• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.4
• /
• pp.65-70
• /
• 2008

The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.43-49
• /
• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.25-29
• /
• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.37-42
• /
• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.