• Title/Summary/Keyword: Power MOSFETs

Search Result 171, Processing Time 0.037 seconds

A Novel High-Frequency using Self-Quenching Power Semiconductor Switching Devices (자기 소호형 소자를 사용한 신방식 고주파 인버터)

  • Yoo, Dong-Wook;Wee, Sang-Bong;Kim, Dong-Hee;Bae, Jin-Ho;Oh, Seang-Hoon
    • Proceedings of the KIEE Conference
    • /
    • 1989.07a
    • /
    • pp.522-526
    • /
    • 1989
  • Recently developments of high-speed Semi-conductor Switches as Power MOSFETS, Power IGBT, power SIT have enwidened the performance of classical inverter configuration, and also allowed the practical applications of new inverter configuration, with improved performance and wider operating zones. Static power converters are now used in a great variety of applications including induction heating, high-frequency generation, DC/DC power converter, etc.

  • PDF

Considerations on the use of a Boost PFC Regulator Used in Household Air-conditioning Systems (over 3kW)

  • Jang Ki-Young;Suh Bum-Seok;Kim Tae-Hoon
    • Proceedings of the KIPE Conference
    • /
    • 2002.07a
    • /
    • pp.589-592
    • /
    • 2002
  • The CCM (Continuous Conduction Mode) boost topology is generally used in the PFC (Power Factor Correction) regulator of household air-conditioning systems. There are three kinds of power devices-bridge rectifier diodes, FRDs (Fast Recovery Diodes), and IGBTs (or MOSFETs) - used In a boost PFC regulator. Selecting the appropriate device is very cumbersome work, specially, in the case of FRDs and IGBTs, because there are several considerations as described below: 1) High frequency leakage current regulation (conducted and radiated EMI regulation) 2) Power losses and thermal design 3) Device cost. It should be noted that there are trade-offs between the power loss characteristic of 2) and the other characteristics of 1) and 3). This paper presents a detailed evaluation by using several types of power devices, which can be unintentionally used, to show that optimal selection can be achieved. Based on the given thermal resistances, thermal analysis and design procedures are also described from a practical viewpoint.

  • PDF

A Three-Phase AC-DC High Step-up Converter for Microscale Wind-power Generation Systems

  • Yang, Lung-Sheng;Lin, Chia-Ching;Chang, En-Chih
    • Journal of Power Electronics
    • /
    • v.16 no.5
    • /
    • pp.1861-1868
    • /
    • 2016
  • In this paper, a three-phase AC-DC high step-up converter is developed for application to microscale wind-power generation systems. Such an AC-DC boost converter prossessess the property of the single-switch high step-up DC-DC structure. For power factor correction, the advanced half-stage converter is operated under the discontinuous conduction mode (DCM). Simulatanously, to achieve a high step-up voltage gain, the back half-stage functions in the continuous conduction mode (CCM). A high voltage gain can be obtained by use of an output-capacitor mass and a coupled inductor. Compared to the output voltage, the voltage stress is decreased on the switch. To lessen the conducting losses, a low rated voltage and small conductive resistance MOSFETs are adopted. In addition, the coupled inductor retrieves the leakage-inductor energy. The operation principle and steady-state behavior are analyzed, and a prototype hardware circuit is realized to verify the performance of the proposed converter.

High-Frequency Soft-Switching PWM DC-DC Power Converter for Low Voltage Large Current Applications

  • Muraoka Hidekazu;Sakamoto Kenya;Nakaoka Mutsuo
    • Proceedings of the KIPE Conference
    • /
    • 2001.10a
    • /
    • pp.198-202
    • /
    • 2001
  • This paper presents a novel prototype version of ZCS-PWM forward DC-DC power converter using power MOSFETs which is designed for application specific low voltage large current conversion operation. The soft-switching forward power converter with a high frequency isolated transformer link which can efficiency operate over wide load ranges under two conditions of ZCS as well as active voltage clamped switching is evaluated and discussed on the basis of the simulation and experimental results.

  • PDF

A Study on Electrical Characteristic Improvement & Design Parameters of Power MOSFET with Single Floating Island Structure (단일 Floating Island 구조 Power MOSFET의 전기적 특성 향상과 설계 파라미터에 관한 연구)

  • Cho, Yu Seup;Sung, Man Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.28 no.4
    • /
    • pp.222-228
    • /
    • 2015
  • Power MOSFETs (metal oxide semiconductor field effect transistor) operate as energy control semiconductor switches. In order to reduce energy loss of the device, it is essential to increase its conductance. However, a trade-off relationship between the breakdown voltage and conductance of the device have been the critical difficulty to improve. In this paper, theoretical analysis of electrical benefits on single floating island power MOSFET is proposed. By the method, the optimization point has set defining the doping limit under single floating island structure. The numerical multiple 2.22 was obtained which indicates the doping limit of the original device, improving its ON state voltage drop by 45%.

Switching Loss and Performance Analysis of the Buck Converter using Si and SiC devices (Si 및 SiC 소자를 이용한 벅 컨버터의 스위칭 손실 및 성능 분석)

  • Lim, J.W.;Choe, J.M.;Cho, Y.H.;Cheo, G.H.
    • Proceedings of the KIPE Conference
    • /
    • 2014.07a
    • /
    • pp.411-412
    • /
    • 2014
  • In this paper, the switching losses and performances of Silicon Carbide(SiC) and Silicon based on the MOSFETs have been compared. To do this experiment, the buck converter using both SiC and Si devices have been built and tested. As a result, it has been confirmed that the converter with SiC devices shows better efficiency and performance compared with the converter using Si devices.

  • PDF

Metal Gate Electrode in SiC MOSFET (SiC MOSFET 소자에서 금속 게이트 전극의 이용)

  • Bahng, W.;Song, G.H.;Kim, N.K.;Kim, S.C.;Seo, K.S.;Kim, H.W.;Kim, E.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2002.07a
    • /
    • pp.358-361
    • /
    • 2002
  • Self-aligned MOSFETS using a polysilicon gate are widely fabricated in silicon technology. The polysilicon layer acts as a mask for the source and drain implants and does as gate electrode in the final product. However, the usage of polysilicon gate as a self-aligned mask is restricted in fabricating SiC MOSFETS since the following processes such as dopant activation, ohmic contacts are done at the very high temperature to attack the stability of the polysilicon layer. A metal instead of polysilicon can be used as a gate material and even can be used for ohmic contact to source region of SiC MOSFETS, which may reduce the number of the fabrication processes. Co-formation process of metal-source/drain ohmic contact and gate has been examined in the 4H-SiC based vertical power MOSFET At low bias region (<20V), increment of leakage current after RTA was detected. However, the amount of leakage current increment was less than a few tens of ph. The interface trap densities calculated from high-low frequency C-V curves do not show any difference between w/ RTA and w/o RTA. From the C-V characteristic curves, equivalent oxide thickness was calculated. The calculated thickness was 55 and 62nm for w/o RTA and w/ RTA, respectively. During the annealing, oxidation and silicidation of Ni can be occurred. Even though refractory nature of Ni, 950$^{\circ}C$ is high enough to oxidize it. Ni reacts with silicon and oxygen from SiO$_2$ 1ayer and form Ni-silicide and Ni-oxide, respectively. These extra layers result in the change of capacitance of whole oxide layer and the leakage current

  • PDF

Optimization of 1.2 kV 4H-SiC MOSFETs with Vertical Variation Doping Structure (Vertical Variation Doping 구조를 도입한 1.2 kV 4H-SiC MOSFET 최적화)

  • Ye-Jin Kim;Seung-Hyun Park;Tae-Hee Lee;Ji-Soo Choi;Se-Rim Park;Geon-Hee Lee;Jong-Min Oh;Weon Ho Shin;Sang-Mo Koo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.37 no.3
    • /
    • pp.332-336
    • /
    • 2024
  • High-energy bandgap material silicon carbide (SiC) is gaining attention as a next-generation power semiconductor material, and in particular, SiC-based MOSFETs are developed as representative power semiconductors to increase the breakdown voltage (BV) of conventional planar structures. However, as the size of SJ (Super Junction) MOSFET devices decreases and the depth of pillars increases, it becomes challenging to uniformly form the doping concentration of pillars. Therefore, a structure with different doping concentrations segmented within the pillar is being researched. Using Silvaco TCAD simulation, a SJ VVD (vertical variation doping profile) MOSFET with three different doping concentrations in the pillar was studied. Simulations were conducted for the width of the pillar and the doping concentration of N-epi, revealing that as the width of the pillar increases, the depletion region widens, leading to an increase in on-specific resistance (Ron,sp) and breakdown voltage (BV). Additionally, as the doping concentration of N-epi increases, the number of carriers increases, and the depletion region narrows, resulting in a decrease in Ron,sp and BV. The optimized SJ VVD MOSFET exhibits a very high figure of merit (BFOM) of 13,400 KW/cm2, indicating excellent performance characteristics and suggesting its potential as a next-generation highperformance power device suitable for practical applications.

A New Three Winding Coupled Inductor-Assisted High Frequency Boost Chopper Type DC-DC Power Converter with a High Voltage Conversion Ratio

  • Ahmed Tarek;Nagai Shinichiro;Hiraki Eiji;Nakaoka Mutsuo
    • Journal of Power Electronics
    • /
    • v.5 no.2
    • /
    • pp.99-103
    • /
    • 2005
  • In this paper, a novel circuit topology of a three-winding coupling inductor-assisting a high-frequency PWM boost chopper type DC-DC power converter with a high boost voltage conversion ratio and low switch voltage stress is proposed for the new energy interfaced DC power conditioner in solar photovoltaic and fuel cell generation systems. The operating principle in a steady state is described by using its equivalent circuits under the practical condition of energy processing of a lossless capacitive snubber. The newly-proposed power MOSFET boost chopper type DC-DC power converter with the three-winding coupled inductor type transformer and a single lossless capacitor snubber is built and tested for an output power of 500W. Utilizing the lower voltage and internal resistance power MOSFET switch in the proposed PWM boost chopper type DC-DC power converter can reduce the conduction losses of the active power switch compared to the conventional model. Therefore, the total actual power conversion efficiency under a condition of the nominal rated output power is estimated to be 81.1 %, which is 3.7% higher than the conventional PWM boost chopper DC power conversion circuit topology.

A Study on Gate driver with Boot-strap chain to Drive Multi-level PDP Driver Application (Multi-level PDP 구동회로를 위한 Gate driver의 Boot-strap chain에 관한 연구)

  • Nam, Won-Seok;Hong, Sung-Soo;SaKong, Suk-Chin;Roh, Chung-Wook
    • The Transactions of the Korean Institute of Power Electronics
    • /
    • v.11 no.2
    • /
    • pp.120-126
    • /
    • 2006
  • A gate driver with Boot-strap chain is proposed to drive Multi-level PDP sustain switches. The proposed gate driver uses only one boot-strap capacitor and one diode per each MOSFETs switch without floating power supply. By adoption of this gate driver circuits, the size, weight and the cost of the driver board can be reduced.