• Journal of Powder Materials
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• v.19 no.2
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• pp.134-139
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• 2012

P/M coppers are subjected to the isothermal compression tests at the strain rate ranging from 0.01 to 10.0 $s^{-1}$ and the temperature from 200 to $800^{\circ}C$. The processing map reveals the dynamic recrystallization (DRX) domain in the following temperature and strain rate ranges: $600-800^{\circ}C$ and 0.01-10.0 $s^{-1}$, respectively. In the domain, the region at temperature of $600^{\circ}C$ and strain rate of $10^{-2}s^{-1}$ shows peak efficiency. From the kinetic analysis, the apparent activation energy in the DRX domain is 190.67 kJ/mol and it suggests that lattice self-diffusion is the rate controlling mechanism.

• Electrical & Electronic Materials
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• v.9 no.3
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1

• Journal of Korea Foundry Society
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• v.38 no.3
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• pp.55-59
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• 2018

To optimize the conductivity and to reduce the weight by as much as possible, Al-Cu composites were prepared through a suction-casting procedure. Pure copper metal foam was infiltrated by melted aluminum with the use of the vacuum, after which warm rolling was conducted to remove several remaining pores at the interface between the Cu foam and the aluminum matrix. Despite the short casting time, significant dissolution of Cu into the melt was observed. Moreover, it was found that various Al-Cu intermetallic compounds arose at the interface during the isothermal heating process after the casting and rolling steps. The average thickness of the Al-Cu intermetallic compound tended to increase in proportion to the heating time. The electrical and thermal conductivity levels of the cast composites were found to be comparatively low, mainly due to the dissolution of the Cu foam and the formation of intermetallics at the interface.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.72-79
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• 2014

Shaped charge(SC) ammunition is a weapon that penetrates directly the target by made jet from metal liner on impacting at a target. In SC, the liner occupies significantly important role causing an explosion and penetration of the target. The Al-Ni composite coating was deposited on copper liner in a solid state via kinetic spraying to improve the explosive force. The mechanical properties, reactivity and microstructure were investigated to confirm the possibility of kinetic sprayed Al/Ni composite coating as a reactive liner material. Reactive liner using Al/Ni composite exhibited much enhanced reactivity than pure copper liner due to Self-propagating High-temperature Synthesis (SHS) reaction with significantly improved adhesive bond strength. Especially, among the Al/Ni composite coatings, AN11 (the Al versus Ni atomic percent ratio is 1:1) showed the greatest reactivity due to its widest reaction area between deposited Al and Ni.

• Journal of Welding and Joining
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• v.28 no.2
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• pp.47-53
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• 2010

According to the research report for the recent a few years, the dissimilar welding of Cu and STS 304 alloy have been presented that a weldability is very poor. This article present a study on Lap joint by Electron beam welding dissimilar materials. The weld metals was constituted between pure copper and STS 304 steel. The experiment was performed with 125mA welding current, 520mA focusing current. The Vacuum condition of chamber is 5${\times}$10-5torr and welding speed is 300mm/min. Showing the bead shape of weld metal, the thickness of the stainless 304 using as the protect materials is 3mm and the thickness of a copper is 15mm. The analysis about the microstructure were carried out in which it was observed with SEM. The results showed that complex heterogeneous fusion zone microstructure characterized both by rapid cooling and mixing of the molten metal, however the liquation crack was formated in the fusion line.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.458-461
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• 2004

In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Electronic Materials Letters
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• v.14 no.6
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• pp.712-717
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• 2018

In this letter, we have introduced copper chloride ($CuCl_2$) as an additive in the $CH_3NH_3PbI_3$ precursor solution to improve the surface morphology and crystallinity of $CH_3NH_3PbI_3$ films in a single solvent system. Our optimized perovskite solar cells (PSCs) with 2.5 mol% $CuCl_2$ additive showed best power conversion efficiency (PCE) of 15.22%. The PCE of the PSCs fabricated by $CuCl_2$ (2.5 mol%) additive engineering was 56% higher than the PSC fabricated with pristine $CH_3NH_3PbI_3$.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.181-188
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• 2001

The present research is an experimental study of subcooled flow boiling behavior using flat, microporousenhanced square heater surfaces in pure FC-72. Two $1-cm^{2}$ copper surfaces, one highly polished (plain) and one microporous coated, were flush-mounted into a 12.7 mm square, horizontal flow channel. Testing was performed for fluid velocities ranging from 0.5 to 4 m/s (Reynolds numbers from 18,700 to 174,500) and pure subcooling levels from 4 to 20 K. Results showed both surfaces' nucleate flow boiling curves collapsed to one line showing insensitivity to fluid velocity and subcooling. The log-log slope of the microporous surface nucleate boiling curves was lower than the plain surface due to the conductive thermal resistance of the microporous coating layer. Both, increased fluid velocity and subcooling, increase the CHF values for both surfaces, however, the already enhanced boiling characteristics of the microporous coating appear dominant and require higher fluid velocities to provide additional enhancement of CHF to the microporous surface.