• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.483-488
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• 2006

Etching process of PMMA (Polymethyl Methacrylate) on glass surface was investigated by dry etching technique using remote plasma. To determine the etching characteristics, the remote plasma etching was conducted for various process parameters such as plasma power, reaction gas and distance from plasma generation. As the distance from the plasma generation was increased, the etch rate of PMMA was linearly decreased by radical density in plasma. PMMA has removed by reactive radicals in the plasma. The etch rate increased with plasma power because of more reactive radicals. The etch rate and surface roughness of PMMA increased with $O_2$ concentration in the etchant.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.25-28
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• 2001

In this paper, we have investigated the effects of gas flow rate, rf power, process pressure and Ar addition on reactive ion etching of InP, InGaAs and InAlAs using Sic14 and Cl$_2$ gases. The etch rates were measured by using a surface profiler. The etched profiles, sidewall roughness, and surface morphology were observed by scanning electron microscopy and by atomic force microscopy. The selective etching of InGaAs to InP and InAlAs was studied by varying the etching parameters. It was found that Cl$_2$ gas is more efficient for the selective etching of InGaAs to InAlAs than SiCl$_4$ gas. The etch selectivity of InGaAs to InAlAs is strongly dependent on the rf power and the process pressure.

• Journal of the Korean Ceramic Society
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• v.32 no.8
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• pp.950-956
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• 1995

Y2O3 thin films were deposited by reactive sputtering of Y target in Ar and O2 gas mixture. Residual stress was measrued by sin2$\psi$ method of x-ray diffraction (XRD) and growth orientation was examined by measuring the relative intensity of (400) plane and (222) plane of Y2O3 films. In the case that Y2O3 films were deposited at 40$0^{\circ}C$ and at low working pressure below 0.05 torr the film had large compressive stress and (111) plane orientation. At working pressure of about 0.10 torr the film had small compressive stress and (100) orientation. Above working pressure of 0.20 torr, the films had nearly zero stress and random orientation. In the case that the (111) oriented film deposited at low working pressure below 0.05 torr, as substrate temperature decreased, (111) orientation increased. In the case the film, with (100) orientation, deposited at working pressure of about 0.10 torr, (100) orientation increased with decresing substrate temperature. These relationship of residual stress and growth orientation can be explained by the relationship of surface energy and strain energy.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.829-833
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• 1996

Superconducting YBaCuO thin films were deposited on MgO (100) single crystal substrate by rf reactive sputtering method. Sputtering target was prepared by mixing the original powders of $Y_2O_3$, $BaCO_3$, and CuO at $830^{\circ}C$, and its composition was $YBa_2Cu_{3.3}O_x$ adding the excess CuO to compensate for the loss of Cu in the deposition process. The sputtering conditions for a high quality of YBCO thin film were: substrate temperature of 13$0^{\circ}C$; gas pressure of 10 mTorr; gas mixture ($O_2$: Ar =10: 90); distance of 2.5 inch; and rf power density of 4.87 W /$\textrm{cm}^2$. The deposition rate was 2.4~2.6 nm/min. From the RBS results, it was found that Cu and Ba contents in thin films decreased with the increase of substrate temperature. The increase of gas pressure resulted in significant deficiency of Ba elements.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.02a
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• pp.102-102
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• 1996

This paper represents a new type low power High Frequency technological ion source (HF TIS) for ion - beam processing: the surface modification of materials, cleaning of surface, sputtering, coating of thin films, and polishing. The operational principle of HF TIS is based on the excitation of electrostatic waves in plasma located in the external magnetic field. Low power HF TIS with diameter 92 rom gives the opportunity to obtain beams of inert and chemically reactive gases with currents range from 5 to 150 mA (current density $0.015\;~\;3.5\;mA/\textrm{m}^2$) and ion beam energy 100 ~ 2500 eV at a HF power level 10 ~ 150 W. Three grid concave type ion optical system (IOS) is used for extraction and formation ofion beam.n beam.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.7-11
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• 2012

Plasma electrolytic oxidation of magnesium alloys is a well known technique to produce corrosion and wear resistant coatings. The addition of particles to the electrolyte provides a possibility to produce coatings with an increasing range of composition by in-situ incorporation of those particles into the coating. An extensive literature review has revealed that the mode of incorporation depends mainly on the melting point of the used particles and the energy provided by the discharges of the PEO process. The spectrum ranges from inert to partly reactive incorporation, but a complete reactive incorporation and a formation of a new single phase coating was not observed so far. Thus a new approach in PEO processing is introduced using specific particles as a kind of sintering additive, changing not only the composition but lowering the melting temperature and increase the liquid phase fraction during the discharges, resulting in a new amorphous coating.

• Journal of the Korean institute of surface engineering
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• v.24 no.3
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• pp.119-124
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• 1991

Recently, the trend of research in hard coating is concentrate on developing the process of ionization rate under low operating pressure, to get the thin film with high adhesion and dense microstructures. In this study ionization rate enhancement type PVD process using permanent magnet is developed, which enhances the ionization rate by confining the plasma suppressing the wall loss of electron. By the result to investigate the characteristic of glow discharge, the ionization rate of this process is enhanced about twice as high as that of triod BARE process (about 26%), and more dense TiN microstructures are obtained in this process. Cylindrical ion energy analyzer is made and attached in front of a quadrupole mass filter for the analysis of the energy distribution of reactive gas and activated gas ions from the plasma zone. To analyze the operation mechanism of ion energy analyzer, computer simulation is performed by calculation the electric field environment using finite element method. By these analyses of ion energy distribution of outcoming ions from the plasma zone, it is found that magnetic field enhances ion kinetic energy as well as ionization rate. The other results of this study is that the foundation of feed-back system is constructed, which automatically control the partial pressure of reactive gas. In can be possible by recording the data of mass spectrum and ion energy analysis using A-D converter.

• Journal of the Korean institute of surface engineering
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• v.40 no.6
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• pp.245-249
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• 2007

Amorphous IZO films were deposited on PET substrate by DC magnetron sputtering without substrate heating. In order to investigate effect of reactive gas addition on film properties, 0.2-0.4% of $H_2$ or $O_2$ gas was introduced during the deposition. Deposited IZO films were evaluated with mechanical property, electrical property, and water permeability. In the case of $H_2$ gas addition, mechanical property showed clear degradation compared to $O_2$ gas. In the case of $O_2$ gas, water permeability of the IZO film was increased compared to $H_2$ gas which could be attributed to the low adhesion of the film caused by bombardment of high energy negative oxygen ion. As a result, it is confirmed that water permeability of the film could be strongly affected by adhesion of the film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.367-367
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• 2008

Aluminum nitride (AlN) thin films have been deposited on Si substrate by using reactive RF magnetron sputtering method in a gas mixture of Ar and $N_2$ at different $N_2$ concentration. It was found that $N_2$ concentration was varied in the range up to 20-100%, highly c-axis oriented film can be obtained at 50% $N_2$ with full width at half maximum (FWHM) $4.5^{\circ}$. Decrease in surface roughness from 7.5 nm to 4.6 nm found to be associated with decrease in grain size, with $N_2$ concentration; however, the AlN film fabricated at 20% $N_2$ exhibited a granular type of structure with non-uniform grains. The absorption peak was observed around 675 $cm^{-1}$ in fourier transform infrared spectroscopy (FTIR). It is concluded that the AlN film deposited at $N_2$ concentration of 50% exhibited the most desirable properties for the application of high-frequency surface acoustic devices.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.525-531
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• 1996

(Ti1-xAlx)N films were deposited on high speed steel and silicon substrates by reactive sputtering in mixed $Ar-N_2$ discharges. Crystalline phases and microhardness of ($Ti_1_xAl_x$)N films were investigated with variation of the film composition and substrate RF bias voltage. With Al content x of about 0.6, crystalline phase of ( $Ti_1_xAl_x$N films was changed from single-phase NaCl structure to two phase mixture of NaCl and wurtzite structures: Microhardness of ($Ti_1_xAl_x$)N films was largely improved by applying RF bias voltage above 50 V during deposition. Hardness of ($Ti_1_xAl_x$)N films reached a maximum value for Al content x of about 0.4, and 1900 kg/$mm^2$ was obtained for 1$\mu m$-thick ($Ti_{0.6}Al_{0.4}$)N films.