• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.14-21
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• 2009

In this paper, a Ka-band 10 W power amplifier module with seven power MMIC bare dies is designed and fabricated using MIC technology which combines multiple MMIC chips on a thin film substrate. Modified Wilkinson power dividers/combiners and CBFGCPW-Microstrip transitions for suppressing resonance and reducing connection loss are utilized for high-gain and high-power millimeter wave modules. A new TTL pulse timing control scheme is proposed to improve output power degradation due to large bypass capacitors in the gate bias circuit. Pulse-mode operation time is extended more than 200 nsec and output power increase of 0.62 W is achieved by applying the proposed scheme to the Ka-band 10 W power amplifier module operating in the pulsed condition of 10 kHz and $5\;{\mu}sec$. The implemented power amplifier module shows a power gain of 59.5 dB and an output power of 11.89 W.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.5C
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• pp.522-529
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• 2002

MMIC circuits in whole receiver system was fabricated based on GaAs pHEMT technology. And a V-band downconverter module was fabricated by integrating these circuits. The downconverter module consists of a LO drive power amplifier which generates 24dBm output power, a low noise amplifier(LNA) which shows 20 dB small signal gain, an active parallel feedback oscillator which generates 1.6 dBm output power, and a cascode mixer which shows over 6dB conversion gain. The good conversion gain performance of our mixer made no need to attach any IF amplifier which grows conversion gain. Measured results of the complete downconverter show a conversion gain of over 20 dB between 57.5 GHz and 61.7GHz without IF amplifier.

• Journal of Satellite, Information and Communications
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• v.5 no.2
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• pp.82-86
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• 2010

In this paper, a power amplifier module for WCDMA base-station applications is designed and implemented using GaN field-effect transistors (FETs), which uses an envelope tracking bias system. The designed module consists of an high gain MMIC amplifier, a driver amplifier, a power amplifier, and bias circuits for envelope tracking applications. Especially, a FET bias sequencing circuit and two isolators are integrated for stable RF operations. All circuits are assembled within a single housing, so its dimension is just $17.8{\times}9.8{\times}2.0\;cm3$. Measured results show that the developed power amplifier module has good envelope tracking capability: the power-added efficiency of 35% at the output power range from 30dBm to 40dBm over a wide range of drain bias.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1331-1336
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• 2014

In this study, we have implemented a PAM(Power Amplifier Module) with 25W output power using by cooperate divider/Combiner circuit in X-band to minimize combine loss on a Al2O3 substrate. The PAM(Power Amplifier Module) is consisted of MMIC and 10way traveling wave divider/Combiner with proposed structure what have showed that 45.2dBm output power, 16dB gain, PAE 26 % and 17dBc@44dBm IMD3 characteristics. This combine/divider structure can be used when multistage passive divider and combiner needs. especially, power amplifier with very compact size.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.7
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• pp.1156-1160
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• 2000

The cancellation loop configuration for power amplifier module is proposed to reject the RX signals using feed-forward technique. In this paper, we implement the 1W-ampilfier module of WLL band to show validity of the proposed cancellation loop. The power amplifier module with the proposed cancellation loop can provide low TX insertion path loss due to duplexer and choice of loose RX attenuation characteristic for various wireless communication systems. It shows at least 90 % improved RX rejection characteristic compared to power amplifier module without RX band cancellation loop.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.2
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• pp.83-90
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• 2000

A simple low-cost and small size 1.88-198 GHz Band RF power amplifier module is developed for IMT2000 repeater. The power amplifier consists of two stage amplifiers that the first stage amplifier is drive amplifier using discrete type P-HEMT (ATF-34143, 800 micron gate width, Agilent Technologies) and the second is power amplifier with 300Bm 1dB gain compression point using GaAs FET(EFA240D-SOT89, 2400 micron gate width, Excelics Semiconductor). this power amplifier module feature a 29.5dBm 1dB gain compression point, 29.5dB gain, 42dBm 3rd order intercept point(OIP3) and -10dB/-l2dB input/output return loss over the 1880-1980 MHz. This PA module is fully integrated using MIC technology into a small size and design by full nonlinear design technologies. The dimensions of this PA module are 42(L) $\times$ 34(W) mm.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.3
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• pp.421-432
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• 2020

This paper proposes a 2-kW solid-state power amplifier (SSPA) developed by employing power amplifier pallets designed using gallium-nitride high electron mobility transistors, which is used in S-band military radars and to replace existing traveling-wave tube amplifier (TWTA). The SSPA consists of a high-power amplifier module, which combines eight power amplifier pallets, a drive amplifier module, a digital control module, and a power supply unit. First, the amplifier module and component were integrated into a small package to account for space limitations; next, an on-board harmonic filter was fabricated to reject spurious components; and finally, an auto gain control system was designed for various duty ratios because recent military radar systems are all active phase radars using the pulse operation mode. The developed SSPA exhibited a max gain of 48 dB and an output power ranging between 63-63.6 dBm at a frequency band of 3.1 to 3.5 GHz. The auto gain control function showed that the output power is regulated around 63 dBm despite the fluctuation of the input power from 15-20 dBm. Finally, reliability of the developed system was verified through a temperature environment test for nine hours at high (55 ℃) / low (-40℃) temperature profile in accordance with military standard 810. The developed SSPA show better performance such as light weight, high output, high gain, various safety function, low repair cost and short repair time than existing TWTA.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.5 no.1 s.9
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• pp.13-19
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• 2006

In this paper, a broadband Microwave Power Module(MPM) operating at 7 - 11 GHz is designed and fabricated. The MPM consists of a SSA (Solid State Amplifier) and a conventional TWT (traveling Wave Tube). This combined module takes advantage of a low noise and high gain of SSA. The computer modeling and simulation of the SSA are designed by the use of the ADS (Advanced Design System) software. The SSA is designed by configurating the CSSDA (Cascaded Single Stage Distributed Amplifier). The broadband MPM is measured to be noise figure 8.3 - 10.02 dB at 7 - 11 GHz bandwidth, output power of 38.12 dBm at 9 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.162-172
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• 2011

In this paper, a design and fabrication of 4 W power amplifier for the WiMAX frequency band(2.3~2.7 GHz) are presented. The adopted active device is a commercially available GaN HEMT chip of Triquint Company, which is recently released. The optimum input and output impedances are extracted for power amplifier design using a specially self-designed tuning jig. Using the adopted impedances value, class-F power amplifier was designed based on EM simulation. For integration and matching in the small package module, spiral inductors and interdigital capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 50 % and harmonic suppression above 40 dBc for second(2nd) and third(3rd) harmonic at the output power of 36 dBm.