• Applied Science and Convergence Technology
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• 제24권4호
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• pp.96-101
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• 2015

Quantitative evaluation of photocatalytic activity of oxide nanoparticles in aqueous solution is quite challenging in that the kinetic reaction rate is determined by a complicated interplay among various limiting factors such as light scattering and absorption, diffusion and adsorption of reactants in condensed liquid phase, photoexcited charge separation and recombination rate, and the exact nature of active sites determined by detailed morphology and crystallinity of nanocrystals. Here, we present our simple experimental results showing that the kinetic regime of a typical photocatalytic degradation experiment over UV-irradiated $TiO_2$ nanoparticles in aqueous solution is in that dominated by the photoactivity of $TiO_2$ and its concentration. This result lays a firm ground of using the measured kinetic reaction rate in evaluating photocatalytic efficiency of oxide nanocrystals under evaluation.

• 대한수학회보
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• 제50권6호
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• pp.1765-1780
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• 2013

This paper deals with some types of semilinear parabolic systems with localized or nonlocal sources and nonlocal boundary conditions. The authors first derive some global existence and blow-up criteria. And then, for blow-up solutions, they study the global blow-up property as well as the precise blow-up rate estimates, which has been seldom studied until now.

• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.27-32
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• 2014

The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.39-43
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• 2005

In the study, in order to deposit TaN thin film for diffusion barrier and bottom electrode we made the Plasma Assisted ALD equipment and confirmed the electrical characteristics of TaN thin films grown PAALD method. Plasma Assisted ALD equipment depositing TaN thin film using PEMAT(pentakis(ethylmethlyamino) tantalum) precursor and NH3 reaction gas is shown that TaN thin film deposited high density and amorphous phase with XRD measurement. The degree of diffusion and reaction taking place in Cu/TaN (deposited using 150W PAALD)/$SiO_{2}$/Si systems with increasing annealing temperature was estimated for MOS capacitor property and the $SiO_{2}$, (600${\AA}$)/Si system surface analysis by C-V measurement and secondary ion material spectrometer (SIMS) after Cu/TaN/$SiO_{2}$ (400 ${\AA}$) layer etching. TaN thin film deposited PAALD method diffusion barrier have a good diffusion barrier property up to 500$^{\circ}C$.

• Korea-Australia Rheology Journal
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• 제14권2호
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• pp.63-70
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• 2002

Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of Welding and Joining
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• 제21권2호
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• pp.35-41
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• 2003

Sintered alumina ceramics were joined by 2 kinds of SiO$_2$-CaO-A1$_2$O$_3$ glass solders having a similar expansivity as alumina. Wetting of glass/alumina was examined by sessile drop method. The observation of interface and bending strength related to alumina/glass/alumina systems were investigated by means of SEM/EDX and 4-point bending test. the result are summarized as follow: (1) Wetting of glass solders on alumina was good at temperatures higher than 145$0^{\circ}C$. (2) When the joining temperature wan high, diffusion and/or reactions between solder md alumina took place at the interface. These diffusions and reactions occurring at the interface greatly affected the bending strength of joining body. (3) Highest strength corresponding to 80% that of alumina was obtained by the solder of 35SiO$_2$-35CaO-30A1$_2$O$_3$(wt%) glass.

• 상하수도학회지
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• 제12권4호
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• pp.59-69
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• 1998

Biological treatment systems generally can be divided into two main classes of a suspended sludge process and attached one like a fluidized bed reactor. These process are considered to bring remarkable change in species composition of microorganisms, due to difference of a state of biofilm, a concentration and diffusion velocity of dissolved oxygen, a concentration and diffusion velocity of substance or poisonous matter. The change of species composition bring different treatment result for influence factors like F/M ratio, DO concentration, pH or poisonous matter. This study is to investigate the reaction characteristics of both microorganisms, namely, a suspended sludge and attached sludge, through the changes of pH, temperature and substance concentration.

• 대한기계학회논문집B
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• 제28권3호
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• pp.359-364
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• 2004

For the development of high efficiency and low emission combustion systems, high temperature air combustion technology has been tested by utilizing preheated air over 1100 K and exhaust gas recirculation. In this system, combustion air is diluted with large amount of recirculated exhaust gases, such that the oxygen concentration is relatively low in the reaction zone, leading to low flame temperature. Since, the temperature fluctuations and sound emissions from the flame are small and flame luminosity is low, the combustion mode is expected to be flameless or mild combustion. Experiment was performed to investigate the turbulent flame structure and NO$_x$ emission characteristics in the high temperature air combustion focused on coflowing jet diffusion flames which has a fundamental structure of many practical combustion systems. The effect of turbulence has also been evaluated by installing perforated plate in the oxidizer inlet nozzle. LPG was used as a fuel. Results showed that even though NO$_x$ emission is sensitive to the combustion air temperature, the present high temperature air combustion system produce low NO$_x$ emission because it is operated in low oxygen concentration condition by the high exhaust gas recirculation.