
    • Restorative Dentistry and Endodontics
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    • v.28 no.3
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    • pp.222-231
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    • 2003
  • The purpose of this study was to compare shear bond strength and interfacial pattern of composite bond-ed to dentin using self-etching adhesive systems. Sixty extracted human molars with exposed occlusal dentin were divided into four groups and bonded with four adhesives and composites. Single Bond/Filtek Z 350(SB), Tyrian SPE-One-Step Plus/Aelitefil(TY), Prompt L-Pop/Filtek Z 250(LP), and One-Up Bond F/palfique Toughwell(OU). The results of this study were as follows; 1 Shear bond strength for OU was significantly lower than that of other groups(p<0.05). No significant difference was founded among SB, TY, and LP. 2. Failure modes to dentin showed adhesive and mixed for SB TY and LP, but them for OU showed adhesive in all spceimens. 3. Dentin-resin interface showed close adaptation for SB, TY, and LP, but it showed gap for OU. 4. The hybrid layers for TY, LP OU were thinner than that of SB. Adhesive layers were observed between composite and hybrid layer, which were 5 $\mu\textrm{m}$ thick for TY and 10 $\mu\textrm{m}$ thick for OU.

THE EFFECT OF HYBRID LAYER THICKNESS ON MICROTENSILE BOND STRENGTH OF THREE-STEP AND SELF-ETCHING DENTIN ADHESIVE SYSTEMS (혼성층의 두께가 three-step과 self-etching 상아질 접착제의 미세인장결합강도에 미치는 효과)

  • Lee, Hye-Jung;Park, Jeong-Kil;Hur, Bock
    • Restorative Dentistry and Endodontics
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    • v.28 no.6
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    • pp.491-497
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    • 2003
  • The purpose of this study was to evaluate the correlation between hybrid layer thickness and bond strength using confocal laser scanning microscope and microtensile bond strength test of two adhesive systems. The dentin surface of human molars. sectioned to remove the enamel from the occlusal surface. Either Scotchbond Multi-Purpose(3M Dental Product, St. Paul, MN, U.S.A) or Clearfil SE Bond (Kuraray, Osaka, Japan) was bonded to the surface. and covered with resin-composite. The resin-bonded teeth were serially sliced perpendicular to the adhesive interface to measure the hybrid layer thickness by confocal laser scanning microscope. The specimen were trimmed to give a bonded cross-sectional surface area of $1\textrm{mm}^2$, then the micro-tensile bone test was performed at a cross head speed of 1.0 mm/min. All fractured surfaces were also observed by stereomicroscope. There was no significant differences in bond strengths the materials(p>0.05). However. the hybrid layers of three-step dentin adhesive system, SM, had significantly thicker than self-etching adhesive system. CS(p<0.05). Pearson's correlation coefficient showed no correlation between hybrid layer thickness and bond strengths(p>0.05). Bond strengths of dentin adhesive systems were not dependent on the thickness of hybrid layer.

Effects of dentin surface preparations on bonding of self-etching adhesives under simulated pulpal pressure

  • Chantima Siriporananon;Pisol Senawongse;Vanthana Sattabanasuk;Natchalee Srimaneekarn;Hidehiko Sano;Pipop Saikaew
    • Restorative Dentistry and Endodontics
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    • v.47 no.1
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    • pp.4.1-4.13
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    • 2022
  • Objectives: This study evaluated the effects of different smear layer preparations on the dentin permeability and microtensile bond strength (µTBS) of 2 self-etching adhesives (Clearfil SE Bond [CSE] and Clearfil Tri-S Bond Universal [CTS]) under dynamic pulpal pressure. Materials and Methods: Human third molars were cut into crown segments. The dentin surfaces were prepared using 4 armamentaria: 600-grit SiC paper, coarse diamond burs, superfine diamond burs, and carbide burs. The pulp chamber of each crown segment was connected to a dynamic intra-pulpal pressure simulation apparatus, and the permeability test was done under a pressure of 15 cmH2O. The relative permeability (%P) was evaluated on the smear layer-covered and bonded dentin surfaces. The teeth were bonded to either of the adhesives under pulpal pressure simulation, and cut into sticks after 24 hours water storage for the µTBS test. The resin-dentin interface and nanoleakage observations were performed using a scanning electron microscope. Statistical comparisons were done using analysis of variance and post hoc tests. Results: Only the method of surface preparation had a significant effect on permeability (p < 0.05). The smear layers created by the carbide and superfine diamond burs yielded the lowest permeability. CSE demonstrated a higher µTBS, with these values in the superfine diamond and carbide bur groups being the highest. Microscopic evaluation of the resin-dentin interface revealed nanoleakage in the coarse diamond bur and SiC paper groups for both adhesives. Conclusions: Superfine diamond and carbide burs can be recommended for dentin preparation with the use of 2-step CSE.