• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Proceedings of the IEEK Conference
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• 2002.06c
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• pp.165-168
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• 2002

This paper has been designed and implemented of web security system using RF card A security mechanism that was proposed in this paper provides web services on card reader reads RF card of user only. In this paper, user authentication and server authentication was provided by challenge/response mechanism. Also, this system was provides confidentiality of communication messages.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.8
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• pp.837-843
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• 2008

This paper proposes a power divider based on meta-material structure with dual-band operation. The meta-material structures of left-hand characteristic are constituted of series capacitors and shunt inductors, but they have parasitic series inductance and shunt capacitance effects. There is represented the composite right/ left-handed transmission line (CRLH-TL) model. When the power divider is implemented by using the CRLH-TL, the power divider can operate dual band. To verify the power divider with dual band, we are implemented to operate dual-band that is 0.88 GHz and 1.67 GHz. The characteristics of divider have the return loss less than each 21.0 dB and 15.8 dB and the insertion loss better than 3.83 dB and 3.64 dB at each frequency. Also, the output phase difference is $3{\sim}6^{\circ}$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.288-292
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• 2002

We propose the new type of on-chip ESD protection method for RF applications. By using the properties of RF circuits, we can use the short-circuited stub as ESD protection device in front of the DC blocking capacitor Specially, we can use short-circuited stub as the portion of the matching circuit so to reduce the and various parameters of the transmission line. This new type ESD protection method is very different from the conventional ESD protection method. With the new type ESD protection method, we remove the parasitic capacitance of ESD protection device which degrade the performance of core circuit.

• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.84-87
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• 2015

We have designed and fabricated two different RF-DC Converters called doubler for 5.8GHz Microwave Wireless Power Transmission. The doubler as RF-DC Converter makes the rectified voltage be doubled. We measured and compared voltages of the doublers with those of the previous full-wave rectifying RF-DC Converter. The doublers show rectified double voltages. However, the full-wave rectifying converter has a high efficiency due to the suppression of reflecting harmonics. The other fabricated doublers causes so many harmonics that they can't convert the low-power RF to the full DC. In this paper, we show that the different doublers doesn't double the rectifying voltages compared with those of the full-wave rectifying converter and give a reason about that.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2003.11a
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• pp.175-179
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• 2003

In this paper, we developed a DTV RF (Radio frequency) capture, analysis, and regeneration system adapting digital signal processing and high speed hard disk interfacing techniques and analyzed characteristics of captured RF signal. This system can be used in the various field of DTV transmission because this system can capture the receiving real DTV signals and analyze captured RF signals that contain the complex characteristics of the real-world RF environments and regenerate it in a laboratory without the performance degradation. The system can capture and replay the DTV RF signals in real-time on hard disk. Therefore, there is no limit for the amount of captured data with in the installed storage capacity. We can expect various possible applications for this system such as a tool for the development of the receiver performance analysis, design, and analysis for the DTV coverage areas, etc. This system can also be used as RF signal analyzer.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.540-543
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• 2003

This paper presents design and manufacture of RF type non-contact radiological dosage measuring device. It also concerns on the broad out-line and the ways of improvement about RF type non-contact radiation measuring device. Measuring radiological dosage with non-contact RF, the stability and efficiency of the measure have been improved by reforming constant current circuit. Furthermore, applying communication protocol in process makes it possible to achieve faster and more accurate communication than old circuit. On the base of those, RF type non-contact radiological dosage measuring device which consists of radiological dosage measuring module and Reader module has been designed and manufactured. While testing communication against embodied device, the possibility of the field application could be confirmed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.652-655
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• 2004

RF MEMS is a miniature device or an array of integration devices and mechanical components and fabricated with If batch-processing techniques. RF MEMS application area are in phased arrays and reconfigurable apertures for defence and telecommunication systems, switching network for satellite communication, and single-pole double throw switches for wireless application. Recently, RF MEMS switches have been developed for the application to the milimeter wave system. RF MEMS switches offer a substantilly higher performance than PM diode or FET switches. In this paper, SPDT(single-pole-double-throw) switch are designed to use 10 GHz. Actuation voltage and displacement are simulated by tool. And stress and distribution are simulated.

• Journal of Broadcast Engineering
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• v.21 no.5
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• pp.803-815
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• 2016

In this paper, we design a direct radio frequency (RF) sampling receiver for multiband GNSS signals and demonstrate its performance. The direct RF sampling is a technique that does not use an analog mixer, but samples the passband signal directly, and all receiver processes are done in digital domain, whereas the conventional intermediate frequency (IF) receiver samples the IF band signals. In contrast to the IF sampling receiver, the RF sampling receiver is less complex in hardware, reconfigurable, and simultaneously converts multiband signals to digital signals with an analog-to-digital (AD) converter. The reconfigurability and simultaneous reception are very important in military applications where rapid change to other system is needed when a system is jammed by an enemy. For simultaneous reception of multiband signals, the sampling frequency should be selected with caution by considering the carrier frequencies, bandwidths, desired intermediate frequencies, and guard bands. In this paper, we select a sampling frequency and design a direct RF sampling receiver to receive multiband global navigation satellite system (GNSS) signals such as GPS L1, GLONASS G1 and G2 signals. The receiver is implemented with a commercial AD converter and software. The receiver performance is demonstrated by receiving the real signals.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.11
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• pp.1228-1238
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• 2012

In this paper, we design, fabricate and measure two kinds of high-frequency packages for K-band CMOS FMCW radar chips using RF via structures. The packages are fabricated with the conventional PCB process and LTCC process. The design centering of the packages is performed at 24 GHz and impedance variation caused by the wire bonding and RF via structure is fully evaluated using 3D electromagnetic simulation. The RF via structure with characteristic impedance of $50{\Omega}$ is used to reduce impedance mismatch loss. Two kinds of test packages with back-to-back connected RF paths are fabricated and measured for the design verification of the PCB-based package and LTCC package. Their measured results show an insertion loss of less than 0.4 dB at 24 GHz and less than 0.5 dB for 20~29 GHz. The measured return loss is less than -13 dB for the PCB-based package and less than -15 dB for the LTCC package in the frequency band, but the return loss of the package itself is predicted to be better than that of the test package by about 5 dB, because the ripples of the back-to-back connection typically degrade the return loss by 5 dB or more.