• Journal of KIISE
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• v.42 no.9
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• pp.1100-1108
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• 2015

Classes.dex, which is the executable file for android operation system, has Java bite code format, so that anyone can analyze and modify its source codes by using reverse engineering. Due to this characteristic, many android applications using classes.dex as executable file have been illegally copied and distributed, causing damage to the developers and software industry. To tackle such ill-intended behavior, this paper proposes a technique to encrypt classes.dex file using an AES(Advanced Encryption Standard) encryption algorithm and decrypts the applications encrypted in such a manner in order to prevent reverse engineering of the applications. To reinforce the file against reverse engineering attack, hash values that are obtained from substituting a hash equation through the combination of salt values, are used for the keys for encrypting and decrypting classes.dex. The experiments demonstrated that the proposed technique is effective in preventing the illegal duplication of classes.dex-based android applications and reverse engineering attack. As a result, the proposed technique can protect the source of an application and also prevent the spreading of malicious codes due to repackaging attack.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1776-1779
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• 2003

This research presents Reverse Engineering of a Impeller. The modeling introduced in this paper adopts polynomial regression that is utilizing approximating technique. The measured data are obtained from measuring with Coordinate Measuring Machine. This paper introduces efficient methods of Reverse Engineering using Polynomial Regression.

• Proceedings of the Safety Management and Science Conference
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• 1999.11a
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• pp.565-574
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• 1999

In reverse engineering area, it is rapidly developing reconstruction of surfaces from scanning or digitizing data, but geometric models of existing objects unavailable many industries. This paper describes new methodology of reverse engineering area, good strategies and important algorithms in reverse engineering area. Furthermore, proposing reconstruction of surface technique is presented. A method find base geometry and blending surface between them. Each based geometry is divided by triangular patch which are compared their normal vector for face grouping. Each group is categorized analytical surface such as a part of the cylinder, the sphere, the cone, and the plane that mean each based geometry surface. And then, each based geometry surface is implemented infinitive surface. Infinitive average surface's intersections are trimmed boundary representation model reconstruction. This method has several benefits such as the time efficiency and automatic functional modeling system in reverse engineering. Especially, it can be applied 3D scanner and 3D copier.

• Journal of Mechanical Science and Technology
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• v.14 no.10
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• pp.1104-1113
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• 2000

This paper proposes an efficient reverse engineering technique for compound surfaces using a boundary detection method. This approach consists in extracting geometric edge information using a vision system, which can be used in order to drastically reduce geometric errors in the vicinity of compound surface boundaries. Through the image-processing technique and the interpolation process, boundaries are reconstructed by either analytic curves (e. g. circle, ellipse, line) or parametric curves (B-spline curve). In other regions, except boundaries, geometric data are acquired on CMM as points inspected using a touch type probe, and then they are interpolated on several surfaces using a B-spline skinning method. Finally, the boundary edge and the skinned surfaces are combined to reconstruct the final compound surface. Through simulations and experimental works, the effectiveness of the proposed method is confirmed.

• Journal of Information Processing Systems
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• v.15 no.6
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• pp.1438-1448
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• 2019

We present a new technique, called VED (very effective debugging), for detecting and correcting division by zero errors for all types of .NET application. We use applications written in C# because C# applications are distributed through the internet and its executable format is used extensively. A tool called Immunity Debugger is used to reverse engineer executable code to get binaries of source code. With this technique, we demonstrate integer division by zero errors, the location of the error causing assembly language code, as well as error recovery done according to user preference. This technique can be extended to work for other programming languages in addition to C#. VED can work on different platforms such as Linux. This technique is simple to implement and economical because all the software used here are open source. Our aims are to simplify the maintenance process and to reduce the cost of the software development life cycle.

• ETRI Journal
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• v.20 no.1
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• pp.16-27
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• 1998

In this paper, we consider the acquisition performance of an IS-95 reverse link access channel slot as a function of system design parameters such as postdetection integration length and the number of access channel message block repetitons. The uncertainty region of the reverse link spreading codes compared to that of forward link is very small, since the uncertainty region of the reverse link is determined by a cell radius. Thus, the parallel acquisiton technique in the reverse link is more efficient than a serial acquisition technique in terms of implementation and of acquisition time. The parallel acquisition is achieved by a bank of N parallel I/Q noncoherent correlator are analyzed for band-limited noise and the Rayleigh fast fading channel. The detection probability is derived for multiple correct code-phase offsets and multipath fading. The probability of no message error is derived when rake combining, access channel message block combining, and Viterbi decoding are applied. Numerical results provide the acquisition performance for system design parameters such as postdetection integration length and number of access channel message block repetitions in case of a random access on a mobile station.

• Journal of Power Electronics
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• v.19 no.3
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• pp.645-654
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• 2019

In this paper, a new high step up DC/DC converter with a modified super-lift technique is presented. The coupled inductor technique is combined with the super-lift technique to provide a tenfold or more voltage gain with a proper duty cycle and a low turn ratio. Due to a high conversion ratio, the voltage stress on the semiconductor devices is reduced. As a result, low voltage ultra-fast recovery diodes and low on resistance MOSFET can be used, which improves the reverse recovery problems and conduction losses. This converter employs a passive clamp circuit to recycle the energy stored in the leakage inductance. The proposed convertor features a high conversion ratio with a low turn ratio, low voltage stress, low reverse recovery losses, omission of the inrush currents of the switch capacitor loops, high efficiency, small volume and reduced cost. This converter is suitable for renewable energy applications. The operational principle and a steady-state analysis of the proposed converter are presented in details. A 200W, 30V input, 380V output laboratory prototype circuit is implemented to confirm the theoretical analysis.

• Computers and Concrete
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• v.33 no.5
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• pp.595-603
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• 2024

In the construction industry, there has been a surge in the implementation of high-tech equipment in recent years. Various technologies are being considered as potential solutions for future construction projects. Building information modeling (BIM), which utilizes advanced equipment, is a promising solution among these technologies. The need for safety inspection has also increased with the aging structures. Nevertheless, traditional safety inspection technology falls short of meeting this demand as it heavily relies on the subjective opinions of workers. This inadequacy highlights the need for advancements in existing maintenance technology. Research on building safety inspection using 3D laser scanners has notably increased. Laser scanners that use light detection and ranging (LiDAR) can quickly and accurately acquire producing information, which can be realized through reverse engineering by modeling point cloud data. This study introduces an innovative evaluation system for building safety using a 3D laser scanner. The system was used to assess the safety of an existing three-story building by implementing a reverse engineering technique. The 3D digital data are obtained from the scanner to detect defects and deflections in and outside the building and to create an as-built BIM. Subsequently, the as-built structural model of the building was generated using the reverse engineering approach and used for structural analysis. The acquired information, including deformations and dimensions, is compared with the expected values to evaluate the effectiveness of the proposed technique.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.172-179
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• 2002

In this paper, an efficient reverse engineering method for free-formed surfaces is proposed based on the integration of a repetitive digitizing method and vision system. In recent reverse engineering process, the equi-interval digitization method is being used since the surface information is not known. If more accurate results are required, the number of measuring point should be increased appropriately. Thus, such measuring process tends to result in too dense data including useless information, and cause excessive measuring time. This problem can be improved by applying repetitive digitizing method and image process technique, which is proposed in this paper. The proposed methods are validated through appropriate simulation and experiments.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.304-307
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• 2013

Reverse engineering of semiconductor devices utilizes delayering processes, in order to identify how the interconnection lines are stacked over transistor gates. Cu metal has been used in recent fabrication technologies, and de-processes becomes more difficult with the shrinking device dimensions. In this article, reverse engineering technologies to reveal the Cu interconnection lines and Cu via-plugs embedded in dielectric layers are investigated. Stacked dielectric layers are removed by $CF_4$ plasma etching, then the exposed planar Cu metal lines and via-plugs are selectively delineated by wet chemical solution, instead of the commonly used plasma-based dry etch. As a result, we have been successful in extracting the layouts of multiple layers within a system IC, and this technique can be applicable to other logic IC, analog IC, and CMOS IC, etc.