• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.943-946
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• 1997

Electropolishing is the controlled electrochemical removal of surface metal, resultmg in a brilliant appearance andimproved properties. Sometimes described as "reverse plating," the process has a leveling effect, which produces smoothnessand increased reflectivity. Unlike conventional mechanical finishing systems, the electropolishing does not smear, bend,stress or fracture the crystalline metal surface to achieve smoothness. Instead, electropolishing removes metal from thesurface producing a unidirectional pattern that is stress-free, microscopically smooth and often highly reflective. In addition,improved corrosion resistance and passivity are achieved on many ferrous and some non-ferrous alloys. Pure aluminium doesnot electropolish well, if at all, but most other alloys of aluminum electropolish excellently.Therefore, the aim of this study is to determine the characteristics of electropolishing aluminium alloy in term of currentdensity, machining time, temperature, electrode gap and workpiece surface measurementkpiece surface measurement

• Transactions of the Korean hydrogen and new energy society
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• v.4 no.2
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• pp.23-28
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• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.212-215
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• 2005

Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.175-178
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• 2004

The size and number of nano-size defects of thin trivalent chrome layers were determined by small angle neutron scattering (SANS) without breaking the thin chrome layers. Most of defect size of the trivalent chromium prepared in this test conditions is in the range of about 40nm. The number of nano-size defects less than about 40nm of the trivalent chromium layer increases with plating voltage at constant current density From this study, SANS is proved as one of useful techniques to evaluate nano-size defects of thin film layer.

• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.207-214
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• 1989

The surface morphology and the proferred orientation of the Pb-Sn alloy electrodeposite were investated by the change of electrolysis conditions in pulse current electroplating. The preferred orientation of Pb-phase in alloy deposits was changed in the sequence of (110)longrightarrow(100)or(100)+(111)longrightarrow(111) with increasing peak current density, while that of $\beta$-Sn phase changed from (321)+(301)to(301)+(111) mixed orientation. The surface morphology was closely related to the preferred orientation of alloy electrodeposits. The alloy deposits, which had (100)or(111) for pb-phase and (321)or(100)(301)for $\beta$-Sn sespectively, showed the surface structure of granular crystallites. The alloy deposits whih mixed orientations for both phases had microstructure of closely the closely stacked crysrallites, which was inclined to the surface.

• Journal of the Korean institute of surface engineering
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• v.13 no.4
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• pp.211-220
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• 1980

Internal stress of electrodeposited metals affect physical and mechanical characteristics of deposits. Internal stress of nickel deposits was reviewed intensively. Important outcomes are as follows. Substrate have an important effect on internal stress of electrodeposit. Origin of its internal stress could be explained mismatch of crystal lattice and coalescence of crystallites. When surface cleaning is not satisfying, instantaneous stress is low but the electrodeposited layer being thickened increasingly stress become to high and peeling phenomenon occurs. Effect of current density and temperature on internal stress is variable. Internal stress increases rapidly at pH 5 and above because of codepositing colloidal materials caused hydrolysis. Concentrations of nickel ion and $H_3BO_3$ ion affect little on internal stress and solution which contains impurities tend to increase stress. Especially impurities of $H_2O_2$ and iron ion have a great effect on internal stress. Additives are divided in two kind. One is increasing tensile stress another is increasing compressive stress. Concentrations of additives have a great effect on internal stress.

• Journal of the Korean institute of surface engineering
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• v.33 no.5
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• pp.356-364
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• 2000

Factors that affect the hardness of the zinc electrodeposits in the sulfate electrolyte were investigated. The hardness of zinc deposit was enhanced by increasing the concentration of impurities such as iron and nickel in the bath that changed the crystallographic orientation of the zinc deposit from the strong basal plane to the random orientation. The increase of the concentration of sodium sulfate and current density in iron contained bath improved the hardness of zinc deposit because those were easily codeposited in zinc layer. However the increase of the concentration of sodium sulfate up to 80g/$\ell$ in the bath darkened the surface of zinc electrodeposits due to change of morphology by the codeposition of iron.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.95-104
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• 1985

A study has been made of preferred orientation, crose sectional microstructure, surface morphology and mechanical properties of copper foils fabricated by electrodeposition on 304 stainless steel plate from copper sulfate baths for high speed plating. The preferred orientation of the copper foils changed from the [110] to the [111] to ture with decreasing bath temperature and increasing cathode current density. The foils with the [110] texture had the field oriented texture type structure and the surface of many asperities grooved approximately perpendicular to the subtrate. A specimen with the [111]+[311] texture had the lower strength than one with the [10] texture, if they were obtained under similar electrolysis conditions.