• 한국표면공학회지
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• 제31권4호
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• pp.181-190
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• 1998

Al ion plating was carried to improve corrosion resistance of Nd-based permanent magnet made by prwder molding method. The effects of applied votage, pressyre and temperature were investigated to find the reation between coating parameters and their properties. Density of coating layer increased with voltage and thus corrosion resistance improved. However when voltage was applied more than 1000V, corrosion resistance whet down because of resputtering effect. Good corrosion resistance was acquired when gas pressure was $5.0\times10^-2$>torr, which is satisfied momentum energy of Ar, Al ions as well as quantity of plasma. The layer coated in low temperature range have better surface density and corrosion resistance than in high temperature. This result is seemed due to the characteristics of substrate itself. All coating layers were showed stong adhesion with substrate.

• 한국표면공학회지
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• 제50권5호
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• pp.373-379
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• 2017

Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.

• 한국분말재료학회지
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• 제13권1호
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• pp.18-24
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• 2006

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

• Journal of Magnetics
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• 제11권3호
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• pp.119-122
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• 한국해양공학회지
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• 제11권3호
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• pp.56-68
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• 1997

This work was intended to study the effect of a partial pressure ratio and a total pressure of reactive gases on the properties of TiC$_{x}$N$_{1-x}$ . coated layer. In this regard, various TiC$_{x}$N$_{1-x}$ coatings were synthesized with C2112 and N2 Mixture gas of different compositions by Arc Ion Plating process which has been highlighted for an industrial purpose. It was revealed from colors and X-ray diffraction patterns that the concentration of carbon of a TiC$_{x}$N$_{1-x}$ coating increases with a partial pressure ratio (PC$_{2}$H$_{2}$/PN$_{2}$) as well as a total pressure Of $C_{2}$H$_{2}$ and N$_{2}$ mixture gas. Accordingly, the hardness of TiC$_{x}$N$_{1-x}$ coated layer increased but the adhesion to the substrate of SKH 51 was degraded. On the other hand, the deposition rate was independent of a partial pressure ratio and a total pressure of mixture gas. It was found that a uniform gas distribution is critical for an industrial application since the composition of a coating depends strongly on the location of a substrate inside of the furnace. As a result of milling tests with different TiC$_{x}$N$_{1-x}$ coated end mills, the one which has a low carbon concentration was better than others studied in this work.d in this work.

• 열처리공학회지
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• 제20권2호
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• pp.78-83
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• 2007

CrN coatings were deposited by cathodic arc ion plating method on the SKD11 steel substrates. Atmosphere temperature of $350^{\circ}C$, arc current of 90 A, nitrogen partial pressure of 1.0-5.3 Pa, and negative bias voltage of 30-135 V were selected. The characteristics of microstructure were investigated with XRD. Hardness, adhesion and friction coefficient measured by microhardness tester, scratch tester, and ball on disk tribometer. Microstructures depended on nitrogen partial pressure and bias voltage. The preferred orientation of the films was changed from (200) to (111) with decreasing pressure and increasing bias voltage. Adhesion properties related with microstructure, but microstructure changes slightly influenced on hardness and friction properties. The critical load.($Lc_1$) and hardness of CrN films deposited at 5.3 Pa, -30 V condition were 55 N(HF1), $2157{\pm}47\;Hk_{0.025}$. The friction coefficient were about 0.5 under dry condition.

• 대한금속재료학회지
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• 제48권12호
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• Current Photovoltaic Research
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• 제4권4호
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1589-1592
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• 1994

We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.

• 한국표면공학회지
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• 제32권3호
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• pp.447-451
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• 1999

Silver has the highest electrical conductivity of all metals and consequently this property is an attractive feature which makes it a leading candidate for use in electronic devices. The research conducted was focused primarily on the development of a process for obtaining a deposited silver-coating onto alumina, for applications related to electrical-conducting devices and, ancillarily, catalysts. Alumina balls and plane substrates were utilized for the investigation. The coating process employed an aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives-an activator which would be expected to promote good deposition-characteristics onto the (dielectric) substrate and an inhibitor which would obviate homogeneous reduction (precipitation) of silver was observed when the activator-containing silver-electrolyte reductant constituents were combined. However, the silver-electrolyte/reductant system with inhibitor could be employed (at 8$0^{\circ}C$) to achieve a viable (subject to future research optimization) coating on alumina. The influence of the processing temperature on the deposition process was delineated during the course of the research. The morphology of the deposited-silver on the alumina balls was assessed by SEM imaging. A tape-peel test was employed, with the plane substrates, to semi-quantitatively characterize the adhesion to the alumina.