• 제목/요약/키워드: Polishing time

검색결과 300건 처리시간 0.027초

A Study on the Construction of Cutting Scenario for Kori Unit 1 Bio-shield considering ALARA

  • Hak-Yun Lee;Min-Ho Lee;Ki-Tae Yang;Jun-Yeol An;Jong-Soon Song
    • Nuclear Engineering and Technology
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    • 제55권11호
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    • pp.4181-4190
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    • 2023
  • Nuclear power plants are subjected to various processes during decommissioning, including cutting, decontamination, disposal, and treatment. The cutting of massive bio-shields is a significant step in the decommissioning process. Cutting is performed near the target structure, and during this process, workers are exposed to potential radioactive elements. However, studies considering worker exposure management during such cutting operations are limited. Furthermore, dismantling a nuclear power plant under certain circumstances may result in the unnecessary radiation exposure of workers and an increase in secondary waste generation. In this study, a cutting scenario was formulated considering the bio-shield as a representative structure. The specifications of a standard South Korean radioactive waste disposal drum were used as the basic conditions. Additionally, we explored the hot-to-cold and cold-to-hot methods, with and without the application of polishing during decontamination. For evaluating various scenarios, different cutting time points up to 30 years after permanent shutdown were considered, and cutting speeds of 1-10nullm2/h were applied to account for the variability and uncertainty attributable to the design output and specifications. The obtained results provide fundamental guidelines for establishing cutting methods suitable for large structures.

Improvement of Corrosion Resistance of Aluminum Alloy with Wettability Controlled Porous Oxide films

  • Sakairi, M.;Goyal, V.
    • Corrosion Science and Technology
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    • 제15권4호
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    • pp.166-170
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    • 2016
  • The combined process of porous type anodizing and desiccation treatment was applied to improve wettability of A1050 aluminum alloy. The water contact angles of anodized samples were increaseds considerably with desiccation treatment. However, there was no considerable effect of polishing and anodizing time on water contact angle. The corrosion behavior with the treatments was investigated electrochemically. The corrosion resistance of the samples in 3.5 mass% NaCl solutions increased with higher contact angle. Anodized and desiccated samples showed better corrosion resistance than un-desiccated samples around rest potential region.

광역평탄화에 따른 투명전도박막의 표면특성 (Surface Properties of ITO Thin Film by Planarization)

  • 최권우;이우선;서용진
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.95-96
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    • 2006
  • ITO thin film is generally fabricated by various methods such as spray, CVD, evaporation, electron gun deposition, direct current electroplating, high frequency sputtering, and reactive DC sputtering. However, some problems such as peaks, bumps, large particles, and pin-holes on the surface of ITO thin film were reported, which caused the destruction of color quality, the reduction of device life time, and short-circuit. Chemical mechanical polishing (CMP) process is one of the suitable solutions which could solve the problems.

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STI 채널 모서리에서 발생하는 MOSFET의 험프 특성 (The MOSFET Hump Characteristics Occurring at STI Channel Edge)

  • 김현호;이천희
    • 한국시뮬레이션학회논문지
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    • 제11권1호
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    • pp.23-30
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    • 2002
  • An STI(Shallow Trench Isolation) by using a CMP(Chemical Mechanical Polishing) process has been one of the key issues in the device isolation[1] In this paper we fabricated N, P-MOSFEET tall analyse hump characteristics in various rounding oxdation thickness(ex : Skip, 500, 800, 1000$\AA$). As a result we found that hump occurred at STI channel edge region by field oxide recess. and boron segregation(early turn on due to boron segregatiorn at channel edge). Therefore we improved that hump occurrence by increased oxidation thickness, and control field oxide recess( 20nm), wet oxidation etch time(19HF,30sec), STI nitride wet cleaning time(99HF, 60sec+P 90min) and fate pre-oxidation cleaning time (U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

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컴퓨터 제어를 통한 광학 가공에서의 다양한 툴 영향 함수의 모델링 (Modeling of Various Tool Influence Functions in Computer Controlled Optical Surfacing)

  • 김기철;김영식;이혁교;김학성;양호순;이윤우
    • 한국정밀공학회지
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    • 제33권3호
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    • pp.167-172
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    • 2016
  • The computer controlled optical surfacing (CCOS) technique provides superior fabrication performance for optical mirrors when compared to the conventional method, which relies heavily on the skill of the optician. The CCOS technique provides improvements in terms of mass production, low cost, and short polishing time, and are achieved by estimating and controlling the moving speed of the tool and toolpath through a numerical analysis of the tool influence function (TIF). Hence, the exact estimation of various TIFs is critical for high convergence rates and high form accuracy in the CCOS process. In this paper, we suggest a new model for TIFs, which can be applied for various tool shapes, different velocity distributions, and non-uniform tool pressure distributions. Our proposed TIFs were also verified by comparisons with experimental results. We anticipate that these new TIFs will have a major role in improving the form accuracy and shortening the polishing time by increasing the accuracy of the material removal rate.

구름접촉에 의한 SM55C의 마멸 거동 (Wear behavior of SM55C steel by rolling contact)

  • 박범수;채영훈;김석삼
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.240-247
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    • 2002
  • The rolling wear behavior of SM55C is investigated under lubrication. This is a comparative tribological behavior of heat treatment effect for SM55C. Rolling wear test method is used for Ball-on-disk type. Specimens can be classified into two main groups: as-annealing and non-annealing. As result of wear behavior, flanking initial time of non-annealing specimen keep at retard but it have not under high normal load. One of the notable features of annealing specimen is steady flanking initial time for a normal load in this experiment. Failure mechanism of SM55C is due to the fatigue wear such like flanking, pitting etc.. Flanking leads to abruptly fracture of worn surface. Fracture mechanism has a connection with normal load and polishing direction of specimens.

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고속가공을 위한 정면밀링커터 바디시스템 개발 (Development of Face Milling Cutter Body System for High Speed Machining)

  • 장성민;맹민재;조명우
    • 한국정밀공학회지
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    • 제21권12호
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    • pp.21-28
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    • 2004
  • In modem manufacturing industries such as the airplane and automobile, aluminum alloys which are remarkable in durability have been utilized effectively. High-speed machining technology for surface roughness quality of workpiece has been applied in these fields. Higher cutting speed and feedrates lead to a reduction of machining time and increase of surface quality. Furthermore, the reduction of time required for polishing or lapping of machined surfaces improves the production rate. Traditional milling process for high speed cutting can be machined with end mill tool. However, such processes are generally cost-expensive and have low material removal rate. Thus, in this paper, face milling cutter which gives high MRR has developed face milling cutter body for the high speed machining of light alloy to overcome the problems. Also vibration experiment to detect natural frequency in free state and frequency characteristics during machining are performed to escape resonance.

Development of Multiple CMP Monitoring System for Consumable Designs

  • Park, Sun-Joon;Park, Boum-Young;Kim, Sung-Ryul;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • 제8권1호
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    • pp.11-14
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    • 2007
  • Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.

창의적 문제해결 이론을 이용한 소성역깊이 측정에 관한 연구 (A Study on the Measurement of Plastic Zone Depth using TRIZ)

  • 이동우;주원식
    • 한국기계가공학회지
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    • 제7권1호
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    • pp.62-66
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    • 2008
  • Machine parts subjected to fluctuating or cyclic loads induce repeated stresses that often result in failure by fatigue. In such cases, the fatigue failures unfortunately sometimes occur. These may arise from a lack of knowledge with regard to the design, fabrication and operation of the machines or structures. The failure analysis provides valuable information regarding the prevention of similar failures. Furthermore, this information will be useful to improve or to develop new products. Failure stress analysis is classified into X-ray fractography. X-ray fractography has the limited applications because of material crystal size, difficult measurement method, electrolytic polishing precision, and long test time. Therefore, this study proposed the new method to improve the measurement precision of plastic zone depth and test time using TRIZ.

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수치제어 데이터와 오프라인 프로그램을 이용한 연마 로봇 시스템 개발 (The Development of Grinding Robot System Using NC data and Off-line Programming)

  • 오영섭;유범상
    • 한국정밀공학회지
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    • 제16권3호통권96호
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    • pp.9-17
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    • 1999
  • This paper presents a method of grinding and polishing automation of precision die after CNC machining. The method employs a robot system equipped with a pneumatic spindle and a special abrasive film pad. The robot program is automatically generated off-line program form a PC and downloaded to robot controller. Position and orientation data for the program is supplied form cutter contact (CC) data of NC machining process. This eliminates separate robot teaching process. This paper aims at practical automation of die finishing process which is very time consuming and suffering from shortage of workpeople. Time loss due to changeover from one product to another is eliminated by PC off-line programming exploiting appropriate NC machining data. Dextrous 6-axis robot with rigid wrist and simple tooling enables the process applicable to larger, rather complex 3 dimensional free surfaces.

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