• Title/Summary/Keyword: Pulsed laser beam machining

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Micro Machining of Aluminium using Pulsed Laser Beam (레이저빔을 이용한 알루미늄의 미세가공)

  • Shin, Hong Shik
    • Journal of Institute of Convergence Technology
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    • v.4 no.2
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    • pp.41-45
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    • 2014
  • Micro fabrication technologies of aluminium have been required to satisfy many demands in technology fields. Pulsed laser beam machining can be an alternative method to accomplish the micro machining of aluminium. Pulsed laser beam can be applied to micro machining such as micro drilling and milling. Using pulsed laser beam, the machining characteristics of aluminium in micro drilling and milling were investigated according to average power, repetition rate, moving speed of spot. The laser beam machining with the optimal conditions can achieve precise micro figures. As a result, micro pattern, text and structures on aluminium surface was successfully fabricated by pulsed laser beam machining.

Study on Characteristics of Micro Patterned Copper Electrodeposition according to Parameters in Laser Beam Machining (레이저빔 가공 인자에 따른 구리도금 미세 패터닝 특성 연구)

  • Shin, Hong Shik
    • Journal of Institute of Convergence Technology
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    • v.5 no.2
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    • pp.21-25
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    • 2015
  • This paper proposes a fabrication process of deposited layer with micro patterns that uses a combination of a pulsed laser beam machining and an electrodeposition. This process consists of the electrodeposition and the laser beam machining. The deposited layer on metal can be selectively eliminated by laser ablation. As a result, the deposited layer with micro patterns can be fabricated without a mask. The characteristics of the deposited layer on stainless steel were investigated according to the average power and marking speed in the pulsed laser beam machining. The optimal laser beam conditions for precise micro patterning of the deposited layer were determined. Finally, the deposited copper layer with micro text was successfully fabricated by the pulsed laser beam machining.

Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration (초음파 진동과 레이저 후면 에칭을 통한 유리 구멍 가공)

  • Kim, Hye Mi;Park, Min Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.1
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    • pp.75-81
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    • 2014
  • Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

Micromachining Using Laser Beam Machining and Electrochemical Etching (레이저 빔 가공과 전해 에칭을 이용한 미세 가공)

  • Kim, Jang-Woo;Kwon, Min-Ho;Chung, Do-Kwan;Chu, Chong-Nam
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.10
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    • pp.1089-1095
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    • 2012
  • Laser beam machining (LBM) using nanosecond pulsed laser is widely known to be rapid and non-wear process for micromachining. However, the quality itself cannot meet the precision standard due to the recast layer and heat affected zone. In this paper, a fabrication method for machining micro features in stainless steel using a hybrid process of LBM using nanosecond pulsed laser and electrochemical etching (ECE) is reported. ECE uses non-contacting method for precise surface machining and selectively removes the recast layer and heat affected zone produced by laser beam in an effective way. Compared to the single LBM process, the hybrid process of LBM and ECE enhanced the quality of the micro features.

Micromachining Using Hybrid of Laser Beam and Electrical Discharge Machining (레이저 빔 가공과 방전 가공을 이용한 복합 미세 가공)

  • Kim, San-Ha;Chung, Do-Kwan;Kim, Bo-Hyun;Oh, Kwang-Hwan;Jeong, Sung-Ho;Chu, Chong-Nam
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.10
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    • pp.108-115
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    • 2009
  • Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

Micro-pattern Fabrication of Amorphous Alloy by Laser Beam Machining (비정질 합금의 마이크로 패턴 레이저 가공)

  • Kim, Haan;Park, Jong Wuk
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.4
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    • pp.77-83
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    • 2022
  • Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

A Study on the YAG Laser Machining of Cr Thin Films (YAG 레이저에 의한 Cr박막가공에 관한 연구)

  • 강형식;홍성준;박홍식;전태옥
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.1053-1057
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    • 1997
  • Laser thin film process with a Q-switch pulsed YAG laser was performed for micro machining. In this research, we performed basic Cr thin film on glass substrates removal machining experiments. Form experiments, it happens not only evaporration of thin film but also spatter and cohesion of melting substance in working region, when machining a Cr thin film by Q-switch YAG laser beam irradiation. Critical energy of surface irradiation type by irradiation direction of laser in a face composing thin film on the glass is higher than that of back irradiation type, but the latter is favorable because of spatter appearance. In case of image formation position when laser beam is irradiated, the defocus is permitted to a certain extent within forcus depth. Ifexceeds focus depth, formation of pattern is vanishing step by step.

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Ablation rate study using short pulsed laser subjected to Alumina medium (알루미나 세라믹 소재의 초단파 레이저 어블레이션량 연구)

  • Kim, Kyunghan;Park, Jinho
    • Laser Solutions
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    • v.18 no.4
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    • pp.17-22
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    • 2015
  • In this paper, ablation rate of $Al_2O_3$ ceramics by femtosecond laser fluence is derived with experimental method. The automatic three axis linear stage makes laser optics to move with high spatial resolution. With 10 times objective lens, minimal pattern width of $Al_2O_3$ is measured in the focal plane. Ablated surface area is shown as linear tendency increasing number of machining times with various laser power conditions. Machining times is most sensitive condition to control $Al_2O_3$ pattern width. Also, the linear increment of pattern width with laser power change is investigated. In high machining speed, the ablation volume rate is more linear with fluence because pulse overlap is minimized in this condition. Thermal effect to surrounding medium can be minimized and clean laser process without melting zone is possible in high machining speed. Ablation volume rate decelerates as increasing machining times and multiple machining times should be considered to achieve proper ablation width and depth.

CW 및 Pulsed 레이져를 이용한 세라믹 절단

  • 방세윤
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.156-160
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    • 1994
  • Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

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