• BMB Reports
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• v.36 no.4
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• pp.349-353
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• 2003

To explore the application of DNA chip technology for the detection and typing of Human Papillomavirus (HPV), the HPV6, 11, 16 and 18 gene fragments were isolated and printed onto aminosilane-coated glass slides by a PixSys 5500 microarrayer as probes to prepare the HPV gene chips. HPV samples, after being labeled with fluorescent dye by restriction display PCR (RD-PCR) technology, were hybridized with the microarray, which was followed by scanning and analysis. The experimental condition for preparing the HPV gene chips was investigated, and the possibility of HPV genotyping using gene chips was discussed. The technique that was established in this study for preparing HPV gene chips is practical. The results of the present study demonstrated the versatility and inspiring prospect of using this technology to detect and genotype HPV.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11b
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• pp.15-17
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• 2004

The quality of X -ray image is depending on the acquired signal pattern So far, the MTF(modulation transfer function) of medical image system has been obtained through various kinds of calculationprocesses after using SWRF (A square wave response function method) to print out it into films. In this study, a tool has been developed that can help the actual user who actually creates the medical images measure the MTF of the finaldisplay image very simply by applying Borland C++ builder software as well as LEAD tools software for the SWRF calculation process to analyze the MTF even on the display image. Films have been printed out by this newly developed MTF measuring tool under the same conditions with the ones for the existing tools and also the calculation method has shown no difference with any existing SWRF calculation method. By using this, it was found out that the MTF of the resolving power of the computed radiography(CR) Image plate (IP) that is a conventional X-ray detection system Jar the conventional X-ray purpose was about 10% at the range of 3.00 LP/mm.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.125-130
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• 2011

The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within $20{\mu}m$ width on a $20{\mu}m$ thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.51-56
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• 2021

Using an inkjet printing process, we have investigated a droplet formation of poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) near the orifice of a piezoelectric inkjet head. With an attempt to form the smallest droplet without any satellites, we have applied various waveforms such as the unipolar, bipolar, and M-shaped waveforms. It is found that the droplet velocity and volume vary depending sensitively on the waveform width and voltage. Of those, the M-shaped waveform is shown to provide the smallest droplet volume, followed by the bipolar and then unipolar waveforms. The droplet printed on a PET film roll by the M-shaped waveform has the diameter as small as 46.1 ㎛. It is likely that the second short unipolar in the M-shape waveform increases the droplet velocity gradient, rendering the droplet smaller.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.68-73
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• 2022

In this study, we produced the surface defect detection model to automatically detect defect bone plates using a deep learning algorithm. Bone plates with a width and a length of 50 mm are most used for fracture treatment. Normal bone plates and defective bone plates were printed on the 3d printer. Normal bone plates and defective bone plates were photographed with 1,080 pixels using the webcam. The total quantity of collected images was 500. 300 images were used to learn the defect detection model. 200 images were used to test the defect detection model. The mAP(Mean Average Precision) method was used to evaluate the performance of the surface defect detection model. As the result of confirming the performance of the surface defect detection model, the detection accuracy was 96.3 %.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.168-173
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• 2022

As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.254-259
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• 2018

General D-glass(Dielectric glass) fibers are adaptable to PCBs(Printed circuit boards) because they have a low dielectric constant of about 3.5~4.5. However, very few papers have appeared on the physical characteristics of D-glass fibers. D-glass fibers were fabricated via continuous spinning process using bulk D-glass. In order to fabricate the D-glass, raw materials were put into a Pt crucible, melted at $1650^{\circ}C$ for 2 hrs, and then annealed at $521{\pm}10^{\circ}C$ for 2 hrs. We obtained transparent clear glass. The transmittance and adaptable temperature for spinning of the bulk marble glass were characterized using a UV-visible spectrometer and a viscometer. Continuous spinning was carried out using direct melting spinning equipment as a function of the fiberizing temperature in the range of $1368^{\circ}C$ to $1460^{\circ}C$, while the winder speed was between 100 rpm and 200 rpm. We investigated the physical properties of the D-glass fibers. The average diameters of the glass fibers were measured by optical microscope and FE-SEM. The average diameters of the D-glass fibers were 21.36 um at 100 rpm and 34.06 um at 200 rpm. The mechanical properties of the fibers were confirmed using a UTM(Universal materials testing machine). The average tensile strengths of the D-glass fibers were 467.03 MPa at 100 rpm and 522.60 MPa at 200 rpm.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.39-42
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• 2017

E-glass (electrical glass) fiber is the widely used as a reinforced composite material of PCBs (printed circuit boards). However, E-glass fiber is not stable because it has a dielectric constant of 6~7. On the other hand, D-glass (dielectric glass) fiber has a low dielectric constant of 3~4.5. Thus, it is adaptable for use as a reinforcing material of PCBs. In this study, we fabricated D-glass compositions with low dielectric constant, and measured the electrical and optical properties. In the glass composition, the boron content was changed from 9 to 31 wt%. To confirm the dependence of the dielectric constant on melting properties, D-glass with 22 wt% boron was melted at $1550^{\circ}C$ and $1650^{\circ}C$ for 2hrs. The glass melted at $1650^{\circ}C$ had a lower dielectric constant than the glass melted at $1550^{\circ}C$. Therefore, the D-glass with boron of 9~31 wt% was fabricated by melting at $1650^{\circ}C$ for 2hrs, and transparent clear glass was obtained. We identified the non-crystalline nature of the glass using an XRD (x-ray diffractometer) graph. The visible light transmittance values depending on the boron contents were measured and found to be 88.6 % ~ 82.5 %. Finally, the dielectric constant of the D-glass with 31 wt% boron was found to have decreased from 4.18 to 3.93.