• 대한전자공학회논문지
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• 제23권6호
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• pp.789-794
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• 1986

포화속도 모델을 이용하여 이온주입공정에 의한 GaAs MESFET를 설계하였다. 20KeV의 $Si^+$ 이온 주입공정과 $975^{\circ}C$ 5sec의 RTP 활성화공정에 의해 $V_{th}$가 -0.5V 일때의 gm이 460ms/mm인 MESFET를 설계할 수 있었다.

• 대한기계학회논문집A
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• 제34권5호
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• pp.575-582
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• 2010

최근 박육사출성형이나 마이크로 사출성형에서의 성형성을 높이기 위해 급속 금형가열 기술이 사용되고 있다. 고주파 유도가열은 전자기 유도현상을 이용하여 금형 표면만을 효율적으로 가열할 수 있어 급속 금형가열 기술로서 활용되고 있다. 본 연구에서는 고주파 유도가열 적용 사출성형 과정의 수치적 모사를 위해 전자기장 해석, 열전달 해석, 사출성형 유동해석을 연계한 통합적 전산모사 기법에 관한 연구를 수행하였다. 본 연구에서 제안된 통합적 전산모사 기법을 유도가열 적용 박육 사출성형의 해석에 적용하여 실험결과와 비교하였고, 특히 금형온도 경계조건의 부여방식에 따른 해석의 신뢰성에 대한 고찰이 이루어졌다.

• Applied Science and Convergence Technology
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• 제26권5호
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• pp.110-113
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• 2017

The two-dimensional layered $MoS_2$ has high mobility and excellent optical properties, and there has been much research on the methods for using this for next generation electronics. $MoS_2$ is similar to graphene in that there is comparatively weak bonding through Van der Waals covalent bonding in the substrate-$MoS_2$ and $MoS_2-MoS_2$ heteromaterial as well in the layer-by-layer structure. So, on the monatomic level, $MoS_2$ can easily be exfoliated physically or chemically. During the $MoS_2$ field-effect transistor fabrication process of photolithography, when using water, the water infiltrates into the substrate-$MoS_2$ gap, and leads to the problem of a rapid decline in the material's yield. To solve this problem, an epoxy-based, as opposed to a water-based photoresist, was used in the photolithography process. In this research, a hydrophobic $MoS_2$ field effect transistor (FET) was fabricated on a hydrophilic $SiO_2$ substrate via chemical vapor deposition CVD. To solve the problem of $MoS_2$ exfoliation that occurs in water-based photolithography, a PPMA sacrificial layer and SU-8 2002 were used, and a $MoS_2$ film FET was successfully created. To minimize Ohmic contact resistance, rapid thermal annealing was used, and then electronic properties were measured.

• 한국재료학회지
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• 제23권7호
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• pp.379-384
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• 2013

In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

• 한국분말재료학회지
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• 제1권1호
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• pp.72-78
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• 1994

Two kinds of $U_3Si$ powders and $U_3Si$ dispersed nuclear fuel meats have been prepared by conventional comminution process and a newly developed rotating disk atomization process. In contrast to angular shape and broad size distribution of the conventionally processed powder, the atomized powder was spherical and showed narrow size distribution. For the atomized powder, the heat treatment time for the formation of $U_3Si$ by a peritectoid reaction was reduced to about one tenth, thanks to microstructure refinement by rapid cooling of about 5$\times$104 K/s. The extruding pressure of atomized $U_3Si$ powder and Al powder mixture was lower than that of comminuted $U_3Si$ and Al powder mixture. The elongation of the atomization processed fuel meats was much higher than that of the comminution processed fuel meats and remained over 10% up to 80wt.% of $U_3Si$ powder fraction in the fuel meats. It appears therefore that the loading density of $U_3Si$ in fuel meat can be increased by using atomized $U_3Si$ powder. The atomized spherical particles were randomly distributed, while the comminuted particles with angular and longish shape were considerably aligned along the extrusion direction. Along the transverse direction of the extraction the electrical conductivity of the atomization processed fuel meats was appreciably higher than that of comminution processed fuel meats. This tendency became pronounced as $U_3Si$ content increased. Because the thermal conduction which is believed to be proportioned to the electrical conduction in the nuclear fuel meats occurs in radial direction, the atomization processed fuel can be better used in research reactors where high thermal conductivity is required.

• 방사성폐기물학회지
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• 제7권2호
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• pp.73-78
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• 2009

사용후핵연료 파이로프로세싱의 전해환원 공정에서 발생하는 LiCl 염폐기물내 Cs과 Sr의 방사능 붕괴열을 계산하였다. 계산시 대부분의 LiCl염폐기물을 재생하여 재활용하고 나머지를 고화체로 만든다고 가정하였다. 계산결과 Cs 및 Sr의 붕괴로 생성되는 자핵종인 Ba와 Y에 의한 열발생량이 모핵종에 비해 최대 4.6배 더 많았다. LiCl염폐기물내 Cs 및 Sr에 의한 열발생은 초기 한달 정도에 최대이므로 일정 기간 초기 LiCl염폐기물의 온도 급상승을 제어할 냉각설비의 운영이 바람직할 것으로 보인다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.35-35
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• 2009

Capacitorless one transistor dynamic random access memory (1T-DRAM) cells were fabricated on the fully depleted strained-silicon-on-insulator (FD sSOI) and the effects of silicon back interface state on buried oxide (BOX) layer on the memory properties were evaluated. As a result, the fabricated 1T-DRAM cells showed superior electrical characteristics and a large sensing current margin (${\Delta}I_s$) between "1" state and "0" state. The back interface of SOI based capacitorless 1T-DRAM memory cell plays an important role on the memory performance. As the back interface properties were degraded by increase rapid thermal annealing (RTA) process, the performance of 1T-DRAM was also degraded. On the other hand, the properties of back interface and the performance of 1T-DRAM were considerably improved by post RTA annealing process at $450^{\circ}C$ for 30 min in a 2% $H_2/N_2$ ambient.

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 1993년도 Proceedings of International Conference for Agricultural Machinery and Process Engineering
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• pp.1222-1229
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• 1993

An advanced design environment , which is based on adaptive and knowledge -based finite elements (INTELMESH), has been developed. Unlike other approaches, INTEMMESH incorporates the information about the object geometry as well as the boundary and loading conditions to generate an ${\alpha}$-priori finite element mesh which is more refined around the critical regions of the problem domain. INTEMMESH is designed for planar domains and axisymmetric 3-D structures of elasticity and heat transfer subjected to mechanical and thermal loading . It intelligently identifies the critical regions/points in the problem domain and utilize the new concepts of substructuring and wave propagation to choose the proper mesh size for them. INTEMMESH generates well-shaped triangular elements by applying trangulartion and Laplacian smoothing procedures. The adaptive analysis involves the intial finite elements analyze and an efficient ${\alpha}$-posteriori error analysis involves the initial finite element anal sis and an efficient ${\alpha}$-posteriori error analysis and estimation . Once a problem is defined , the system automatically builds a finite element model and analyzes the problem though automatic iterative process until the error reaches a desired level. It has been shown that the proposed approach which initiates the process with an ${\alpha}$-priori, and near optimum mesh of the object , converges to the desired accuracy in less time and at less cost. Such an advanced design/analysis environment will provide the capability for rapid product development and reducing the design cycle time and cost.

• Journal of Welding and Joining
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• 제21권5호
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• pp.525-533
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• 2003

The dimensional accuracy and global roughness between successive layers of VLM-s, which is a new rapid prototyping process using hotwire cutter and EPS foam, depend significantly on the operating parameters of hotwire cutter. In the present study, the effect of cutting angle on the kerf width and edge shape in hotwire cutting of EPS foam for the case of single-sloped cutting with one cutting angle was investigated. Through single-sloped cutting tests, the modified relationship between kerf width and effective heat input, considering the effect of the cutting angle, and the relationship between the melted area and the cutting angle were obtained. In order to investigate the effect of cutting angles on the thermal field in EPS foam, transient heat transfer analyses using single-sloped volumetric heat flux model and locally-conformed mesh were performed. Through the comparison between experimental and numerical results, it was shown that the proposed analysis model is needed to estimate the three-dimensional temperature distribution of the EPS foam for the case of single-sloped hotwire cutting.

• 한국정밀공학회지
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• 제32권2호
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• pp.167-172
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• 2015

In order to prevent crack in thick weld zones, the preheating process such as induction and gas torch heating needs to be applied. Among them induction heating is the most effective heat source because it has rare thermal effect and very rapid heating characteristics. In this paper, when the induction heating method is used to improve arc welding, the temperature distribution and magnetic field density of the welding zones are analyzed by simultaneously solving heat transfer and electromagnetic field equation. In particular, cone and flat type coils are designed and induction heating effects of each type are compared to identify heating characteristics on a V-groove weld joint. As a result, a cone shape coil is more efficient in the preheating process. When induction heating and arc welding system is designed for thick plate with V-groove weld joint, the results in this paper could be applied.