• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.61-65
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• 2024

The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.47 no.4
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• pp.20-27
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• 2010

This paper proposes a saturation compensating method by embedding pseudo-random code information in wavelet packet based colorization algorithm. In the color-to-gray process, an input RGB image is converted into YCbCr images, and a 2-level wavelet packet transform is applied to the Y image. And then, color components of CbCr are embedded into two sub-bands including minimum amount of energy on the Y image. At this time, in order to compensate the color saturations of the recovered color image during the printing and scanning process, the maximum and minimum values of CbCr components of an original image are also embedded into the diagonal-diagonal sub-band by a form of pseudo-random code. This pseudo-random code has the maximum and minimum values of an original CbCr components, and is expressed by the number of white pixels. In the gray-to-color process, saturations of the recovered color image are compensated using the ratio of the original CbCr values to the extracted CbCr values. Through the experiments, we can confirm that the proposed method improves color saturations in the recovered color images by the comparison of color difference and PSNR values.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.43 no.1 s.307
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• pp.9-16
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• 2006

This Paper proposes an adaptive error diffusioThis paper proposes an adaptive error diffusion algorithm for text enhancement followed by an efficient text segmentation that uses the maximum gradient difference (MGD). The gradients are calculated along with scan lines, and the MGD values are filled within a local window to merge the potential text segments. Isolated segments are then eliminated in the non-text region filtering process. After the left segmentation, a conventional error diffusion method is applied to the background, while the edge enhancement error diffusion is used for the text. Since it is inevitable that visually objectionable artifacts are generated when using two different halftoning algorithms, the gradual dilation is proposed to minimize the boundary artifacts in the segmented text blocks before halftoning. Sharpening based on the gradually dilated text region (GDTR) prevents the printing of successive dots around the text region boundaries. The error diffusion algorithm with edge enhancement is extended to halftone color images to sharpen the tort regions. The proposed adaptive error diffusion algorithm involves color halftoning that controls the amount of edge enhancement using a general error filter. The multiplicative edge enhancement parameters are selected based on the amount of edge sharpening and color difference. Plus, the additional error factor is introduced to reduce the dot elimination artifact generated by the edge enhancement error diffusion. By using the proposed algorithm, the text of a scanned image is sharper than that with a conventional error diffusion without changing background.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Clean Technology
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• v.28 no.4
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• pp.293-300
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• 2022

The remarkable mechanical, electrical, and thermal properties of graphene have recently sparked tremendous interest in various research fields. One of the most promising methods to produce large quantities of graphene dispersion is liquid-phase exfoliation (LPE) which utilizes ultrasonic waves or shear stresses to exfoliate bulk graphite into graphene flakes that are a few layers thick. Graphene dispersion produced via LPE can be transformed into graphene ink to further boost graphene's applications, but producing high-quality graphene more economically remains a challenge. To overcome this shortcoming, an advanced LPE process should be developed that uses relatively cheap natural graphite as a graphene source. In this study, a flow-LPE process was used to exfoliate natural graphite to produce graphene that was three times cheaper and seven times larger than synthetic graphite. The optimal exfoliation conditions in the flow-LPE process were determined in order to produce high-quality graphene flakes. In addition, the structural and electrical properties of the flakes were characterized. The electrical properties of the exfoliated graphene were investigated by carrying out an ink formulation process to prepare graphene ink suitable for inkjet printing, and fabricating a printed graphene pattern. By utilizing natural graphite, this study offers a potential protocol for graphene production, ink formulation, and printed graphene devices in a more industrial-comparable manner.

• Journal of vocational education research
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• v.36 no.1
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• pp.47-75
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• 2017

The purpose of this study was to provide basic data for policy making for secondary vocational education in each region and transformation in vocational high schools. To achieve this, the regional strategic industries in Daejeon and Jeonnam were selected, new demand for vocational high school graduates was forecasted in each industry and occupation. The results of the study are as follows. First, locational quotient analysis and regional shift-share analysis revealed that Daejon and Jeonnam have different strategic industries. Daejon, unlike Jeonnam strategically develops 'manufacturing food, beverage and tobacco', 'manufacturing timber and paper, printing and copying', 'public service and administration of national defense and social security' and 'manufacturing electrical devices, electronics and precision devices'. Jeonnam has specialized industries distinguished from Daejon's, which are 'manufacturing of machinery transportation equipments and etc', 'manufacturing of non-metallic minerals and metal products', 'electric, gas, steam and water supply systems/industries', 'manufacturing coal and chemical products, refining petroleum', 'mining' and 'agriculture, forestry and fishery'. Second, new demand for vocational high school graduates by occupations and industries showed regional differences(in Daejon and Jeonnam). According the forecast, Daejon will have many workforce demands based on manufacturing industries, on the other hand Jeonnam's focused on service industries. Analysis by occupations was also different, Daejon showed high demands on professional and related workers, while Jeonnam requested many new office and service workers. Third, new workforce demand by occupations in regional strategic industries is big part of overall new workforce demand both in Daejon and Jeonnam. Forth, according to the results of analyzing the new demand for vocational high school graduates in Daejeon and Jeonnam in terms of industry location quotient and change effect, there was high demand in industries with positive total change effects. In terms of location quotient, Daejeon and Jeonnam showed different results.