• 한국재료학회지
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• 제15권1호
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국표면공학회지
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• 제27권5호
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• pp.261-272
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• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• 한국전기전자재료학회논문지
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• 제18권2호
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• pp.148-152
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• 2005

Atmospheric low-temperature plasma was produced using dielectric barrier discharge (DBD) plate-type plasma reactor and high frequency of 13.56 Hz. The surfaces of polyimide films for insulating and packaging materials were treated by the atmospheric low-temperature plasma. The contact angle of 67$^{\circ}$ was observed before the plasma treatment. The contact angle was decreased with deceasing the velocity of plasma treatment. In case of oxygen content of 0.2 %, electrode gap of 2 mm, the velocity of plasma treatment of 20 mm/sec, and input power of 400 W, the minimum contact angle of 13$^{\circ}$ was observed. The chemical characteristics of polyimide film after the plama treatment were investigated using X-ray photoelectron spectroscopy (XPS), and new carboxyl group bond was observed. The surfaces of polyimide films were changed into hydrophilic by the atmospheric low-temperature plasma. The polyimide films having hydrophilic surface will be very useful as a packaging and insulating materials in electronic devices.

• 한국전기전자재료학회논문지
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• 제15권5호
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• pp.393-397
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• 2002

Polyimide (PI) films have been studied widely as the interlayer dielectric materials due to a low dielectric constant, low water absorption, high gap-fill and planarization capability. The polyimide film was etched using inductively coupled plasma system. The etcying characteristics such as etch rate and selectivity were evaluated at different $CF_4/(CF_4+O_2)$chemistry. The maximum etch rate was 8300 ${\AA}/min$ and the selectivity of polyimide to SiO$_2$was 5.9 at $CF_4/(CF_4+O_2)$ of 0.2. Etch profile of polyimide film with an aluminum pattern was measured by a scanning electron microscopy. The vertical profile was approximately $90^{\circ}$ at $CF_4/(CF_4+O_2)$ of 0.2. As 20% $CF_4$ were added into $O_2$ plasma from the results of the optical emission spectroscopy, the radical densities of fluorine and oxygen increased with increasing $CF_4$ concentration in $CF_4/O_2$ from 0 to 20%, resulting in the increased etch rate. The surface reaction of etched PI films was investigated using x-ray photoelectron spectroscopy.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.594-597
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• 2023

We have proposed and demonstrated a fiber optic RH (relative humidity) sensor based on fiber Bragg grating covered with a polyimide film. As the polyimide film absolves the moisture in the air, its volume expands. As a result, the grating period of the FBG (fiber Bragg grating) covered with a polyimide film becomes wide and the Bragg wavelength is shifted. The sensor is implemented by fixing a 30 ㎛ thickness polyimide film on the surface of an optical fiber grating using an adhesive, and the characteristics of the device according to humidity are analyzed. The fabricated FBG RH sensor showed a high sensitivity of 0.0186 nm/RH% and a wide measurement range from 30% to 90%. The influence of environmental temperature on the characteristics of the RH sensor was also measured and analyzed. The feasibility of commercialization is presented.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1442-1446
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• 2006

In this paper, the response surface modeling of the pretilt angle control in the nematic liquid crystal (NLC) on the homogeneous polyimide surface with different surface treatment is investigated The rubbing strength and the hard baking temperature are considered as input factors. After the design of experiments is performed, the process model is then explored using the response surface methodology. The analysis of variance is used to analyze the statistical significance and the effect plots are also investigated to examine the relationship between the process parameters and the response.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.1078-1081
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• 2003

The polar anchoring strength and surface ordering in a NLC, 4-n-pentyl-4'-cyanobiphenyl (5CB), on a rubbed polyimide (PI) surface containing trifluoromethyl moiety were studied. The large extrapolation length de of 5CB for washing process of water was measured at RS=114 mm. The polar anchoring energy of 5CB on the rubbed PI surface is decreased by the washing process. Also, the polar anchoring energy of 5CB increases with the rubbing strength on the PI surface. The surface ordering of 5CB for all washing processes is smaller than the non-washing process; it is attributed to the washing process.

• E2M - 전기 전자와 첨단 소재
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• 제10권9호
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• pp.876-880
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• 1997

In this paper we investigated the transcription of liquid crystal (LC) alignment method by using memory effect of nematic(N) LCon polymide(PI) surface with side chain as for non-rubbing alignment techniques. That the monodomain alignment of aligned NLC is observed by microscope textures in the cells on PI surface with side chain. We obtained that the pretilt angle of NLC are generated about 3.7$^{\circ}$on PI surface. We suggest that the LC alignment by using transcription alingnment method is attributed to memory effect of NLC on PI surface.

• 한국전기전자재료학회논문지
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• 제15권9호
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• pp.808-811
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• 2002

We investigated response characteristics of twisted nematic (TN) cell with different nematic liquid crystals (NLCs) and cell gap d on a rubbed polyimide (PI) surface. High transmittance and fast response time of the TN cell on the rubbed PI surface were achieved by using high birefringence (Δn) and low cell gap d. The response time of TN cell on the rubbed PI surface was measured 5.1 ms. The transmittance and response time of the TN cell on the rubbed PI surface decreased with decreasing Δnd.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.369-372
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• 2004

Photo-induced surface alignment is charming as a non-contact photo-patternable alignment technology which can be used in the next generation of displays, such as large area, multi-domain. For decades, many polymer film have been investigated and developed to be used in the photo alignment. Among these photoreactive materials, recently developed polyimide, Chloromethylated Polyimide(CMPI) now became the focus of interests in this area because of its high photosensitivity and superior thermal stability. In this report, we present micro patterning method to form the nanoscale structure by Mask-Less laser patterning using this CMPI film and NSOM probe.