• 제목/요약/키워드: Plating conditions

검색결과 239건 처리시간 0.026초

Effect of bath conditions and pulse parameters on tin surface finish for microelectronic packaging applications

  • Sharma, Ashutosh;Jung, Do-hyun;Jung, Jae-pil
    • 한국표면공학회:학술대회논문집
    • /
    • 한국표면공학회 2015년도 추계학술대회 논문집
    • /
    • pp.232-233
    • /
    • 2015
  • The effects of various bath conditions such as surfactant concentration, bath pH, bath temperature, agitation of bath; as well as pulse parameters such as cathodic current density, pulse duty cycle and frequency, on the grain size, surface finish, and appearance of the tin plated coatings have been investigated. The plating bath under investigation is an aqueous acidic solution composed of a mixture of $SnSO_4$, $H_2SO_4$, and a surfactant. The bath conductivity and pH are measured by a glass pH electrode. The microstructure of the coatings produced is characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and surface profilometry. XRD analysis shows that the deposits consist of tetragonal ${\beta}$-Sn crystal structure irrespective of plating conditions. The mechanism involved in the morphology evolution in response to various parameters and conditions has also been discussed.

  • PDF

하이드로퀴논 환원제를 사용한 은코팅 구리 플레이크의 제조에서 공정 변수의 영향 (Effects of Process Variables on Preparation of Silver-Coated Copper Flakes Using Hydroquinone Reducing Agent)

  • 오상주;이종현
    • 마이크로전자및패키징학회지
    • /
    • 제24권3호
    • /
    • pp.57-62
    • /
    • 2017
  • 하이드로퀴논 환원제를 사용하는 무전해 은도금 방법으로 은(Ag)코팅 구리(Cu) 플레이크를 제조하는 공정에서 전처리 용액, 반응온도, pH, Ag 도금액 조성 및 주입속도, 펄프농도 등 여러 변수를 변화시켜가며 우수한 품질의 Ag 코팅이 형성되는 공정조건들을 확보하였다. Cu 플레이크 표면의 산화층을 제거하기 위한 효과적인 전처리 용액이 제시되었고, 낮은 반응온도, 4.34 수준의 pH값, 느린 Ag 도금액 주입속도, Ag 도금액에서 증류수 제거, 높은 펄프농도 조건에서 분리형 미세 Ag 입자들의 생성이 억제되고, Cu 표면 커버리지가 우수한 Ag 코팅층이 형성됨을 확인할 수 있었다.

Optimal Pre-Plating Method of Chicken Satellite Cells for Cultured Meat Production

  • Kim, So-Hee;Kim, Chan-Jin;Lee, Eun-Yeong;Son, Yu-Min;Hwang, Young-Hwa;Joo, Seon-Tea
    • 한국축산식품학회지
    • /
    • 제42권6호
    • /
    • pp.942-952
    • /
    • 2022
  • To establish a pre-plating method of chicken satellite cells with high purity, pre-plating was performed under culture conditions of 37℃ and 41℃, and the pre-plating time was set from a total of 3 hours to 6 hours in consideration of the cell attachment time. The purity of the cells was confirmed by staining paired box protein 7 (Pax7) after proliferation, and Pax7 expression was the highest in culture flasks shaken for 2 hours after incubation at 41℃ for 2 hours to prevent the attachment of satellite cells (p<0.05). Also, when pre-plating and proliferation were performed at 37℃ and 41℃, the Pax7 expression rate was higher at 41℃. The differentiation capabilities of the three groups (T3, T6, and T7) with high Pax7 expression were compared and the fusion index (%) and myotube formation area (%) determined by myosin heavy chain (MHC) staining was calculated. The T6 and T7 groups, which were cultured at 41℃, showed significantly higher values than the T3 group (p<0.05). There was no significant difference in the expression of Pax7 and MHC between the T6 and T7 groups (p>0.05). These results suggest that pre-plating at 41℃ for a total of 4 hours was the most efficient in terms of cost and time for purifying chicken satellite cells for cultured meat.

도금 및 CMP에 의한 Micro-Tip 제작 공정 연구 (A Study on Micro-Tip Fabrication by Plating and CMP)

  • 한명수;박창모;신광수;고항주;김두근;한수욱;김선훈;기현철;김효진;김장현
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
    • /
    • pp.152-152
    • /
    • 2009
  • We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.

  • PDF

은도금 중공미세구를 이용한 경량 전파흡수체의 제조 (Fabrication of Light Weighted Microwave Absorbers Using Silver-Coated Hollow Microspheres)

  • 김욱중;김선태;김성수;권순길;안준모;김근홍;천창환
    • 한국재료학회지
    • /
    • 제11권11호
    • /
    • pp.941-946
    • /
    • 2001
  • Conductive microspheres with a density of 0.2 g/cc were fabricated by electroless silver plating for application to the light-weighted microwave absorbers. The silver plating was conducted with the variation of plating conditions (sensitizing condition, $AgNO_3$, concentration, amount of reducing agent). Specimens have very low electro-resistivity. Under an optimum processing condition, conductive microspheres with uniform silver plating layer can be produced. Rubber-sphere composites were fabricated and their microwave absorbing properties were measured by HP8722D Network Analyzer. It was found that the lower the electrical resistance of microsphere, the better the microwave absorbing properties. Feasibility of microwave absorbers using this microspheres can be demonstrated with the result of microwave reflection loss of -15 dB and thickness of 1.44 mm.

  • PDF

다이아몬드 배열 무전해 니켈 도금층/무산소동 기판의 열전도도 특성 (Thermal Properties of Diamond Aligned Electroless Ni Plating Layer/Oxygen Free Cu Substrates)

  • 정다운;김송이;박경태;서석준;김택수;김범성
    • 한국분말재료학회지
    • /
    • 제22권2호
    • /
    • pp.134-137
    • /
    • 2015
  • The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

미세 배선 성형을 위한 전주용 동도금액의 특성 (Characteristics of Copper Plating Solutions for Electroforming of Microcircuit)

  • 박해덕;장도연;강성군
    • 한국재료학회지
    • /
    • 제11권10호
    • /
    • pp.820-832
    • /
    • 2001
  • In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

  • PDF

Tin-Cobalt 합금 도금공정에서 도금물성 향상을 위한 최적 용액조성 디자인 (Plating Solution Composition Control of Tin-Cobalt Alloy Electroplating Process)

  • 이승범;홍인권
    • 공업화학
    • /
    • 제17권2호
    • /
    • pp.150-157
    • /
    • 2006
  • 최근 들어 크롬대체 도금공정의 필요성이 대두되고 있는 가운데, 크롬도금과 색차가 적고 기계적 특성이 우수하며 환경 친화적인 주석 계 합금도금의 사용이 확대되고 있다. 따라서 본 연구에서는 Sn-Co 합금도금공정을 바탕으로 광택제, 착화제로서 glycine 사용에 대한 연구를 수행하고자 하였다. Sn-Co 합금도금과 glycine 첨가에 따른 물리적 특성 및 표면 광택측정을 위해 Hull-cell 분석 및 도금표면분석을 수행하였다. Hull-cell 분석결과 glycine의 첨가량이 증가함에 따라 광택특성은 우수한 것으로 관찰되었으며, 표면광택성이 가장 우수한 도금조건으로는 $50^{\circ}C$, pH = 8의 조건에서 전전류 공급량 1 A로 1 min간 도금한 경우 음극전류밀도 $1A/dm^2$인 영역을 추천할 수 있었다. 동일조건의 pilot 실험을 $10{\mu}m$ 두께로 Ni하지 도금 후 Sn-Co 합금도금액 기본조성인 0.03 M $SnCl_{2}{\cdot}2H_{2}O$, 0.05 M $CoSO_{4}{\cdot}7H_{2}O$, 0.7 M $K_{4}P_{2}O_{7}$의 혼합 용액에서 수행하 였다. $0.2{\sim}0.6 {\mu}m$의 도금두께를 갖는 Sn-Co 합금도금 표면의 기계적 특성과 도금표면의 성분분석 결과 glycine의 첨가량이 15 g/L일 때 우수한 밀착성, 내식성, 내마모성을 보였다. 따라서 Sn-Co 합금도금공정에 glycine을 첨가한 용액을 크롬도금공정의 최적 도금용액으로 추천할 수 있었다.

HCD이온플레이팅 방법을 이용한 zzTiC코팅에 관한 연구 (A Study on the TiC Coating Using Hollow Cathode Discharge Ion Plating)

  • 김인철;서용운;황기웅
    • 대한전기학회논문지
    • /
    • 제41권8호
    • /
    • pp.875-882
    • /
    • 1992
  • Titanium carbide(TiC) films, known as having excellent characteristics of resistance to wear and corrosion, were deposited on SUS-304 sheets using HCD(Hollow Cathode Discharge) reactive ion plating with acetylene gas as the reactant gas. The characteristics of TiC films were examined by X-ray diffraction, micro-Vickers hardness tester, ${\alpha}$-step, SEM(Scanning Electron Spectroscopy), ESCA(Electron Spectroscopy for Chemical Analysis), and AES(Auger Electron Spectroscopy) and the results were discussed with regard to the changes of various deposition conditions(bias voltage, acetylene flow rate, temperature).