• Journal of Korean Society of Forest Science
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• v.89 no.3
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• pp.323-334
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• 2000

This study was carried out to investigate the effects of geological and topographical features on landslide and land-creep at the twenty four surveyed sites of Kyungpook province. According to the results obtained, it was concluded that continuous heavy rainfall was one of the primary factors to occur landslide and land-creep. Most of the landslides occurred in the past were concentrated in the granite and granitic gneiss zones, while land-creeps were mainly occurred in the mud-stone zones. Therefore, it was thought that the physical properties such as soil texture, solid phase, moisture contents, density, hardness and porosity rate of weathered granite and granitic gneiss could affect the occurrence of landslide and land-creep. Due to the holding of sand contents in the upper soil layers of weathered granite and granitic gneiss, rainfall could infiltrate into the soil easily. While lower soil layers contained much quantity of clay and silt contents, those soils saturated with rainfall cause to lose viscosity and shear strength. Therefore, it was seemed that landslide was occurred more easily and the saturation of those soils was made much easily by bed rocks under those soils. Landslide and land-creep are slided into lower place by gravitation and slope degree factors. Therefore, prediction of landslide occurrence is very difficult because landslide is occurred abruptly, and physical properties of the soil have to be understood and checking the existence of bed rocks under the soils is not easy, on the other hand, land-creep is progressed very slowly. Therefore, it was suggested that in a degree creeping could be protected by removing of several causing factors.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.5
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• pp.524-532
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• 2008

This paper presents yaw vibration control performances of railway vehicle featuring controllable magnetorheological damper. A cylindrical type of MR damper is devised and its damping force is evaluated by considering fluid resistance and MR effect. Design parameters are determined to achieve desired damping force level. The MR damper model is then incorporated with the governing equations of motion of the railway vehicle which includes vehicle body, bogie and wheel-set. Subsequently, computer simulation of vibration control via proportional-integral-derivative(PID) controller is performed using Matlab. Various control performances are demonstrated under external excitation by creep force between wheel and rail.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09b
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• pp.131-137
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• 2010

`Frost heave' is volumetric extension behavior of soil due to freezing. It could have a bad effect to foundations of infrastructures like building, road, railroad and bridge. Therefore, it is considered as a primary design parameter with 'adfreeze bond' and 'creep deformation' for foundation design in cold region. In some countries, studies for analyzing frost heave in many ways have being performed, however, only a few studies for evaluating frost susceptibility of soils by measuring frost heave rate of frozen soils in Korea. For analyzing frost heave as a foundation design parameter, both frost heaving rate and heaving pressure are should be addressed in study. Hence, in this study, development of experimental apparatus to evaluate frost heave and pressure is suggested.

• Journal of Korea Foundry Society
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• v.38 no.5
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• pp.103-110
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• 2018

The effects of a heat treatment on the carbide formation behavior and mechanical properties of the cobalt-based superalloy X-45 were investigated here. Coarse primary carbides formed in the interdendritic region in the as-cast specimen, along with the precipitation of fine secondary carbides in the vicinity of the primary carbides. Most of the carbides formed in the interdendritic region were dissolved into the matrix by a solution treatment at $1274^{\circ}C$. Solutionizing at $1150^{\circ}C$ led to the dissolution of some carbides at the grain boundaries, though this also caused the precipitation of fine carbides in the vicinity of coarse primary carbides. A solution treatment followed by an aging treatment at $927^{\circ}C$ led to the precipitation of fine secondary carbides in the interdendritic region. Very fine carbides were precipitated in the dendritic region by an aging heat treatment at $927^{\circ}C$ and $982^{\circ}C$ without a solution treatment. The hardness value of the alloy solutionized at $1150^{\circ}C$ was somewhat higher than that in the as-cast condition; however, various aging treatments did not strongly influence the hardness value. The specimens as-cast and aged at $927^{\circ}C$ showed the highest hardness values, though they were not significantly affected by the aging time. The specimens aged only at $982^{\circ}C$ showed outstanding tensile and creep properties. Thermal exposure at high temperatures for 8000 hours led to the precipitation of carbide at the center of the dendrite region and an improvement of the creep rupture lifetimes.

• Journal of the Korean Society for Railway
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• v.9 no.6 s.37
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• pp.644-651
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• 2006

An application of concrete track is being actively processed for the construction of Korean railroad. The concrete track has an advantage to decrease the maintenance ire, but is very difficult system to maintain after earthwork settlement occurred. Therefore, the management and control of embankment and foundation settlement is very important for the successful concrete track construction. We expect that the main part of the settlement of the concrete track is the one of embankment and foundation supporting it. Settlements vulnerable to the concrete track among the causes of lots of settlements are primary consolidation and secondary compression settlement of foundation, creep settlement of embankment, settlement caused by train load, and unequal settlement resulting from the difference of embankment material and construction process. This paper investigated the settlement causes to make badly effects on the concrete track and also evaluated the settlement with field tests and numerical analysis.

• Journal of Korea Foundry Society
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• v.36 no.5
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• pp.159-166
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• 2016

The microstructural evolution of a cast Ni base superalloy, IN738LC, has been investigated after long term exposure at several temperatures. Most of the fine secondary ${\gamma}^{\prime}$ particles resolved after 2000 hour exposure at $816^{\circ}C$. At higher temperatures of $871^{\circ}C$ and $927^{\circ}C$, secondary ${\gamma}^{\prime}$ resolved after 1000 hours of exposure, and cuboidal primary ${\gamma}^{\prime}$ grew with exposure time. During the thermal exposure, ${\sigma}$ phase formed at all tested temperatures, and ${\eta}$ phase was observed around interdendritic regions due to carbide degeneration. The influence of microstructural evolution during thermal exposure on the mechanical properties has been analyzed. The effects of ${\gamma}^{\prime}$ particle growth are more pronounced on the high temperature creep properties than on the room temperature tensile properties.

• Korean Journal of Agricultural Science
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• v.10 no.1
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• pp.110-117
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• 1983

This study was conducted to investigate the influence of load increment ratio on the secondary consolidation for the marine clay at Asan bay by the hyperbola method. The results were summarized as follow: 1. Calculated secondary consolidation by the hyperbola method was slightly less than the value of Casagrande's log t method, but the difference was very little, and the secondary consolidation could be easily calculated by the hyperbola method even if load increment ratio was small. 2. The secondary consolidation ratio was increased with the decrement of load increment ratio, and the creep phenomenon of the settlement curve occurred under the condition of small load increment ratio seemed to be caused by the secondary consolidation. 3. The secondary consolidation ratio occurred during the primary consolidation was irregular in the overconsolidated range, but it was increased with the decrement of load increment ratio in the normally consolidated range. 4. The coefficient of secondary consolidation was increased with the increment of the consolidation load, made a point of the inflection near preconsolidation. And the coefficient of secondary consolidation was decreased from consolidation load $2kg/cm^2$, showed independent of load increment ratio. 5. The coefficient of secondary consolidation was showed in proportion to compression index.

• Journal of the Korean Geotechnical Society
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• v.24 no.8
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• pp.25-34
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• 2008

A new hybrid oedometer cell is designed and manufactured to investigate a behavior of soft soils by using elastic and electromagnetic waves during consolidation test. Bender elements, which generate and detect shear waves, are placed in the top cap and the bottom plate and mounted on the oedometer wall. Double wedge type electrical resistance probe, which measures local void ratio change, is positioned onto the top cap of the oedometer cell. The bender elements and the electrical resistance probe are anchored into a nylon set screw with epoxy resin. The nylon set screw with epoxy resin minimizes directly transmited elastic waves through the oedometer cell due to impedence mismatch and allows for easy replacement of defected bender elements and electrical resistance probe. Primary consolidation time can be estimated from the slope of electrical resistance versus log time curve and the evolution of shear wave velocity. The shear wave velocity can be used to assess inherent anisotropy when disturbance effects are minimized because particle alignment affects the shear wave velocity. The void ratios evaluated by the electrical resistance probe are similar to those by the settlement during consolidation. This study suggests that the shear wave velocity and the electrical resistance can provide complementary imformations to understand consolidation characteristics such as primary consolidation, anisotropy, and void ratio.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.