• Proceedings of the KIEE Conference
• /
• 2006.07c
• /
• pp.1351-1352
• /
• 2006

In this paper, the impedance properties of degraded thyristor with heat and voltage were presented. As degraded thyristor, 8 thyristors with each other different reverse blocking voltage used. Its impedance and resistance properties were measured from frequency 100Hz to 10MHz applied with bias voltage from 0V to 40V. As a result, at low frequency region, that is, at the frequency 100-10kHz, the abrupt increasement of its capacitance was confirmed. And also, at high frequency region, the capacitance peak move toward low frequency in the region of frequency 4 - 6MHz as degradation of thyristor.

• Proceedings of the KIEE Conference
• /
• 2006.07c
• /
• pp.1309-1310
• /
• 2006

사이리스터 소자의 신뢰성은 HVDC, SVC, FACTs와 같은 대용량 전력 시스템의 신뢰성에 많은 영향을 미친다. 따라서 사이리스터 소자의 신뢰성을 분석하는 것은 시스템의 안정적인 운용과 신뢰성의 확보에 필수적이다. 본 논문에서는 장시간동안 전압 및 열을 인가하여 사이리스터를 가속열화 시켰을 때 사이리스터 소자의 차단전압 및 누설전류 특성의 변화에 대해 실험을 통해 분석하였다. 가속열화 시험에는 14개의 사이리스터가 사용되었고, 1000V, $100^{\circ}C$의 조건에서 가속열화를 진행하였으며, 7일에서 10일의 간격으로 소자의 누설전류 및 차단전압 특성을 측정하여 초기 특성과 비교 분석하였다.

• Journal of Power Electronics
• /
• v.10 no.6
• /
• pp.643-646
• /
• 2010

An interactive web-based teaching tool for a power semiconductor course at the University of Central Florida is presented in this paper. A novel approach is introduced using Technology Aided Design Tools (TCAD) to generate time-lapsed 2D semiconductor device cross-section embedded in a webpage using $Adobe^{(R)}$ Flash (web design tool) platform to create interactive movies that demonstrate complex device physical phenomenon. Students can step through the interactive movies forward, backward, pausing, or looping. Each step represents a giving bias condition. Current-voltage plots are represented along with the semiconductor device and a visual point is placed on the IV curve to indicate the current bias conditions. The changes are then reflected in the 2D cross-section movie area and the IV plot. This tool was implemented in a classroom setting to augment the lectures or for discovery learning.

• Proceedings of the KIPE Conference
• /
• 2015.07a
• /
• pp.487-488
• /
• 2015

New inverter motor drive systems consume 30%~50% less energy compared to existing motor drive systems. For inverter motor drive systems, the development of a 1200V high side driver is critical. This paper presents an advanced 1200V high side driver with low power consumption and high ruggedness. This solution implements a high voltage level shifter which consumes low power by adding a clamped VGS LDMOS driver to the conventional short pulse generator. Moreover, this paper proposes a highly rugged 1200V LDMOS which improves SOA by limiting the hole current. This paper could be applied to smart power modules used for HVAC (heating, ventilation, and airconditioning) and industrial inverters. Consequently, this paper will provide design engineers with an understanding of how they can make a significant contribution to worldwide energy savings.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.361-364
• /
• 2004

Surface doped SOI RESURF LDMOSFET with recessed source region is proposed to improve the on- and off-state characteristics. Surface region of the proposed LDMOS structure is doped like step. The characteristics of the proposed LDMOS is verified by two-dimensional process simulator ATHENA and device simulator ATLAS[1]. The numerically calculated on-resistance($R_{ON}$) of the proposed LDMOS is $10.36\Omega-cm$ and breakdown voltage is 205V when $L_{dr}=7{\mu}m$ with step doped surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.365-368
• /
• 2004

Charge compensation effects in multi-resurf structure make possible to obtain high breakdown volatage and low on-resistance in vertical MOSFET. In this paper, electrical characteristics of the vertical MOSFET with multi epitaxial layer is presented. Proposed device has n and p-pillar for obtaining the charge compensation effects and The doping concentration each pillar is varied from $5{\times}10^{14}\;to\;1{\times}10^{16}/cm^3$. The thickness of the proposed device also varied from $400{\mu}m\;to\;500{\mu}m$. Due to the charge compensation effects, 4500V of breakdown voltage can be obtained.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.14 no.4
• /
• pp.495-502
• /
• 2014

Fast recovery diodes (FRDs) were developed using the $p^{{+}{+}}/n^-/n^{{+}{+}}$ epitaxial layers grown by low temperature epitaxy technology. We investigated the effect of electrostatic discharge (ESD) stresses on their electrical and switching properties using current-voltage (I-V) and reverse recovery time analyses. The FRDs presented a high breakdown voltage, >450 V, and a low reverse leakage current, < $10^{-9}$ A. From the temperature dependence of thermal activation energy, the reverse leakage current was dominated by thermal generation-recombination and diffusion, respectively, at low and high temperature regions. By virtue of the abrupt junction and the Pt drive-in for the controlling of carrier lifetime, the soft reverse recovery behavior could be obtained along with a well-controlled reverse recovery time of 21.12 ns. The FRDs exhibited excellent ESD robustness with negligible degradations in the I-V and the reverse recovery characteristics up to ${\pm}5.5$ kV of HBM and ${\pm}3.5$ kV of IEC61000-4-2 shocks. Likewise, transmission line pulse (TLP) analysis reveals that the FRDs can handle the maximum peak pulse current, $I_{pp,max}$, up to 30 A in the forward mode and down to - 24 A in the reverse mode. The robust ESD property can improve the long term reliability of various power applications such as automobile and switching mode power supply.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1678-1679
• /
• 2007

This paper is the electric power system remote control of semiconductor plasma manufacturing equipment using PLC(power line communication). PLC is useful for economical data link but various problems and limitations are caused in using power lines for communications channel Develop of Semiconductor plasma manufactur ing equipment and remote automation technologies of tool develops day after day and standards. Also, Remote electric power control and device module control by GUIRCS(Graphic User Interface Remote Control System) of tool are monitoring in real time.

• Journal of the Korean Society of Industry Convergence
• /
• v.24 no.4_1
• /
• pp.411-419
• /
• 2021

In this study, IGBT_Total_Loss and DIODE_Total_Loss were used to analyze the slope of the junction temperature for each section for temperature and duty variables in order to simply calculate the junction temperature of the power semiconductor (IGBT). As a result of the calculation, IGBT_Max_Junction_Temp and DIODE_Max_Junction_Temp form a proportional relationship with temperature for each duty. This simulation data shows that the power loss of a power semiconductor is calculated in a complex manner according to the current dependence index, voltage dependence index, and temperature coefficient. By applying the slope for each condition and section, the junction temperature of the power semiconductor can be calculated simply.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.6 no.3
• /
• pp.175-181
• /
• 2006

Wide band-gap semiconductor electron devices have made great progresses to produce very high power amplifiers for various wireless standards. The advantages of wide band-gap electronic devices and their progresses are summarized in this paper.