• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.540-545
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• 2002

The tight integration of the part design and process planning is very effective to high quality product development and cost effective manufacturing. Moreover, the integration in the early design stage, that is, the integration of the conceptual design and the conceptual process planning may take a big impact with the forecasting the alternative of the design and manufacturing. In this paper, the real field parts are studied about the relations among the Feature, Function, and Manufacturing Process taking the style of reverse engineering method, to found the base of the systematic computer system for the integrated product design and manufacturing process planning.

• The Journal of Society for e-Business Studies
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• v.9 no.1
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• pp.105-122
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• 2004

The advance of information technology has changed the business environment, and the business process between the trading partners has been evolved with these changes. However, the business process between trading partners requires human interface for interchanging information or making a decision even though they collaborate each other or are coupled tightly, and this interrupts seamless business processes between them. To overcome this limitations, a new concept of self-integration has been emerged. The self-integration means a true integration among enterprise applications without human interface, and it might be the future direction of integrations. In this study, we introduced the concept of self-integration environment and business process model for supply chain planning. And, we analyzed the negotiation processes and classified the negotiation patterns for integrated supply chain planning in self-integration environment, and then we proposed a generic business process model for negotiation of extended and integrated supply chain planning by integrating the suggested negotiation pattern with business scenarios.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.482-487
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• 1988

A sequential-clustered integrator based on GEAR method is developed for the purpose of dynamic simulation of chemical processes. And a single simulator structure capable of employing various integration approaches is designed and its efficiency and flexiblity is evaluated. Sequential integration method is superior to simultaneous method for the process without recycle, but simultaneous method is very powerful for the coupled process with recycle.

• Information Systems Review
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• v.3 no.2
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• pp.387-398
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• 2001

Effectively integrating information systems in mergers and acquisitions of large organizations can be critical to merger success. But the general literature on M&A focuses on the financial aspects of the acquisition process, rather than on the subsequent process of integration. This paper analyses the case of information systems integration in a merger of two Korean manufacturing organizations, and explores the factors influencing IS integration in M&A in Korea. To analysis this case and find factors affecting IS integration success, we use MIT'90s schema (framework) by Scott Morton that consists of 5 dimensions (strategy, processes, structure, individuals/roles, and technology). From the results of this case study, we found 13 factors and 14 propositions influencing IS integrations performance in M&A in Korean companies. This research helps the company to avoid mistakes and to manage IS integration in M&A. Also this study provides guide line for further researches.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.1007-1014
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• 2003

It is important to integrate an enterprise application for automating of the business profess, which is responded by a flow of market environment. There are two categories of method that integrate enterprise applications. One is Synchronous Integration, and the other is Asynchronous Integration. EAI(Enterprise Application Integration) and Web service which of the asynchronous integration is focused in the automating method of the business process. After we construct the application integration for automating of the business process, we have to concern about managing of the business transaction. Many Organizations have proposed the process method of business transaction based on 2-phase commit protocol. But this method can′t supply the phase that classify the transaction by transaction weight. In this paper, we propose an efficient method of transaction process for business transactions, which is composed by ′Classify Phase′ that classify transactions. We called this model "3-Phase Commit Method Applied by Classify Phase", we design this model to manage an resource of enterprise efficiently. The proposed method is compared by the method based on 2-Phase commit that could be a problem of management the resource of enterprise, and the advantage of this method is certified to propose the solution of that problem.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Knowledge Management Research
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• v.11 no.2
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• pp.1-16
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• 2010

Despite the well accepted necessity and importance of knowledge management, cases of successful knowledge management are not easy to find. With a case study of a Korean organization, this research introduces an integrated knowledge management model, in which knowledge and work processes are combined to improved knowledge performance. Knowledge-work process integration facilitates knowledge asset creation, transfer, and utilization, through which inefficiencies in knowledge utilization may be removed and knowledge contribution to business performance may be enhanced. Knowledge-work process integration may further be aligned with innovation processes, enabling systematic and continuous knowledge based process innovation.

• Proceedings of the Korea Society for Simulation Conference
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• 1998.10a
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• pp.199-203
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• 1998

Process planning and scheduling are traditionally regarded as separate tasks performed sequentially. But if two tasks are performed concurrently, greater performance can be achieved. In this study, we propose new approach to integration of process planning and scheduling. We propose new process planning combinations selection method using simulation based genetic algorithms. Computational experiments show that proposed method yield better performance when compared with existing methods.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.259-266
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• 1992

For CAD/CAPP integration, part information on not only geometry but also machining characteristics should be delivered and commonly used between designers and process planners. In this study, the machining features, as linking factors of the integration, are represented as the combination of functional features and atomic features and grouped into a hierarchical database. And the feature based modelling approach is used by generating information on the machining features in design stage. These features are drawn by analyzing real decision rules of process planners. The database using the machining features is built and used for application modules of process planning, operation planning and standard time estimation.