• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.209-209
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• 2007

Passive Device는 RF Circuit을 제작할 때 많은 면적을 차지하고 있으며 이를 감소시키기 위해 여러 연구가 진행되고 있다. 최근 SoP-L 공정을 이용한 많은 연구가 진행되고 있는데 PCB 제작에 이용되는 일반적인 재료와 공정을 그대로 이용함으로써 개발 비용과 시간 면에서 많은 장점을 가지기 때문이다. SoP-L의 또 하나 장점은 다층구조를 만들기가 용이하다는 점이다. 각 층 간에는 Via를 사용하여 연결하게 되는데, RF Circuit은 회로의 구조와 물성에 따라 특성이 결정되며, 그만큼 Via를 썼을 때 그 영향을 생각해야 한다. 본 연구에서는 multi-layer LCP substrate에 다수의 Via를 chain 구조로 형성하여 전기적 특성을 확인하였다. Via가 70um 두께의 substrate를 관통하면서 상층과 하층의 Conductor을 연속적으로 연결하게 된다. 이 구조의 Resistance와 Insertion Loss를 측정하여, Via의 크기 별 수율과 평균적인 Resistance, RF 계측기로 재현성을 확인하였다. 이를 바탕으로 공정에서의 안정성을 확보하고 Via의 크기와 도금방법에 의한 RF Circuit에서의 영향을 파악하여, 앞으로의 RF Device 개발에 도움이 될 것으로 기대한다. 특히 유기물을 이용한 다층구조의 고주파 RF Circuit에 Via를 적용할 때의 영향을 설계에서부터 고려할 수 있는 자료가 될 것이다.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1972-1975
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• 2002

In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50 ${\Omega}$ matched coplanar waveguide(CPW) transmission line is employed as the test vehicle to evaluate the performances of the proposed package structure. The line is encapsulated with the LTCC packaging lid and connected to the via feed line. To reduce the insertion loss due to the packaging lid, the cavity with via post is formed in the packaging lid. The performances of the package structure is simulated with the different cavity depth and via-to-via length. Simulation results show that the proposed package structure has reflection loss better than 20 dB and insertion loss lower than 0.1 dB from DC to 30 GHz with the cavity depth and via-to-via length of 300 ${\mu}m$ and 350 ${\mu}m$, respectively. To realize the designed package structure, the cavity patterning is tested using the sandblast of LTCC.

• ETRI Journal
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• v.41 no.4
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• pp.536-548
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• 2019

In this study, an electronically steerable parasitic array radiator (ESPAR) antenna via analog radio frequency (RF) switches for a single RF chain MIMO system is presented. The proposed antenna elements are spaced at ${\lambda}/64$, and the antenna size is miniaturized via a dielectric radome. The optimum reactance load value is calculated via the beamforming load search algorithm. A switch simplifies the design and implementation of the reactance loads and does not require additional complex antenna matching circuits. The measured impedance bandwidth of the proposed ESPAR antenna is 1,500 MHz (1.75 GHz-3.25 GHz). The proposed antenna exhibits a beam pattern that is reconfigurable at 2.48 GHz due to changes in the reactance value, and the measured peak antenna gain is 4.8 dBi. The reception performance is measured by using a $4{\times}4$ BPSK signal. The measured average SNR is 17 dB when using the proposed ESPAR antenna as a transmitter, and the average SNR is 16.7 dB when using a four-conventional monopole antenna.

• Journal of Ginseng Research
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• v.43 no.2
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• pp.319-325
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• 2019

Background: Ginsenoside Rf is a ginseng saponin found only in Panax ginseng that affects lipid metabolism. It also has neuroprotective and antiinflammatory properties. We previously showed that Korean Red Ginseng (KRG) inhibited the expression of cyclooxygenase-2 (COX-2) by hypoxia via peroxisome proliferator-activated receptor gamma ($PPAR{\gamma}$). The aim of the current study was to evaluate the possibility of ginsenoside Rf as an active ingredient of KRG in the inhibition of hypoxia-induced COX-2 via $PPAR{\gamma}$. Methods: The effects of ginsenoside Rf on the upregulation of COX-2 by hypoxia and its antimigration effects were evaluated in A549 cells. Docking of ginsenoside Rf was performed with the $PPAR{\gamma}$ structure using Surflex-Dock in Sybyl-X 2.1.1. Results: $PPAR{\gamma}$ protein levels and peroxisome proliferator response element promoter activities were promoted by ginsenoside Rf. Inhibition of COX-2 expression by ginsenoside Rf was blocked by the $PPAR{\gamma}-specific$ inhibitor, T0070907. The $PPAR{\gamma}$ inhibitor also blocked the ability of ginsenoside Rf to suppress cell migration under hypoxia. The docking simulation results indicate that ginsenoside Rf binds to the active site of $PPAR{\gamma}$. Conclusions: Our results demonstrate that ginsenoside Rf inhibits hypoxia induced-COX-2 expression and cellular migration, which are dependent on $PPAR{\gamma}$ activation. These results suggest that ginsenoside Rf has an antiinflammatory effect under hypoxic conditions. Moreover, docking analysis of ginsenoside Rf into the active site of $PPAR{\gamma}$ suggests that the compound binds to $PPAR{\gamma}$ in a position similar to that of known agonists.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.11
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• pp.1228-1238
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• 2012

In this paper, we design, fabricate and measure two kinds of high-frequency packages for K-band CMOS FMCW radar chips using RF via structures. The packages are fabricated with the conventional PCB process and LTCC process. The design centering of the packages is performed at 24 GHz and impedance variation caused by the wire bonding and RF via structure is fully evaluated using 3D electromagnetic simulation. The RF via structure with characteristic impedance of $50{\Omega}$ is used to reduce impedance mismatch loss. Two kinds of test packages with back-to-back connected RF paths are fabricated and measured for the design verification of the PCB-based package and LTCC package. Their measured results show an insertion loss of less than 0.4 dB at 24 GHz and less than 0.5 dB for 20~29 GHz. The measured return loss is less than -13 dB for the PCB-based package and less than -15 dB for the LTCC package in the frequency band, but the return loss of the package itself is predicted to be better than that of the test package by about 5 dB, because the ripples of the back-to-back connection typically degrade the return loss by 5 dB or more.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• Journal of Ginseng Research
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• v.45 no.5
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• pp.555-564
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• 2021

Background: Ginsenosides of Panax ginseng are used to enhance skin health and beauty. The present study aimed to investigate the potential use of ginsenoside Rf (Rf) from Panax ginseng as a new anti-pigmentation agent. Methods: The anti-melanogenic effects of Rf were explored. The transcriptional activity of the cyclic adenosine monophosphate (cAMP) response element binding protein (CREB) and the expression levels of tyrosinase, microphthalmia-associated transcription factor (MITF), and tyrosinase-related proteins (Tyrps) were evaluated in melanocytes and UV-irradiated ex vivo human skin. Results: Rf significantly inhibited Forskolin (FSK) or UV-stimulated melanogenesis. Consistently, cellular tyrosinase activity and levels of MITF, tyrosinase, and Tyrps were downregulated. Furthermore, Rf suppressed MITF promoter activity, which was stimulated by FSK or CREB-regulated transcription coactivator 3 (CRTC3) overexpression. Increased CREB phosphorylation and protein kinase A (PKA) activity induced by FSK were also mitigated in the presence of Rf. Conclusion: Rf can be used as a reliable anti-pigmentation agent, which has a scientifically confirmed and reproducible action mechanism, via inhibition of CREB/MITF pathway.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.1-5
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• 2000

Co-fired resistors for high frequency MCM-C (Multi Chip Module-Cofired) were fabricated and measured their RF properties from DC to 6 GHz. LTCC (Low Temperature Co-fired Ceramics) substrates with 8 layers were used as the substrates. Resisters and electrodes were printed on the 7th layer and connected to the top layer by via holes. Deviation from DC resistance of the resistors was resulted from the resister pastes, resistor size, and via length. From the experimental results, the suitable equivalent circuit model was adopted with resistor, transmission line, capacitor, and inductor. The characteristic impedance $Z_{o}$ of the transmission line from the equivalent circuit can explain the RF behavior of the buried resistor according to the structural variation.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.85-90
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• 1997

A new ionized sputtering process was developed to fill small trench or via using additional ionizing mechanism of sputtered particles from 32cm $AlCu_x$(x=0.5%) cathode target with rotating magnet, then drawn toward substrate by small negative DC potential. The radial uniformity in RFI magnetron sputtering was studied by plasma diagnosis and appropriate RFI coil design to improve it. Optical emission intensities of excited species. $Ar^{\circ}, \;Ar^+;Al^+, \;Al^{\circ}$ are measured across the radial direction and showed close correlation with deposit's bottom to top thickness ratios in trenches and vias of submicron opening and 1.5 aspect ratio. After increase of the diameter of RF coil from 29 cm to 32 cm and improved the power leading feedthrough symmetry by removal of asymmetric single turn region, there was an increase of uniformity from 7.5% to 1.5% in bottom to top thickness ratio in 0.6 $\mu\textrm{m}$ vias.