• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.58-62
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• 2017

In this paper, we studied the structural design for safety improvement of the winch mount of the armored recovery vehicle. From the finite element analysis using the safety factor of the original winch mount, the results determined that the safety factor was very low, namely 1.14 at $-15^{\circ}$ when towing the maximum force. For considering the usage and safety, the safety factor needs to increase to between 1.4 and 1.6. To improve the safety factor, a re-design, such as shape modification and strengthening the welded zone, was performed. After the improvement of the structural design, the safety factor of the improved mount was calculated at 1.78, an increase of about 56.1% from that of the original mount.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.94-97
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• 2015

In this study, we introduce a yellowing phenomenon in silver nanowire laser patterning and attempt to understand the cause of this phenomenon. Silver nanowire is a promising alternative to indium tin oxide as a transparent electrode owing to its flexibility. Additionally, silver nanowire can be easily patterned by laser ablation, which is free of dangerous chemicals. However, a yellowish color change reducing visibility is observed on the patterned area of the silver nanowires, and this yellowing phenomenon prevents the use of silver nanowire as a transparent electrode material. We concluded that resolidified debris of melted and evaporated silver nanowires after laser ablation causes the color change of the electrode. Further research is needed to determine a means of mitigating this yellowing phenomenon.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.97-103
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• 2017

The objective of this study is to develop and commercialize an on-board fuel storage system for CNG vehicles. A type 4 vessel is made of resin-impregnated continuous filament windings on a polyamide (PA6) liner. In particular, this study localized the PA6 liner's fabrication and development. To analyze the filament winding, a specimen test was performed, and the results were verified values obtained using finite element analysis. In this study, the filament winding and fibers were optimized for a 207 bar composite cylinder in a compressed natural gas vehicle.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.101-107
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• 2006

Cold gas dynamic spray or cold spray is a novel manufacturing method for coatings. Cold spray is a high rate and direct material deposition process that utilizes the kinetic energy of particles sprayed at high velocity (300-1,200m/s). In this research, a technique to repair the damaged mold by cold spray deposition and mechanical machining was proposed. An aluminum 6061 mold with three-dimensional surface was fabricated, intentionally damaged and material-added by cold spray, and its original geometry was re-obtained successfully by Computer Numerical Control (CNC) machining. To investigate deformation of material caused by cold spray, deposition was conducted on thin aluminum plates ($100mm{\times}100mm{\times}3mm$). The average deformation of the plates was $205{\sim}290{\mu}m$ by Coordinate Measurement Machine (CMM). In addition, the cross section of deposited layer was analyzed by scanning electron microscopy (SEM). To compare variation of hardness, Vickers hardness was measured by micro-hardness tester.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.11
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• pp.3048-3053
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• 2009

Because of operating environment, the intake system of the small engine needs a serious design consideration. To capture oil particles from the blow-by gas, a grid of the intake system had been applied, but it has very low capturing efficiency and high manufacturing cost. To improve system performance, a new intake system has been developed using computational technique. The grid has been removed and the location of the blow-by hall has been re-designed. Total efficiency capturing oil particles has been improved about 5 times compared with that of previous model with the grid. By removing the grid, approximately 10% of the total manufacturing cast has been reduced.

• Korean Journal of Computational Design and Engineering
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• v.19 no.3
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• pp.214-223
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• 2014

This paper presents a bottleneck detection framework using simulation approach in a wafer FAB (Fabrication). In a semiconductor manufacturing industry, wafer FAB facility contains various equipment and dozens kinds of wafer products. The wafer FAB has many characteristics, such as re-entrant processing flow, batch tools. The performance of a complex manufacturing system (i.e. semiconductor wafer FAB) is mainly decided by a bottleneck. This paper defines the problem of a bottleneck process and propose a simulation based framework for bottleneck detection. The bottleneck is not the viewpoint of a machine, but the viewpoint of a step with the highest WIP in its upstream buffer and severe fluctuation. In this paper, focus on the classification of bottleneck steps and then verify the steps are not in a starvation state in last, regardless of dispatching rules. By the proposed framework of this paper, the performance of a wafer FAB is improved in on-time delivery and the mean of minimum of cycle time.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.6
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• pp.195-200
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• 2012

In this study, parameters and requirements of an 120kW class monorail planetary gearbox was analysed and the adaptive planetary gearbox design was selected. The specification of the sun gear, planetary gear and carrier was set and the profile & lead was optimized. The mechanical efficiency of the optimized one and the original one was observed. Dynamo-tester system was used to observe the mechanical efficiency of the planetary gearbox. A dynamo unit was connected with the planetary gearbox which straightened through the motor by a coupling. The standard tooth shape planetary gearbox and modified tooth shape planetary gearbox were used as test pieces and the rotation speed was set from 600 to 6000rpm with 600rpm, 2.5min one step. In order to check the mechanical efficiency of the planetary gearbox, the tests were done as follows. 1) The power loss between driving motor and dynamo tester. 2) Temperature variation by different rotation speeds. 3) Noise variation by different rotation speeds.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.4
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• pp.511-520
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• 2010

In general, spot welding is used at no welding rod or flux for the process, low welding point temperature compared to arc welding, short heating time, less damage to the parent material, and low deformation and residual stress, relatively. Also, because of the pressurization effect, better mechanical qualities of the welding parts are obtained. Therefore, in various fields of industry its rapid operation speed can make mass production possible such as motor industry. In FEM analysis for the spot welding process, it is effective to use simple modeling rather than complicated one because of its numerous number of spots and reduction of analysis time. Therefore, this study provides with not only simplification of modeling analysis by using beam component composition of structure without re-compositing the spot welding point mesh but also modeling analysis of which property of fracture strength is reflected. In addition complete spot welding model is examined at rectangular post shape (hat shape) by impact test, compared the results, and verified its validity. As a result, it is possible to optimize the welding position and to recognize the strength of structure and the proposed equal distance model shows the effect of welding point reduction and improvement of stiffness.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.15.2-15.2
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• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.