• Title/Summary/Keyword: Reliability standard

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Reliability-Based Analysis of Slope Stability Due to Infiltration (침투에 대한 불포화 사면의 신뢰성 해석)

  • Cho, Sung-Eun;Lee, Jong-Wook;Kim, Ki-Young;Jeon, Je-Sung
    • Proceedings of the Korean Geotechical Society Conference
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    • 2005.10a
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    • pp.649-654
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    • 2005
  • Shallow slope failures in residual soil during periods of prolonged infiltration are common over the world. One of the key factors that dominate slope stability is hydrological response associated with infiltration. Hence, the soil-water profile during rainfall infiltration into unsaturated soil must me examined to evaluate slope stability. However, the hydraulic response of unsaturated soil is complicated by inherent uncertainties of the soil hydraulic properties. This study presents a methodology for assessing the effects of parameter uncertainty of hydraulic properties on the response of a analytical infiltration model using first-order reliability method. The unsaturated soil properties are considered as uncertain variables with means, standard deviations, and marginal probability distributions. Sensitivities of the probabilistic outcome to the basic uncertainties in the input random variables are provided through importance factors.

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Effects of Doping Concentration of Polycrystalline Silicon Gate Layer on Reliability Characteristics in MOSFET's (MOSFET에서 다결정 실리콘 게이트 막의 도핑 농도가 신뢰성에 미치는 영향)

  • Park, Keun-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.2
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    • pp.74-79
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    • 2018
  • In this report, the results of a systematic study on the effects of polycrystalline silicon gate depletion on the reliability characteristics of metal-oxide semiconductor field-effect transistor (MOSFET) devices were discussed. The devices were fabricated using standard complimentary metal-oxide semiconductor (CMOS) processes, wherein phosphorus ion implantation with implant doses varying from $10^{13}$ to $5{\times}10^{15}cm^{-2}$ was performed to dope the polycrystalline silicon gate layer. For implant doses of $10^{14}/cm^2$ or less, the threshold voltage was increased with the formation of a depletion layer in the polycrystalline silicon gate layer. The gate-depletion effect was more pronounced for shorter channel lengths, like the narrow-width effect, which indicated that the gate-depletion effect could be used to solve the short-channel effect. In addition, the hot-carrier effects were significantly reduced for implant doses of $10^{14}/cm^2$ or less, which was attributed to the decreased gate current under the gate-depletion effects.

A Study of Reliability Improvement for Mechanical Property of Explosive Bolt Body (폭발볼트 몸체 물성의 신뢰성 향상 연구)

  • Lee Yeung-Jo;Kim Dong-Jin;Kang Won-Kyu
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2005.11a
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    • pp.173-176
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    • 2005
  • The present work has been studied the reliability improvement of inspection method for explosive bolt body. The standard value of impact test is made from impact test of explosive bolt body and a useful data is established to the correlation between the hardness and impact data of bolt body. The method is overcome an error obtained from conventional inspection by analysing the mechanical data from each inspection and can be improved to the reliability when mechanical property of explosive bolt body is inspected.

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Engineering criticality analysis on an offshore structure using the first- and second-order reliability method

  • Kang, Beom-Jun;Kim, Jeong-Hwan;Kim, Yooil
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.8 no.6
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    • pp.577-588
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    • 2016
  • Due to the uncertainties related to the flaw assessment parameters, such as flaw size, fracture toughness, loading spectrum and so on, the probability concept is preferred over deterministic one in flaw assessment. In this study, efforts have been made to develop the reliability based flaw assessment procedure which combines the flaw assessment procedure of BS7910 and first-and second-order reliability methods (FORM/SORM). Both crack length and depth of semi-elliptical surface crack at weld toe were handled as random variable whose probability distribution was defined as Gaussian with certain means and standard deviations. Then the limit state functions from static rupture and fatigue perspective were estimated using FORM and SORM in joint probability space of crack depth and length. The validity of predicted limit state functions were checked by comparing it with those obtained by Monte Carlo simulation. It was confirmed that the developed methodology worked perfectly in predicting the limit state functions without time-consuming Monte Carlo simulation.

Analysis of Void Effects on Mechanical Property of BGA Solder Joint (솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향)

  • Lee, Jong-Gun;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.1-9
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    • 2011
  • Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

A Study of Limit State Design Method in Soil Slope (토사면의 한계상태 설계법에 관한 연구)

  • Joung, Gi-Hun;Kim, Jong-Min;Jang, Bum-Su
    • Proceedings of the Korean Geotechical Society Conference
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    • 2005.03a
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    • pp.129-136
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    • 2005
  • The deterministic analysis method has generally used to evaluate the slope stability and it evaluates the slope stability with decision value that is a representative value of design variables. However, one of disadvantages in the deterministic approach is there is not able to consider the uncertainty of soil strength properties, even though it is the biggest influential parameter of the slope stability. On the other hand, the limit state design(LSD) can take a consideration of uncertainties and computes both the reliability index and the probability of failure. LSD method is capable of overcoming the disadvantages of deterministic method and evaluating the slope stability more reliably. In this study, both the mean value and standard deviation of the internal land's representative soil strength properties applied to process the LSD method. The major purpose of this study is to gauge the general applicability of the limit state design in soil slope and to weigh the comparative validity of the proposed partial safety factor. In order to reach the aim of this study, the partial safety factor and resistance factor which totally satisfied the slope's overall safety factor were calculated by the load and resistance safety factor design (LRFD).

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Reliability and Validity of the Manual Measurement Method for Patellar Height (무릎뼈 높이에 대한 도수측정방법의 신뢰도와 타당도)

  • Kim, Moon-Hwan;Yun, Sung-Joon;Weon, Jong-Hyuck
    • Physical Therapy Korea
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    • v.20 no.3
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    • pp.54-61
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    • 2013
  • This study was to determine the reliability and validity of manual measurements of patellar height to standard radiographic measurements in 30 knees of 15 subjects. Patellar height was measured using manual and radiographic methods. The manual measurements were performed by two examiners using digital vernier calipers with the subject sitting and the knees in $30^{\circ}$ of flexion. The radiographic measurements were performed in the same position. The reliability of the manual measurements was assessed by means of intraclass correlation coefficients [ICC(3,1)], and the validity was investigated using the Pearson's product-moment correlation coefficient and an independent t-test. The intra- and inter-rater reliabilities of the manual measurement of patellar height were excellent (ICC=.86 and .88 respectively). The validity of patellar height measured manually compared to the radiographic method was good (Pearson's r=.69). In conclusion, the manual method is an objective, qualitative measurement of patella height.

Validity, Reliability and Efficiency of Pain Self-report Scale in Elderly with Dementia (치매노인의 통증사정에 대한 자가보고 도구의 타당도, 신뢰도 및 효율성 검증)

  • Ryoo, Eon-Na;Park, Kyung-Sook
    • Korean Journal of Adult Nursing
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    • v.23 no.2
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    • pp.111-122
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    • 2011
  • Purpose: The aim on this study was to establish the validity, reliability and efficiency of a Pain Self-Report Scale for elderly with dementia and compare these results with an observational pain rating scale. Methods: Study subjects were 136 elderly with dementia who were residents in a nursing home, geriatric hospital, or day care center. The subject's pain was measured by five self-report scales and observational scale. DS-DAT (discomfort scale-dementia of the Alzheimer's type) was used for pain behavior observational measure. Cognitive state was assessed using the MMSE (Mini-Mental State Examination). Results: Observational rating correlated moderately with self-report (r=.225~.585, p<.05) and tended to underestimate pain intensity. Test-retest reliability was high for all five self-report scales, and the correlation between these scales was very strong (r=.735~.856, p<.05). Comprehension rate of VDS (verbal descriptor scale) was 88.3%, and NRS (numeric rating scale) 69.9%, FPS (face pain scale) 66.9%, HVAS (horizontal visual analog scale) and VVAS (vertical visual analog scale) 65.4%. Conclusion: Nurses should not apply observational scales routinely in demented patients as many of these are capable of reporting their own pain. Self-report, the highest standard of pain measurement can be reliably performed in a large proportion of demented elderly.

The Validity and Reliability of the Korean Version of the General Health Questionnaire : KGHQ-20 & KGHQ-30 (한국판 일반정신건강척도(KGHQ)의 개발에 관한 연구 I : KGHQ-20과 KGHQ-30을 중심으로)

  • Shin, Sun-In
    • Korean Journal of Social Welfare
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    • v.46
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    • pp.210-235
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    • 2001
  • This study purposed to standardize the Korean versions of the General Health Questionnaire, especially KGHQ-20 and KGHQ-30, through the evaluation of their reliability and validity. The two KGHQs, along with several other scales that measure psychological symptoms, were administered to 916 students and 102 chronically mentally ill patients at mental health hospitals in Korea. Both of the KGHQs were found to have high reliability based on test-retest correlation coefficients, internal consistency (Chronbach's ${\alpha}$) as scales, and item-total correlations for most of the items. The two KGHQ scores were shown to have high validity based on three methods of analysis; first, both KGHQ scores had highly significant correlations with most of other measures for psychopathology, such as SCL-90, CES-D, SDS, BAI, STAI; second, there were significant differences of the two KGHQ scores between the group of mentally healthy students and the group of chronically mentally ill patients; the validity of the KGHQ-30 was also derived from high sensitivity and specificity, which helped identify the best cut-off points: 15/16 for the KGHQ-30. The cut-off point for the KGHQ-20 was determined at 12/13 based on the mean scores and standard deviations of other scales as well as of the KGHQ-20.

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