• Title/Summary/Keyword: Precision Surface Metrology

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A High-speed Atomic Force Microscope for Precision Measurement of Microstructured Surfaces

  • Cui, Yuguo;Arai, Yoshikazu;Asai, Takemi;Ju, BinFeng;Gao, Wei
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.3
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    • pp.27-32
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    • 2008
  • This paper describes a contact atomic force microscope (AFM) that can be used for high-speed precision measurements of microstructured surfaces. The AFM is composed of an air-bearing X stage, an air-bearing spindle with the axis of rotation in the Z direction, and an AFM probe unit. The traversing distance and maximum speed of the X stage are 300 mm and 400 mm/s, respectively. The spindle has the ability to hold a sample in a vacuum chuck with a maximum diameter of 130 mm and has a maximum rotation speed of 300 rpm. The bandwidth of the AFM probe unit in an open loop control circuit is more than 40 kHz. To achieve precision measurements of microstructured surfaces with slopes, a scanning strategy combining constant height measurements with a slope compensation technique is proposed. In this scanning strategy, the Z direction PZT actuator of the AFM probe unit is employed to compensate for the slope of the sample surface while the microstructures are scanned by the AFM probe at a constant height. The precision of such a scanning strategy is demonstrated by obtaining profile measurements of a microstructure surface at a series of scanning speeds ranging from 0.1 to 20.0 mm/s.

Three Dimensional Metrology of Surface Mounted Solder Pastes Using Bounding Box Formed by Histogram of Gradient Vectors of Point Cloud (점군의 기울기벡터 히스토그램에 의해 형성된 구속상자를 이용한 표면실장 솔더페이스트의 3차원 Metrology)

  • 신동원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.674-677
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    • 2003
  • This work presents a method of point-to-surface assignment for 3D inspection of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect point-to-surface assignment. The shape of bounding box for solder paste brick is variable according to geometry of measured points. The surface geometry of the bounding box is obtained by using five peaks selected from the histogram of normalized gradient vectors for measured points. By using the bounding box enclosing the solder paste. the task of point-to-surface assignment is successfully executed. Subsequently, the geometrical features are obtained via surface fitting.

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Fabrication of Large-area Micro-lens Arrays with Fast Tool Control

  • Noh, Young-Jin;Arai, Yoshikazu;Tano, Makoto;Gao, Wei
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.4
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    • pp.32-38
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    • 2008
  • This paper describes a fast tool control (FTC)-based diamond turning process for fabricating large-area high-quality micro-lens arrays. The developed FTC unit has a stroke of $48{\mu}m$ and a resonance frequency of 4.9 kHz. Micro-lens arrays were fabricated using a micro-cutting tool with a nose radius of $50{\mu}m$. The FTC unit was integrated with a force sensor so that the initial position of the micro-cutting tool with respect to the workpiece surface could be detected through monitoring the contacting force. The length and depth of the designed parabolic micro-lens profile were $190{\mu}m$ and $20{\mu}m$, respectively. A micro-lens array was fabricated on a cylinder surface over an area of ${\phi}55 mm{\times}40 mm$.

3-D Analysis and Inspection of Surface Mounted Solder Pastes by Point-to-Surface (가변 구속상자를 이용한 점-표면배정방법에 의한 표면실장 솔거페이스트의 삼차원 해석 및 검사)

  • 신동원
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.3
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    • pp.210-220
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    • 2003
  • This work presents a method of point to surface assignment fur 3D metrology of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect assignment. The shape of bounding box fur solder paste brick is variable according to geometry of measured points. The surface geometry of bounding box is obtained by using five peaks selected in the histogram of normalized gradient vectors. By using the bounding box enclosing the solder pastes, the task of point-to-surface assignment has been successfully conducted, then geometrical features are obtained through the task of surface fitting.

Design and Fabrication of a Step Height Certified Reference Material for Multi-probe Inspection Instruments (다중 프로브 검사 계측 장비를 위한 단차 표준 인증 물질의 설계 및 제작)

  • Maeng, Sae-Rom;Jin, Jong-Han;Buajarern, Jariya;Kim, Jae-Wan;Kim, Jong-Ahn;Kang, Chu-Shik
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.3
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    • pp.323-329
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    • 2011
  • Certified reference materials (CRMs) have been used to calibrate surface profilers for reliable measurements. In this paper, we present a newly designed step height CRM which has a step height pattern with two different widths and various special patterns for checking radial magnification, distortion of optical viewing systems, etc. Especially, it could be useful for multi-probe inspection instruments in the manufacturing lines. The fabrication was done by conventional optical lithography and dry etching process with optimized conditions. To verify the step height values, a white-light scanning interferometer was used with objective lenses having magnification of $10{\times}$ and $100{\times}$. CRMs with nominal step heights of $0.5\;{\mu}m$, $1\;{\mu}m$, $3\;{\mu}m$, $5\;{\mu}m$, $7\;{\mu}m$, and $10\;{\mu}m$ were fabricated and the uniformity of these CRMs was evaluated to be less than 3 nm ($1{\sigma}$).

Unequal-path Low-coherence Interferometry Using Femtosecond Pulse Lasers for Surface-profile Metrology (펨토초 레이저를 이용한 형상 측정용 비동일 광경로 저결 맞음 간섭계)

  • Oh, Jeong-Seok;Kim, Seung-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.9 s.186
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    • pp.102-110
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    • 2006
  • We discuss two possibilities of using femtosecond pulse lasers as a new interferometric light source for enhanced precision surface-profile metrology. First, a train of ultra-fast laser pulses yields repeated low temporal coherence, which allows unequal-path scanning interferometry, which is not feasible with white light. Second, the high spatial coherence of femtosecond pulse lasers enables large-sized optics to be tested in nonsymmetric configurations with relatively small-sized reference surfaces. These two advantages are verified experimentally using Fizeau and Twyman-Green type scanning interferometers.