• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1487_1488
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• 2009

In these days, the common grounding systems are adapted in most large structures. In order to evaluate the performance of grounding system, it is needed to measure ground impedance. Measuring methods of ground impedance for a large scale grounding systems have not been yet presented in detail. In this paper, we analyze earth mutual resistance and mutual coupling of $15{\times}15m$ grounding grid in different arrangements of auxiliary electrode. As a results, the auxiliary electrodes are installed where the error rate due to earth mutual resistance is less than 5%. Also, the potential lead is installed at obtuse angle from the current lead and the overlapped length between potential lead and grounding grid are minimized.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2276-2283
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• 2018

A 50kW-4000rpm interior permanent magnet synchronous machine (IPMSM) applied to the high-performance electric vehicle (EV) is introduced in this paper. The main work of this paper is that a 2-D T-type lumped-parameter thermal network (LPTN) model is presented for IPMSM temperature rise calculation. Thermal conductance matrix equation is generated based on calculated thermal resistance and loss. Thus the temperature of each node is obtained by solving thermal conductance matrix. Then a 3-D liquid-solid coupling model is built to compare with the 2-D T-type LPTN model. Finally, an experimental platform is established to verify the above-mentioned methods, which obtains the measured efficiency map and current wave at rated load case and overload case. Thermocouple PTC100 is used to measure the temperature of the stator winding and iron core, and the FLUKE infrared-thermal-imager is applied to measure the surface temperature of IPMSM and controller. Test results show that the 2-D T-type LPTN model have a high accuracy to predict each part temperature.

• Progress in Superconductivity
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• v.10 no.2
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• pp.74-78
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• 2009

Inter-grain nanobridges of the $MgB_2$ superconductor have been fabricated by focused-ion-beam(FIB) and their electrical transport properties were studied. The $MgB_2$ film was prepatterned into microbridges by a standard argon ion milling technique and then FIB-patterned into 100 nm$\times$100 nm bridges. Current-voltage characteristics showed a strong flux-flow type behavior at all temperatures with a trait of Josephson coupling near $T_c$. At low temperatures, the curves showed a two-step resistance-doubled transition with occasional hysteresis. The resistance-doubling transition is believed to be due to a two-channel flux-flow effect. The temperature-dependent critical current data showed $I_c(T){\propto}(1-T/T_c)^2$ near $T_c$, same as a normal barrier junction, and $I_c(T){\propto}(1-T/T_c)^{1.2}$ at low temperatures, similar to that of a film.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.11
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• pp.555-561
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• 2001

In this paper, the low power (1.5 W) solenoid-type magnetic thin-film transformers utilizing a $Ni_{81}Fe_{19)$ core material were designed and fabricated for 5 MHz-drive DC-DC converter application. The $20\mum$ thick copper films were used as the coils. The transformers fabricated in this work have the sizes of $3.08 mm\times25.5 mm\; and\; 6.15 mm\times12.75 mm.$ The optimum design of solenoid-type magnetic thin film transformers was performed utilizing the conventional equations, a Maxwell computer simulator (Ansoft HFSS V7.0 for PC), and parameters obtained from the magnetic properties of NiFe magnetic core materials. frequency characteristics of inductance, dc resistance (R), coupling factor (k) and gain of developed transformers were measured using HP4194A impedance and gain-phase analyzer. The fabricated transformers with the size of $6.15 mm\time12.75 mm$ exhibit the inductance of $0.83 \muH$, the dc resistance of $2.3\Omega$$\Omega$, the k of 0.91 and the gain of -1 dB at 5 MHz, which show the comparable results to those reported in the recent literatures. The measured high-frequency characteristics for the fabricated transformers agreed well with those obtained by theoretical calculations .

• Journal of Magnetics
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• v.6 no.4
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• pp.132-141
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• 2001

The switching characteristics and the magnetization-flop behavior in magnetic tunnel junctions exchange biased by synthetic antiferromagnets (SyAFs) are investigated by using a computer simulations based on a single-domain multilayer model. The bias field acting on the free layer is found to be sensitive to the thickness of neighboring layers, and the thickness dependence of the bias field is greater at smaller cell dimensions due to larger magnetostatic interactions. The resistance to magnetization flop increases with decreasing cell size due to increased shape anisotropy. When the cell dimensions are small and the synthetic antiferromagnet is weakly, or not pinned, the magnetization directions of the two layers sandwiching the insulating layer are aligned antiparallel due to a strong magnetostatic interaction, resulting in an abnormal magneto resistance (MR) change from the high-MR state to zero, irrespective of the direction of the free-layer switching. The threshold field for magnetization-flop is found to increase linearly with increasing antiferromagnetic exchange coupling in the synthetic antiferromagnet. Irrespective of the magnetic parameters and cell sizes, magnetization flop does not exist near zero applied field, indicating that magnetization flop is driven by the Zeeman energy.

• Proceedings of the KIEE Conference
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• 2003.11a
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• pp.379-381
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• 2003

The sharing of common corridors by electric power transmission lines and pipelines is becoming more common place. However, such corridor sharing can result in undesired coupling of electromagnetic energy from the power lines to the near facilities. This causes induced voltages on underground metallic pipelines due to the power line currents. This could cause AC corrosion in the pipeline, which could in turn lead to disastrous accidents, such as gas explosion or oil leakage. This paper investigates for the limitation of induced voltage on the buried metal structures which is used in the inside and outside of the country. And then we measure the earth resistance and leakage current of 22.9kV distribution lines and pipe to soil potential of near pipelines in Seoul Korea. Hereby we can see the leakage current flowing through the earthing electrode have an effect on near pipelines.

• Steel and Composite Structures
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• v.45 no.4
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• pp.605-619
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• 2022

The tensile behavior of the Thread-fixed One-side Bolt (TOB) at high temperatures was studied using the Finite Element Modeling (FEM) to explore the structural responses that could not be measured in tests. The accuracy of the FEM was verified using the test results from the failure mode, load-displacement curve as well as yielding load. Three typical failure modes of TOB connected T-stubs were observed, which were the Flange Yielding (FY), the Bolt Failure (BF) and the Coupling Failure mode (CF). The influence of the flange thickness tb and the temperature θ on the tensile behavior of the T-stub were discussed. The initial stiffness and the yielding load decreased with the increase of the temperature. The T-stubs almost lost their resistance when the temperature exceeded 700℃. The failure modes of T-stubs were mainly decided by the flange thickness, which relates to the anchorage of the hole threads and the bending resistance of flange. The failure mode could also be changed by the high temperature. Design equations in EN 1993-1-8 were modified and verified by the FEM results. The results showed that these equations could predict the failure mode and the yielding load at different temperatures with satisfactory accuracy.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.77-82
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• 2022

During etching process of PCB, the electroplated copper line and seed layer copper have different etching rates and it caused the over etching of copper line as well as undercut of lines. In this research, the effects of etchants composition on copper etching characteristics were investigated. The optimum concentration of hydrogen peroxide and sulfuric acid of etchants were obtained using polarization and OCV (open circuit voltage) analysis for both rolled copper and electroplated copper. The inhibiting effects of different inhibitors were investigated using OCV and ZRA (zero resistance ammeter) analysis. The galvanic current between electroplated copper and seed layer copper were measured using ZRA method. Inhibitors for least galvanic current could be chosen based on galvanic coupling in ZRA analysis.

• Journal of the Korean Society for Heat Treatment
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• v.28 no.5
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• pp.229-238
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• 2015

The effects of Sn addition and solution treatment on corrosion behavior were studied in AZ91 magnesium casting alloy. The addition of 5%Sn contributed to the introduction of $Mg_2Sn$ phase, to the reduction in dendritic cell size and to the increase in the amount of secondary phases. After the solution treatment, trace amount of $Al_8Mn_5$ particles were observed in the ${\alpha}$-(Mg) matrix for the AZ91 alloy, while $Mg_2Sn$ phase with high thermal stability was additionally found in the AZ91-5%Sn alloy. Before the solution treatment, the AZ91-5%Sn alloy had better corrosion resistance than the Sn-free alloy, which is caused by the enhanced barrier effect of the (${\beta}+Mg_2Sn$) phases formed more continuously along the dendritic cell boundaries. It is interesting to note that after the solution treatment, the corrosion rate of both alloys became increased, but the Sn-added alloy showed higher corrosion rate than the Sn-free alloy. The microstructural examination on the corroded surfaces revealed that the remaining $Mg_2Sn$ particles in the solution-treated AZ91-5%Sn alloy play a role in accelerating corrosion by galvanic coupling with the ${\alpha}$-(Mg) matrix.