• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.06a
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• pp.42-47
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• 2000

The friction and lubrication characteristics of joint cartilage were investigated using the metatarso-phalangeal joint cartilage of rabbit against rotating stainless steel disk. Friction tests were conducted by dry and bovine serum lubricated sliding at room and body temperatures. For the dry sliding tests, low friction coefficient of 0.1-0.15 was observed at the early period of test, and then the friction coefficient increased as a test continued. With increasing applied load the early period of low friction lengthens. For the lubricated sliding tests, the coefficient of friction decreased as the applied load increased. And also the coefficient of friction decreased continuously to 0.07 as the test duration increases. These results can be interpreted that the squeeze or weeping lubrication mechanism dominates the friction and lubrication characteristics in the joint cartilage of rabbit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.62-62
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• 2009

Electrical properties of SGS-TFT with 5/5 ${\mu}m$ channel width and length which gate insulator is made of 20nm $SiO_2$ and 80nm $SiN_x$ was fabricated and measured at various temperatures. The field-effect mobility was decreased from 86.25 to 80.42 $cm^2/Vs$ and threshold voltage also decreased from -1.5792 to -1.0492 V, when temperature is increased from room temperature to $100^{\circ}C$. Subthreshold swing, also, increased from 0.3212 to 0.4818 V/dec and $I_{on/off}$ ratio decreased from $5.05{\times}10^7$ to $6.93{\times}10^5$.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.52-55
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• 2000

The temperature effects of programming speed and endurance characteristics in p-channel flash memory cell have been investigated. In the case of room temperature, the programming speed of p-channel flash memory by using BTB scheme is faster than that by using CHE scheme. However, endurance characteristics with BTB programming scheme is not better than that with CHE programming scheme. In the case of elevated temperature, CHE programming speed is reduced due the gate current degradation but BTB programming speed is enhanced due to the increasing of gate current. Finally, the endurance characteristics of both schemes are improved due to the reduction of gate oxide traps.

• Steel and Composite Structures
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• v.3 no.6
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• pp.383-401
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• 2003

Two new formulae for the design of beam-columns at room temperature have been proposed into Eurocode 3, prEN 1993-1-1 (2002), and are the result of great efforts made by two working groups that followed different approaches, a French-Belgian team and an Austrian-German one. Under fire conditions the prEN 1993-1-2 (structural fire design) presents formulae, for the design of beam-columns based on the prENV 1993-1-1 (1992). In order to study the possibility of having, in part 1-1 and part 1-2 of the Eurocode 3, the same approach, a numerical research was made using the finite element program SAFIR, developed at the University of Liege for the study of structures subjected to fire.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.152-155
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• 2003

In order to examine the springback of aluminum alloy sheets, AL1050 and AL5052, in the warm forming which forms the sheet above room temperature, the stretch bending and draw bending tests in various working temperatures were carried out. While the springbacks of AL5052 and AL1050 are tremendously reduced over 150$^{\circ}C$ in the stretch bending test, the springbacks in the draw bending test are rapidly reduced in 150$^{\circ}C$-200$^{\circ}C$ for AL5052 and 200$^{\circ}C$-250$^{\circ}C$ for AL1050. Using the FEM program, the forming and springback processes are analyzed. Though springback amounts of analysis result are slightly bigger than those of experiment, they showed the same trend in the decreasing springback as the forming temperature increases.

• Transactions of Materials Processing
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• v.17 no.7
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• pp.473-480
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• 2008

Sheet metal forming of Mg alloy is usually performed at elevated temperature because of the low formability at room temperature. Therefore, strain rates affected with the forming temperature and speed must be considered as important factor about formability. Effects of process parameters such as various temperatures and forming speeds were investigated in circular cup deep drawing. From the experimental results, it is known that LDR (Limit Drawing Ratio) increase as the strain rate increase. On the contrary, the FLD (Forming Limit Diagram) shows lower value as faster strain rate. Therefore, anisotropy values are investigated according to the temperature and strain rates at each forming temperature. R-values also represent higher value as faster strain rate. It is known that the formability can be different with the deformation mode on warm forming of AZ31 alloy sheet.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.8
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• pp.734-739
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• 2005

Zinc oxide films were deposited on Si (111) substrates by radio-frequency (rf)sputtering at a room temperature and post annealed in Na, air, and $H_2O$ ambient at temperatures between $800{\circ}C$ for 2 hrs. The properties were investigated by atomic force microscope (AFM), X-ray diffraction (XRD), Auger electron spectroscopy (AES) and photoluminescence (PL). Our experiments demonstrated that ZnO films have the better crystal quality for post thermal annealing and especially in $H_2O$ ambient. Even though thermal annealing reduced deep level emission somewhat, for further getting rid off deep level emission, oxygen contents should be adjusted. In our results, $H_2O$ ambient gave the best structural and optical properties.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.155-158
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• 2002

Fabrication process of metal/intermetallic laminated composites by using self-propagating high temperature synthesis(SHS) reactions between Ni and Al elemental metal foils have been investigated. Al foils were sandwiched between Ni foils and heated in a vacuum hot press to the melting point of aluminium. SHS reaction kinetics was thermodynamically analyzed through the final volume fraction of the unreacted Al related with the initial thickness ratio of Ni:Al and diffusion bonding stage before SHS reaction. Thermal aging of laminated composites resulted in the formation of functionally gradient series of intermetallic phases. Microstructure showed that the main phases of intermetallics were NiAl and $Ni_3Al$ having higher strength at room and high temperatures. The volume fractions of intermetallic phases were measured as 82.4, 58.6, 38.4% in 1:1, 2:1, 4:1 initial thickness ratio of Ni:Al.

• The Korean Journal of Ceramics
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• v.2 no.4
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• pp.246-250
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• 1996

The thermomechanical properties of materials from the system Al2O3-SiO2-TiO2(Tialite-Mullite) were investigated by correlating the thermal expansion anisotroypy, flexural strength and Young's modulus with grain size and atructural microcracking during cooling. Microcracking temperatures were determined by measuring the hysteresis of the thermal expansion anisotropy with dilatometry. Single phase Aluminium Titanate is a low strength material, while composites with more than 10 vol% mullite as second phase enhance the Young's modulus, thermal expansion coefficient and room temperature strength.

• Journal of the Korean housing association
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• v.10 no.1
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• pp.75-84
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• 1999

The purpose of this study is to identify the characteristics of the thermal environment, and to analyze the relationship between the thermal reactions and the skin temperatures in the lying position in the radiant floor heating system. The results are as follows: 1) The globe temperature was nearly equal to the operative temperature in the room. 2) The floor surface temperature and the globe temperature were 26.4$^{\circ}C$ and 23.6$^{\circ}C$, respectively when the whole body temperature was at neutral point. 3) The mean temperature of the six skin parts was 31.3$^{\circ}C$ (cold thermal environment); 34.1$^{\circ}C$ (neutral thermal environment); 35.1$^{\circ}C$ (hot thermal environment).