• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.4
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• pp.66-75
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• 1998

In many case of optimal design and sensitivity analysis, obtaining of transfer function between input and output variables is a difficult and time-consuming problem. The bond graph modeling is a method that is used for making it easy to analyze complex systems composed of mechanical and electrical parts. It gives us a simple and systematic tool to get state-space equations easily. And we can obtain the transfer function graphically using bond graph and Mason's rule. This paper shows how bond graphs are converted to block diagram and how Mason's rule is applied. And the simple direct method to obtain transfer function from bond graph is introduced. As a example, induction of transfer function of electric power steering composed of mechanical and electrical parts will be done.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.3
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• pp.420-429
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• 2007

The purpose of this study was to compare the micro ensile bond strength to bovine dentin of several adhesives (SM, Scotch $Bond^{TM}$ Multipurpose; SB, $Adper^{TM}$ Single Bond 2; SE, $Clearfil^{(R)}$ SE Bond; AQ, AQ $Bond^{TM}$; TS, $Clearfil^{(R)}$ tri-S Bond). Except SM and SB, they have a simplified one- or two-step application protocols in compare with the dentin adhesives conventional three-step protocols. For the microtensile bond strength test, the labial surfaces of bovine incisors were used. Following exposure of dentin layer, according to their manufacturer's directions, each dentin adhesives were applied and composite resin blocks were constructed. The teeth were sectioned for specimen and tested microtensile bond strength. Also observed the fracture mode of interface. The obtained results were as follows : 1. The microtensile bond strength values ranged from 51.34 to 24.04 MPa on dentin(in decreasing order, SE, SM, SB, AQ and TS). 2. The highest microtensile bond strength was by SE and SM on bovine dentin, and the lowest by AQ and TS. 3. SM, SB and SE showed cohesive failures and adhesive failure but AQ, TS presented almost adhesive failures. In summary, microtensile bond strengths of single-step adhesives (AQ and TS) on bovine dentin were significantly lower than those of multi-step adhesives (SM, SB and SE) (p<0.05).

• The Journal of Advanced Prosthodontics
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• v.8 no.6
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• pp.504-510
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• 2016

PURPOSE. Polyamide polymers do not provide sufficient bond strength to auto-polymerized resins for repairing fractured denture or replacing dislodged denture teeth. Limited treatment methods have been developed to improve the bond strength between auto-polymerized reline resins and polyamide denture base materials. The objective of the present study was to evaluate the effect of surface modification by acetic acid on surface characteristics and bond strength of reline resin to polyamide denture base. MATERIALS AND METHODS. 84 polyamide specimens were divided into three surface treatment groups (n=28): control (N), silica-coated (S), and acid-treated (A). Two different auto-polymerized reline resins GC and Triplex resins were bonded to the samples (subgroups T and G, respectively, n=14). The specimens were subjected to shear bond strength test after they were stored in distilled water for 1 week and thermo-cycled for 5000 cycles. Data were analyzed with independent t-test, two-way analysis of variance (ANOVA), and Tukey's post hoc multiple comparison test (${\alpha}=.05$). RESULTS. The bond strength values of A and S were significantly higher than those of N (P<.001 for both). However, statistically significant difference was not observed between group A and group S. According to the independent Student's t-test, the shear bond strength values of AT were significantly higher than those of AG (P<.001). CONCLUSION. The surface treatment of polyamide denture base materials with acetic acid may be an efficient and cost-effective method for increasing the shear bond strength to auto-polymerized reline resin.

• Bulletin of the Korean Chemical Society
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• v.7 no.3
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• pp.186-190
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• 1986

Effects of substituents in the nucleophile(X), the substrate(Y) and the leaving group(Z) on the structure of $S_N2$ transition states have been analyzed by considering effects of four components, electrostatic($E_{es}$), exchange repulsion ($E_{ex}$), polarization($E)_{pl}$) and charge transfer($E_{ct}$) terms, of interaction between the reactants on the degree of bond making and bond breaking. Prediction of net effects of all substituents(X, Y and Z) on the degree of bond making were found to be clearcut whereas the effect of an electron withdrawing group on the substrate (Y = EWG) on the degree of bond breaking was complex; the substituent(Y = EWG) is normally carbon-leaving group($C^{\ast}$-L) bond tightening($E_{pl}$ dominance) but becomes $C^{\ast}$-L bond loosening when the bond is strongly antibonding ($E_{ct}$ dominance). Our model calculations on the reaction of $CH_2XNH_2$ with $YCH_2COOCH_2Z$ using energy decomposition scheme have confirmed that predictions based on our analysis are correct.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.280-288
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• 1996

The purpose of this study was to assess comparatively the shear bond strength on dentin of four dentin bonding agents used in conjunction with light-curing composite resins. Clearfil New Bond, Scotchbond Multipurpose Dentin Adhesive, All-Bond 2 and X-R Bond were applicated on labial dentin surfaces just below dentin - enamel juction of bovine incisor teeth. After shear bond strength testing with the universal testing machine, the bonding interface of the specimens were observed under light stereomicroscope. Following results were obtained. 1. The shear bond strength was high in the order of B,C,D,A and group B Scotchbond Multipurpose Dentine Adhesive revealed greater bond strength than Clearfil New Bond and X-R Bond. (p<.001) 2. When using ANOVA and Duncan's multiple range test, there were statistical differences among the four groups, except between group Band C,group D and A. 3. There was no relationship between mode of failure and shear bond strength.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.5
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• pp.650-658
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• 2000

This study was investigated to compare the bond strength of polysulfide adhesive between tray resin and border molding materials and to evaluate the effect of saliva contamination on them. We made the 135 resin tray secimens with a dimension of $1{\times}1{\times}1cm$ and divided them into 3 groups by the materials 1) Quicky group, 2) Compound group, and 3) Impregum group Each group was subdivided by saliva contimination. Group S1 : applied adhesive without saliva contamination Group S2 : applied adhesive after drying 15seconds after saliva contamination Group S3 : applied adhesive no after saliva contamination. Tensile tests were performed with a Universal Load testing machine. Results showed Impregum group significantly higher bond strength than Quicky group, but there was no significant difference in adhesive bond strength between Compound group and Quicky group in experimental group by materials In experimental group by saliva contamination, S1 group is significantly higher bond strength than S2 group and S2 group is significantly higher bond strength than S3 group in Quicky group and S1, S2 group is significantly higher bond strength than S3 group in Compound group and Impregum group. Impression compound and Impregum F which are usually used as an individual tray border mold-ing material can be said to be satisfied in adhesive bond strength to polysulfide impression materials. After try-in and clinical adjustment are performed, a custom tray should be properly rinsed and air dried before tray adhesive was placed.

• Bulletin of the Korean Chemical Society
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• v.9 no.3
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• pp.179-182
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• 1988

A simple correlation between cross interaction constants ${\rho}_{ij}$ and bond lengths in the transition state was obtained ; it has been shown that ${\rho}_{ij}$ corresponds to force constant of activation, which in turn is related to bond length by Badger's rule involving only universal constants. A satisfactory correlation between 4-31G ab initio calculated values of bond length and force constant for C-X streching in the transition state of the methyl transfer reaction, $X^-\;+\;CH_3X\;=\;XCH_3\;+\;X^-$, indicated that Badger's rule can be extended to bonds in the transition state. Independence of ${\rho}_{ij}$ values from the variable charge transmission of reaction centers has been demonstrated with nearly constant, experimentally determined I${\rho}$XYI values, and hence similar degree of bond formation, for various $S_N2$ reactions.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.5
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• pp.483-491
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• 1992

Plasma silicon oxynitride film has been applied as a final passivation layer for semiconductor devices, because it has high resistance to humidity and prevents from alkali ion's penetration, and has low film stress. Structure properties of plasma silicon oxynitride film have been studied experimentally by the use of FT-IR, AES, stress gauge and ellipsometry. In this experiment,Si-N bonds increase as NS12TO/(NS12TO+NHS13T) gas ratio increases. Peaks of Si-N bond, Si-H bond and N-H bond were shifted to high wavenumber according to NS12TO/(NS12TO+NHS13T) gas ratio increase. Absorption peaks of Si-H bond were decreased by furnace anneal at 90$0^{\circ}C$. The atomic composition of film represents that oxygen atoms increase as NS12TO/(NS12TO+NHS13T) gas ratio increases, to the contrary, nitrogen atoms decrease.

• Restorative Dentistry and Endodontics
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• v.40 no.1
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• pp.30-36
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• 2015

Objectives: This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. Materials and Methods: 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Results: Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil $S^3$ Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Conclusions: Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations.