• Journal of Powder Materials
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• v.20 no.1
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• pp.19-23
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• 2013

Ru films were successfully prepared by plasma-enhanced atomic layer deposition (PEALD) using $Ru(EtCp)_2$ and $NH_3$ plasma. To optimize Ru PEALD process, the effect of growth temperature, $NH_3$ plasma power and $NH_3$ plasma time on the growth rate and preferred orientation of the deposited film was systemically investigated. At a growth temperature of $270^{\circ}C$ and $NH_3$ plasma power of 100W, the saturated growth rate of 0.038 nm/cycle was obtained on the flat $SiO_2$/Si substrate when the $Ru(EtCp)_2$ and $NH_3$ plasma time was 7 and 10 sec, respectively. When the growth temperature was decreased, however, an increased $NH_3$ plasma time was required to obtain a saturated growth rate of 0.038 nm/cycle. Also, $NH_3$ plasma power higher than 40 W was required to obtain a saturated growth rate of 0.038 nm/cycle even at a growth temperature of $270^{\circ}C$. However, (002) preferred orientation of Ru film was only observed at higher plasma power than 100W. Moreover, the saturation condition obtained on the flat $SiO_2$/Si substrate resulted in poor step coverage of Ru on the trench pattern with an aspect ratio of 8:1, and longer $NH_3$ plasma time improved the step coverage.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.124-124
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• 2010

Currently, extreme ultraviolet lithography (EUVL) is being investigated for next generation lithography. EUVL is one of competitive lithographic technologies for sub-22nm fabrication of nano-scale Si devices that can possibly replace the conventional photolithography used to make today's microcircuits. Among the core EUVL technologies, mask fabrication is of considerable importance due to the use of new reflective optics having a completely different configuration compared to those of conventional photolithography. Therefore, new materials and new mask fabrication process are required for high performance EUVL mask fabrication. This study investigated the etching properties of SnO2 (Tin Oxide) as a new absorber material for EUVL binary mask. The EUVL mask structure used for etching is SnO2 (absorber layer) / Ru (capping / etch stop layer) / Mo-Si multilayer (reflective layer) / Si (substrate). Since the Ru etch stop layer should not be etched, infinitely high selectivity of SnO2 layer to Ru ESL is required. To obtain infinitely high etch selectivity and very low LER (line edge roughness) values, etch parameters of gas flow ratio, top electrode power, dc self - bias voltage (Vdc), and etch time were varied in inductively coupled Cl2/Ar plasmas. For certain process window, infinitely high etch selectivity of SnO2 to Ru ESL could be obtained by optimizing the process parameters. Etch characteristics were measured by on scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analyses. Detailed mechanisms for ultra-high etch selectivity will be discussed.

• Journal of the Korean Ceramic Society
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• v.37 no.10
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• pp.975-980
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• 2000

스테인레스 스틸 기판 위에 Pb($Zr_{0.45}$ $Ti_{0.55}$) $O_3$후막을 졸-겔 스핀 코팅법으로 제조하였다. 스테인레스 스틸은 그 자체로 좋은 도체이지만 PZT 후막의 강유전 특성을 개선하고자 Ru $O_2$박막을 중간층 겸 하부전극으로 사용하였다. PZT 전구체 용액을 코팅하고 급속 열처리하였을 때 5$50^{\circ}C$ 이하에서 pyrochlore 상이 먼저 나타났고 이 transient 상은 61$0^{\circ}C$에서 모두 perovskite 상으로 변화하였다. $600^{\circ}C$에서 열처리된 PZT 후막은 잔존하는 pyrochlore로 인해 걸어준 전기장에 무관하게 5-7$\mu$C/$ extrm{cm}^2$의 낮은 $P_{r}$값을 나타내었으나 61$0^{\circ}C$ 이상에서 열처리된 시편들은 모두 25$\mu$C/$\textrm{cm}^2$ 이상의 잔류분극을 가지고 있었다. 또한 Ru $O_2$중간층이 PZT의 강유전성에 미치는 영향을 조사하였을 때 잔류분극 값은 거의 영향을 받지 않았으나 항전계 값은 상당한 영향을 받았다. 즉 100nm 두께의 Ru $O_2$박막을 중간층으로 사용할 경우 중간층 없이 직접 스테인레스 스틸 위에 코팅할 때에 비해 항전계 값을 45% 가량 줄일 수 있었다.

• Journal of Energy Engineering
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• v.24 no.2
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• pp.34-39
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• 2015

This study confirmed the characteristics of hydrogen production according to electrode materials by producing non-diaphragm alkaline water electroanalyzer that can be controlled at medium temperature to produce hydrogen. As a result of the electrochemical characteristics by electrode material ($IrO_2/Ti$, $RuO_2/Ti$, Ti), the highest efficiency was found in $RuO_2/Ti$, as a result of hydrogen production experiment by electrolyte concentration, electrolyte concentration has a tendency to be proportional to hydrogen production and the condition of 30% KOH showed the highest hydrogen production as $118.9m^3/m^3/day$. In the experiment that confirmed hydrogen production according to electrode materials, in case of combination of anode ($IrO^2/Ti$) and cathode ($RuO^2/Ti$), it was $157.55m^3/m^3/day$ that showed a higher hydrogen production by around 6.97% than that of $IrO^2/Ti$ and cathode. It is presumed that the improvement of electrochemical activation of DSA electrode increases hydrogen production and influences the improvement of durability compared to the former electrode so that it enables stable alkaline water electrolysis.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.26.2-26.2
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• 2008

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.4
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• pp.369-375
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• 2010

The study on the characteristics of nitrous oxide catalytic decomposition was carried out to utilize the nitrous oxide as a propellant. The Pt, Ir and Ru were synthesized to select a high performance catalyst for the nitrous oxide decomposition reaction. The respective catalyst precursors were loaded in the $Al_2O_3$ support using an wet impregnation method. The $N_2O$ conversion as a variation of space velocity and reaction temperature was measured using a tubular reactor. The catalyst loss was measured to evaluate the durability of catalysts after the reaction at $800^{\circ}C$ for 2 hours. The $N_2O$ conversion was increased at the decrease of space velocity and at the increase of temperature. The Ru/$Al_2O_3$ catalyst had the highest $N_2O$ conversion at low temperature and the best durability.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.557-562
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• 2012

Self-organized ruthenium (Ru) dots were fabricated by $400^{\circ}C$ RTA (rapid thermal annealing) and ALD (atomic layer deposition). The dots were produced under the $400^{\circ}C$ RTA conditions for 10, 30 and 60 seconds on all Si(100)/200 nm-SiO2, glass, and glass/fluorine-doped tin oxide (FTO) substrates. Electrical sheet resistance, and surface microstructure were examined using a 4-point probe and FE-SEM (field emission scanning electron microscopy). Ru dots were observed when a 30 nm-Ru layer on a Si(100)/200 nm-SiO2 substrate was annealed for 10, 30 and 60 seconds, whereas the dots were only observed on a glass substrate when a 50 nm-Ru layer was annealed on glass. For a glass/FTO substrate, RTA <30 seconds was needed for 30 nm Ru thick films. Those dots can increase the effective surface area for silicon and glass substrates by up to 5-44%, and by 300% for the FTO substrate with a < $20^{\circ}$ wetting angle.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.1
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• pp.76-79
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• 2014

We report Zinc oxide (ZnO) nanorods synthesis and electrochemical luminescence (ECL) cell fabrication. The ECL cell was fabricated using the electrode of ZnO nanorods and Ru(II) complex ($Ru(bpy)_3{^{2+}}$) as a luminescence materials. The fabricated ECL cell is composed of F-doped $SnO_2$ (FTO) glass/ Ru(II)/ZnO nanorods/FTO glass. The highest intensity of the emitting light was obtained at the wavelength of ~620 nm which corresponds to dark-orange color. At a bias voltage of 3V, the measured ECL efficiencies were 5 $cd/m^2$ for cell without ZnO nanorod, 145 $cd/m^2$ for ZnO nanorods-$5{\mu}m$, 208 $cd/m^2$ for ZnO nanorods-$8{\mu}m$ and 275 $cd/m^2$ for ZnO nanorods-$10{\mu}m$, respectively. At a bias voltage of 3.5V, the use of ZnO nanorods increases ECL intensities by about 3 times compared to the typical ECL cell without the use of ZnO nanorods.

• The Korean Journal of Ceramics
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• v.3 no.4
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• pp.274-278
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• 1997

(Ba, Sr) TiO$_3$(BST) thin films were prepared on RuO$_2$/Si substrates by rf magnetron sputtering and annealing was followed at temperatures ranging from 550 to 80$0^{\circ}C$ in $N_2$or $O_2$atmosphere. The effects of annealing conditions on the properties of BST film deposited on RuO$_2$bottom electrodes were investigated. It was found that the crystallinity. surface roughness, and grain size of BST films vary with the annealing temperature but they are not dependent upon the annealing atmosphere. The flat region in the current-voltage (I-V) curves of BST capacitors shortened with increasing annealing temperature under both atmospheres. This is believed to be due to the lowering of potential barrier caused by unstable interface and the increase of charge The shortening of the flat region by $O_2$annealing was more severe than that by $N_2$-annealing. As a result, there was no flat region when the films were annealed at 700 and 80$0^{\circ}C$ in $O_2$atmosphere. The dielectric properties of BST films were improved by annealing in either atmosphere. however, a degradation with frequency was observed when the films were annealed at relatively high temperature under $O_2$atmosphere.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.3
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• pp.221-226
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• 2015

Ru catalysts supported on $CeO_2$ were synthesized by an impregnation method and characterized by numerous analytical techniques including X-ray diffraction (XRD), Brunauer-Emmett-Teller (BET), transmission electron microscopy (TEM), and scanning electron microscopy-energy dispersive X-ray spectroscopy (SEM-EDS). Upon utilization of these catalysts for methane dry reforming with a $CH_4/CO_2$ ratio of 1:1 at different temperatures ranging from 550 to $750^{\circ}C$, the $Ru/CeO_2$ catalysts have shown to be active. In particular, Ru(0.55wt%) supported on $CeO_2$ (1) prepared by a hydrothermal method exhibited excellent activity with the conversion of > 75% at $750^{\circ}C$. In addition, the catalyst also proved to be highly stable for at least 47 h without catalyst deactivation under the dry reforming conditions.