• Journal of the Korean Vacuum Society
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• v.22 no.2
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• pp.105-110
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• 2013

Single crystalline $In_xGa_{1-x}As$ nanowires are grown on Si (111) substrate via Vapor-Liquid-Solid growth mode using metal-organic chemical vapor deposition. The ternary nanowires have been grown with various growth conditions and examined by electron microscopy. The alloy compositions of the nanowires has been investigated using Energy-dispersive X-ray spectroscopy. We have found that the composition gradient of the nanowire becomes larger with growth temperature and V/III ratio.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.85-89
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• 2022

We reported on annealing effect on Ga₂O₃/Al₂O₃/SiC devices grown by radio frequency sputtering method. Post-deposition annealing at 900 ℃ was performed, which results in crystallization in the Ga₂O₃ films. The major peaks (-401) and (403) of Ga₂O₃ which was thermally treated at 900 ℃ appears in the x-ray diffraction (XRD) results. Auger electron spectroscopy (AES) shows that Ga and Al atoms seems to be diffused into the opposite direction Al₂O₃ and Ga₂O₃ after annealing. Transfer and output characteristics of back-gate transistor were analyzed where SiC substrate is used as gate material. On-state current and on/off ratio increased almost 10⁹ and 10⁶ times higher in the 900 ℃ annealed sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1092-1095
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• 2004

The $ZnGa_2O_4$ phosphor target is synthesized through solid-state reactions as calcine and sintering temperature in order to deposit $ZnGa_2O_4$ phosphor thin film by rf magnetron sputtering system. The $ZnGa_2O_4$ phosphor thin film is deposited on $Pt/Ti/SiO_2/Si$ substrate and prepared $ZnGa_2O_4$ Phosphor thin film is annealed by rapid thermal processor(RTP) at $750^{\circ}C$, 10 sec. The x-ray diffraction patterns of $ZnGa_2O_4$ phosphor target and thin film show the position of (311) main peak. The cathodolumincsccnce(CL) succtrums of $ZnGa_2O_4$ phosphor target show main peak of 360nm and broad bandwidth of about 180nm.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.11
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• pp.12-17
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• 1999

In this paper, we proposed a novel CB-CPW(Conductor Backed CPW) for suppression of crosstalk caused by PPL(Parallel Plate Line) mode in the millimeter wave frequency. The proposed structure is formed by the GaAs main substrate attached on the Si lossy layer. The PPL mode can be suppressed by the Si lossy layer of conductivity ${\sigma}$, and it reduces the crostalk between the nearby transmission lines. Using 200 um thick Si substrate of ${\sigma}$ = 30S/m, as the lossy layer, the crosstalk can be suppressed below - 40 dB at 60 GHz. The proposed method is costly effective because inexpensive Si wafer is employed to suppress the PPL mode, and it can be used in the various types of millimeter wave applications.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.144-148
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• 2011

$Ga_2O_3$ doped $SnO_2$ thin films were grown by using pulsed laser deposition (PLD) technique on glass substrate. The optical and electrical properties of these films were investigated for different doping concentrations, oxygen partial pressures, substrate temperatures, and film thickness. The films were deposited at different substrate temperatures (room temperature to $600^{\circ}C$). The best opto-electrical properties is shown by the film deposited at substrate temperature of $300^{\circ}C$ with oxygen partial pressure of 80 m Torr and the gallium concentration of 2 wt%. The as obtained lowest resistivity is $9.57{\times}10^{-3}\;{\Omega}cm$ with the average transmission of 80% in the visible region and an optical band gap (indirect allowed) of 4.26 eV.

• Journal of the Korean Magnetics Society
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• v.19 no.4
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• pp.126-132
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• 2009

We have studied physical properties of MnAs thin films grown by Molecular-Beam Epitaxy as well as their post-growth annealing effects. The samples grown at $600^{\circ}C$ show the preferred crystal orientation of type-B independent of substrate whereas type-A is observed for the samples grown at below $200^{\circ}C$. The sample grown at $600^{\circ}C$ on GaAs(001) substrate is magnetized to only one direction even on the easy axis of magnetization. The magnetic properties are vastly enhanced after post-growth annealing for both MnAs/Si(001) sample with no ferromagnetism and ferromagnetic MnAs/GaAs(001) grown at $200^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.220-220
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• 2013

Surface-normal transmission electro-absorption modulator (EAM) are attractive for high-definition (HD) three-dimensional (3D) imaging application due to its features such as small system volume and simple epitaxial structure [1,2]. However, EAM in order to be used for HD 3D imaging system requires uniform modulation performance over large area. To achieve highly uniform modulation performance of EAM at the operating wavelength of 850 nm, it is extremely important to remove the GaAs substrate over large area since GaAs material has high absorption coefficient below 870 nm which corresponds to band-edge energy of GaAs (1.424 eV). In this study, we propose and experimentally demonstrate a transmission EAM in which highly selective backside etching methods which include lapping, dry etching and wet etching is carried out to remove the GaAs substrate for achieving highly uniform modulation performance. First, lapping process on GaAs substrate was carried out for different lapping speeds (5 rpm, 7 rpm, 10 rpm) and the thickness was measured over different areas of surface. For a lapping speed of 5 rpm, a highly uniform surface over a large area ($2{\times}1\;mm^2$) was obtained. Second, optimization of inductive coupled plasma-reactive ion etching (ICP-RIE) was carried out to achieve anisotropy and high etch rate. The dry etching carried out using a gas mixture of SiCl4 and Ar, each having a flow rate of 10 sccm and 40 sccm, respectively with an RF power of 50 W, ICP power of 400 W and chamber pressure of 2 mTorr was the optimum etching condition. Last, the rest of GaAs substrate was successfully removed by highly selective backside wet etching with pH adjusted solution of citric acid and hydrogen peroxide. Citric acid/hydrogen peroxide etching solution having a volume ratio of 5:1 was the best etching condition which provides not only high selectivity of 235:1 between GaAs and AlAs but also good etching profile [3]. The fabricated transmission EAM array have an amplitude modulation of more than 50% at the bias voltage of -9 V and maintains high uniformity of >90% over large area ($2{\times}1\;mm^2$). These results show that the fabricated transmission EAM with substrate removed is an excellent candidate to be used as an optical shutter for HD 3D imaging application.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.4
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• pp.80-85
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• 2007

The passivation is one of the important technologies for protection of the devies from damage. In this paper, we fabricated $0.1{\mu}m\;{\Gamma}$--gate InAIAs/InGaAs metamorphic high electron mobility transistors (MHEMTs) on a GaAs substrate. And then the wafer with MHEMTs was divided into two pieces; one for passivation and another for without passivation experiments. The passivations were done by using both low-k BCB and Si3N4 thin films. DC and RF performances were measured and the results are compared. The MHEMTs with BCB passivation show lower degradation than ones with Si3N4 passivation.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.32-35
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• 2013

In this paper, a manufacturing process was developed for fabricating high-quality AlGaN/GaN high electron mobility transistors (HEMTs) on silicon carbide (SiC) substrates. Various conditions and processing methods regarding the ohmic contact and pre-metal-deposition $BCl_3$ etching processes were evaluated in terms of the device performance. In order to obtain a good ohmic contact performance, we tested a Ti/Al/Ta/Au ohmic contact metallization scheme under different rapid thermal annealing (RTA) temperature and time. A $BCl_3$-based reactive-ion etching (RIE) method was performed before the ohmic metallization, since this approach was shown to produce a better ohmic contact compared to the as-fabricated HEMTs. A HEMT with a 0.5 ${\mu}m$ gate length was fabricated using this novel manufacturing process, which exhibits a maximum drain current density of 720 mA/mm and a peak transconductance of 235 mS/mm. The X-band output power density was 6.4 W/mm with a 53% power added efficiency (PAE).

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.316-316
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• 2005