• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.4
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• pp.384-393
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• 2013

In this paper, a design of planar microwave bias-tee using lumped elements was presented. The bias-tee is composed of 2 blocks; DC block and RF choke. For this design of the bias-tee, a wideband capacitor was used for DC block. For a RF choke, a series connection of inductors which have different SRFs is used for a RF choke. In the RF choke, a series connection of resistor and capacitor was added in shunt to eliminate a loss from a series resonance. The designed bias-tee was implemented by using 1608 SMT chip components. The fabricated bias-tee was measured using Anritsu 3680K fixture which enables to remove an effect of a connector. The fabricated bias-tee presented -15 dB of return loss and -1.5 dB insertion loss at 10 MHz~18 GHz.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.4
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• pp.292-299
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• 2012

The line-of-sight(LOS) rate is estimated using Kalman filter in Radio-Frequency(RF) seeker. For the two axis gimbaled seeker, proper system modeling is considered and the basic filter structure is set up. The main issue for Kalman filter is choosing the proper process and measurement noise. For the measurement process, the signal to noise ratio(SNR) and other components are introduced. To cope with the eclipse problem or other abnormal seeker status, the pseudo input signal concept is proposed. By conditioning abnormal signals, the LOS rate estimation performance is increased. The process noise is also an important factor in the propagation phase. The analytical approach on a process noise component is performed and a reliable region for the filter is calculated based on the eigenvalue analysis. Some numerical simulations are performed to check the validity of suggested algorithm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.492-498
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• 2002

In this paper, we present the simulation results of multi-layer VCO(voltage controlled oscillator), which is composed of resonator, oscillator, and buffer circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated by the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was Dupont 951AT, which will be applied for LTCC process. The structure of multi-layer VCO is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5 [dBm], the phase noise was -104 [dBc/Hz] at 30 [kHz] offset frequency, the harmonics -8 dBc, and the control voltage sensitivity of 30 [MHz/V] with a DC current consumption of 9.5 [mA]. The size of VCO is $6{\times}9{\times}2 mm$(0.11 [cc]).

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.4
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• pp.331-341
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• 2002

It is expected that the SCM (Subcarrier Multiplexing) optical link system, in which a number of small scale base stations with only antenna and RF transceiver are connected to central station through optical fiber, is in demand. In order to analyze the performance of SCM optical link system fur RF signal transmission, MZ(Mach-Zehnder) modulator's transfer function is modelled as nonlinear form with the cube of input signal. And considering the multiple access interferences occurred In the demodulation of other users'CDMA signals with multipath components after passing through MZ modulator, the BER performance is analyzed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.653-656
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• 2002

In this paper, we present the simulation results of multi-layer VCO(voltage controlled oscillator), which is composed of resonator, oscillator, and buffer circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated by the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont 951AT, which will be applied for LTCC process. The structure of multi-layer VCO is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5 [dBm], the phase noise was -104 [dBc/Hz] at 30 [kHz] offset frequency, the harmonics -8 dBc, and the control voltage sensitivity of 30 [MHz/V] with a DC current consumption of 9.5 [mA]. The size of VCO is $6{\times}9{\times}2$ mm(0.11[cc]).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.912-915
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• 2004

Inductors material utilized in the downsizing passive devices and Rf components requires the physical and electrical properties at given area such as inductors thickness reduction, inductance and q-factor increase, low leakage current and thermal stability. In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of $2{\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to $60{\mu}m$ and from 20 to $70{\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• Journal of the Institute of Convergence Signal Processing
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• v.1 no.1
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• pp.89-96
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• 2000

In this paper, we propose a vision algorithm for the inspection of very small RF-chip inductor which is used in mobile-communication terminal. The proposed method divides coil part from the inductor body by local adaptive thresholding and integral projection method. After dividing work, the coil components are extracted by thinning and labelling techniques. The test items are the number of turns, the intervals in coil, and the measure of uniformity between the extracted lines. If the values of these are more than the specific value a tested product is decided bad one. In the simulation, the proposed method has a good performance.

• Journal of applied mathematics & informatics
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• v.28 no.5_6
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• pp.1055-1071
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• 2010

Recently, a number of algorithms have been proposed for numerical evaluation of Hankel transforms as these transforms arise naturally in many areas of science and technology. All these algorithms depend on separating the integrand $rf(r)J_{\upsilon}(pr)$ into two components; the slowly varying component rf(r) and the rapidly oscillating component $J_{\upsilon}(pr)$. Then the slowly varying component rf(r) is expanded either into a Fourier Bessel series or various wavelet series using different orthonormal bases like Haar wavelets, rationalized Haar wavelets, linear Legendre multiwavelets, Legendre wavelets and truncating the series at an optimal level; or approximating rf(r) by a quadratic over the subinterval using the Filon quadrature philosophy. The purpose of this communication is to take a different approach and replace rapidly oscillating component $J_{\upsilon}(pr)$ in the integrand by its Bernstein series approximation, thus avoiding the complexity of evaluating integrals involving Bessel functions. This leads to a very simple efficient and stable algorithm for numerical evaluation of Hankel transform.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.2A
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• pp.66-79
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• 2005

In this paper, we have performed the analysis of RF transceiver system and communication link for the improvement in reliability of Smart-UAV(Unmanned Aerial Vehicles) Data-Link. The system analysis performed using the development specification of the data link and data sheet of using components through the system simulation tool that is Agilent EEsof ADS. Also, the communication link analysis peformed using a variety of propagation models for the smart UAV operation environments. As a result, we have presented problems appeared in the simulation results and development specification. As well as, we have presented about several problems and consideration issue for system design through the communication link analysis.