• Title/Summary/Keyword: RF design

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Fabrication of High-Frequency Packages for K-Band CMOS FMCW Radar Chips Using RF Via Structures (RF 비아 구조를 이용한 K-대역 CMOS FMCW 레이더 칩용 고주파 패키지의 제작)

  • Shin, Im-Hyu;Park, Yong-Min;Kim, Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.23 no.11
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    • pp.1228-1238
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    • 2012
  • In this paper, we design, fabricate and measure two kinds of high-frequency packages for K-band CMOS FMCW radar chips using RF via structures. The packages are fabricated with the conventional PCB process and LTCC process. The design centering of the packages is performed at 24 GHz and impedance variation caused by the wire bonding and RF via structure is fully evaluated using 3D electromagnetic simulation. The RF via structure with characteristic impedance of $50{\Omega}$ is used to reduce impedance mismatch loss. Two kinds of test packages with back-to-back connected RF paths are fabricated and measured for the design verification of the PCB-based package and LTCC package. Their measured results show an insertion loss of less than 0.4 dB at 24 GHz and less than 0.5 dB for 20~29 GHz. The measured return loss is less than -13 dB for the PCB-based package and less than -15 dB for the LTCC package in the frequency band, but the return loss of the package itself is predicted to be better than that of the test package by about 5 dB, because the ripples of the back-to-back connection typically degrade the return loss by 5 dB or more.

System Level Design of CDMA RF Receivers Using the Receiver Noise Equation

  • Kim, Ji-Hoon;Lee, Han-Dug;Yoo, Hyung-Joun
    • Proceedings of the IEEK Conference
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    • 2002.07a
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    • pp.329-332
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    • 2002
  • In this paper a common design method fur RF receivers of different CDMA standards is introduced. The method adopted a new equation, receiver noise equation, for the analysis of each standard. The test conditions for RF receivers in four different CDMA standards, CDMA cellular, PCS, WCDMA, and cdma2000 are analyzed based on the receiver noise equation. With the result of the analysis, the specifications fer RF receivers of different CDMA standards are derived.

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A DS-QPSK Chip Design and Fabrication for Home RF Wireless Sensors (홈 RF 무선 센서를 위한 DS-QPSK 모듈의 설계 및 칩 제작)

  • Lee Young-Dong;Lee Won-Ki;Jun Soo-Hyun;Chung Wan-Young
    • Proceedings of the IEEK Conference
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    • 2004.06b
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    • pp.411-414
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    • 2004
  • This paper introduces a modulation method for digital wireless communication based on general DS-QPSK. The design and fabrication is for home networking application to a typical RF transmitter with DS-QPSK modulator. This modulator implemented using VHDL hardware programming language, the fabrication of IC chip $5{\times}5 mm^2$ was carried by 27th IDEC MPW(Multi Project Wafer) process in 0.35${\mu}m$ rule at Samsung Inc. This paper presented the important of this technology for the future application in wireless sensor. This module can be efficient usage for home network to transmit the RF wireless sensor system.

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Measurement and Explanation of DC/RF Power Loci of an Active Patch Antenna

  • Mcewan, Neil J.;Ali, Nazar T.;Mezher, Kahtan A.;El-Khazmi, Elmahdi A.;Abd-Alhameed, Raed A.
    • ETRI Journal
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    • v.33 no.1
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    • pp.6-12
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    • 2011
  • A case study of an active transmitting patch antenna revealed a characteristic loop locus of DC power versus RF output power as drive frequency was varied, with an operational bandwidth substantially smaller than the impedance bandwidth of the radiator. An approximate simulation technique, based on separation of the output capacitance of the power transistor, yielded easily visualized plots of power dependence on internal load impedance, and a simple interpretation of the experimental results in terms of a near-resonance condition between the output capacitance and output packaging inductance.

Design of RF Power Detector Module with Switch for W-CDMA Optic Repeater (스위치를 이용한 W-CDMA 광중계기용 RF 전력 검출기 모듈의 설계)

  • Lee, Yun-Bok;Cho, Jung-Yong;Shin, Kyung-Sub;Lee, Yong-An;Lee, Hong-Min
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2003.11a
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    • pp.389-393
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    • 2003
  • This paper describes the design of enhanced TSSI RF Power Detector which has wide dynamic range using switch and Log amp. This Power Detector consists of low and high gain loops, and they adaptively switched by output DC voltage which is proportioned to input power level. Because Power Detector needs to separate the channel, so architecture is heterodyne system having 70MHz intermediate frequency. This proposed RF Power Detector is settle to the satisfaction of Closed loop power control system for W-CDMA optic repeater, and the obtained dynamic range cover the higher than 50dB.

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960MHz band multi-layer VCO design (960MHz 대역 다층구조 VCO 설계)

  • Rhie, Dong-Hee;Jung, Jin-Hwee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.410-413
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    • 2001
  • In this paper, we present results of this that design of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonation circuit and the oscillation circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for acquiring EM(Electromagnetic) characteristics of conductor pattern as well as designing multi-layer VCO, Acquired EM characteristics of the circuit pattern was used like real components at nonlinear RF circuit simulator. Finally VCO is simulated at nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont #9599, which is applied for L TCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 1[dBm], the phase noise was 102 [dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of l0[mA]

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A Design of Low Noise RF Front-End by Improvement Q-factor of On-Chip Spiral Inductor (On-Chip 나선형 인덕터의 품질계수 향상을 통한 저잡음 RF 전치부 설계)

  • Ko, Jae-Hyeong;Jung, Hyo-Bin;Choi, Jin-Kyu;Kim, Hyeong-Seok
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.2
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    • pp.363-368
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    • 2009
  • In the paper, we confirmed improvement Noise figure of the entire RF front-end using spiral inductor with PGS(Patterned Ground Shield) and current bleeding techniques. LNA design is to achieve simultaneous noise and input matching. Spiral inductor in input circuit of LNA inserted PGS for betterment of Q-factor. we modeling inductor using EM simulator, so compared with inductor of TSMC 0.18um. We designed and simulation the optimum structure of PGS using Taguchi's method. We confirmed enhancement of noise figure at LNA after substituted for inductor with PGS. Mixer designed using current bleeding techniques for reduced noise. We designed LNA using inductor with PGS and Mixer using current bleeding techniques, so confirmed improvement of noise figure.

960MHz band multi-layer VCO design (960MHz대역 다층구조 VCO 설계)

  • 이동희;정진휘
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.410-413
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    • 2001
  • In this paper, we present results of this that design of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonation circuit and the oscillation circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for acquiring EM(Electromagnetic) characteristics of conductor pattern as well as designing multi-layer VCO, Acquired EM characteristics of the circuit pattern was used like real components at nonlinear RF circuit simulator. Finally VCO is simulated at nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was Dupont #9599, which is applied for LTCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 1[dBm], the phase noise was 102 [dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of 10[mA].

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Testable Design of RF-ICs using BIST Technique (BIST 기법을 이용한 RF 집적회로의 테스트용이화 설계)

  • Kim, Yong;Lee, Jae-Min
    • Journal of Digital Contents Society
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    • v.13 no.4
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    • pp.491-500
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    • 2012
  • In this paper, a new loopback BIST structure which is effective to test RF transceiver chip and LNA(Low Noise Amplifier) in the chip is presented. Because the presented BIST structure uses a baseband processor in the chip as a tester while the system is under testing mode, the developed test technique has an advantage of performing test application and test evaluation in effectiveness. The presented BIST structure can change high frequency test output signals to a low frequency signals which can make the CUT(circuits under test) tested easily. By using this technique, the necessity of RF test equipment can be mostly reduced. The test time and test cost of RF circuits can be cut down by using proposed BIST structure, and finally the total chip manufacturing costs can be reduced.

Design of Ka-band Satellite Ground Station Antenna/RF System

  • Lee, Jeom-Hun;Lee, Seong-Pal;Oh, Seung-Hyeub
    • International Journal of Aeronautical and Space Sciences
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    • v.4 no.2
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    • pp.88-94
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    • 2003
  • This paper describes the design of the Ka-band Antenna/RF system, which was developed for the experiment of the high-speed satellite communications with geostationary satellite. The design issues described here are the ka-band characteristics for having an optimum performance. and the system characteristic for having a reliable and an extensional operation.