• Corrosion Science and Technology
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• 제3권1호
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• pp.26-29
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• 2004

Metal plated plastics are becoming more prevalent in materials of communication parts. A new technique MmSH is a process of injecting plastics to produce innovated physical properties compared to the conventional injection process. This study involves two ways of coating plastics Ni by electroless plating and varying bath and plasma treatment for improved adhesion strength between plating layer and surface. MmSH injection processed ASS with plasma treated after neutralization showed a superior adhesion force and a gloss and rate of deposition when it was in pH 7.5. On the other hand, conventional injection processed ASS was in pH 6.5.

• 한국재료학회지
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• 제11권11호
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• pp.923-928
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• 2001

An electrolytic silver plating process has been successfully developed for terminated electrode parts of dielectric ceramic resonator. High adhesion strength and high Qu is obtained and blister occurance is minimized under plating condition with $HNO_3$750 $m\ell/\ell$ and HF $ 250m\ell/\ell$ solution at $25^{\circ}C$ for 20 minutes. Adhesion strength has the highest value, 3.2 kg/mm$^2$ at etching temperature of $25^{\circ}C$. Adhesion strength, Qu and blister occurance are monotonically increased with the thickness of electrodeposition layer. In case of electrodeposition of Ag, Qu value of 380 has obtained higher than in case of electrolytic Cu plating with Qu value of 325. Therefore, terminated electrode parts of dielectric ceramic resonator reducing dielectric loss can be obtained using prensent process.

• Journal of Mechanical Science and Technology
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• 제17권12호
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• pp.1904-1911
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• 2003

In order to determine the wear properties of AIP (Arc Ion Plating) deposition, wear process was evaluated by using a Falex test machine. Also, in order to determine the effects of coating material on the wear process, TiC, TiN, and TiCN coatings of thickness about 5 $\mu\textrm{m}$∼6 $\mu\textrm{m}$ coated by Arc ion plating deposition method were tested. The wear property was determined under a dry sliding condition as a function of the applied load, sliding distance, sliding velocity and temperature. The results show that when wear of the coating-layer occurred, specific wear amount increased with the wear rate. At initial state, the wear rate rapidly increased, but it gradually reduced as the velocity increased. Also, when raising the temperature, the wear rate increased in the order of TiCN, TiN and TiC due to the frictional heat.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.93-94
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• 2005

Cu metallization using electrochemical plating(ECP) has played an important role in back end of line(BEOL) interconnect formation. In this work, we studied the optimized copper thickness using Bottom-up Gap-fill in Cu ECP, which is closely related with the pattern dependencies in Cu ECP and Cu dual damascene process at 0.13 ${\mu}m$ technology node. In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge, Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness.

• 한국표면공학회지
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• 제8권2호
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• pp.1-6
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• 1975

A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 B
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• pp.723-725
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• 2001

Ion plating method using plasma is faster as several times than electron beam plating method in plating process. Recently, a variety of techniques for this method are being researched. In this paper to produce sheet plasma with high density for ion plating we designed magnetic circuit of MgO plating device consisting of solenoid coil, rectangular permanent magnet. And, we researched on the effect of those by analyzing magnetic field distribution using FEM.

• 한국공작기계학회논문집
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• 제18권2호
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• pp.234-240
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• 2009

In this study, we found that it is important to have a specific management of standards which are the $12{\pm}3{\mu}m$ of plating thickness and $2{\pm}1%$ of tuning. To verify these standards, we checked the plating thickness and density of tuning through marginal valuation of each and checked size of a plating particle, adhesion of solder and condition of reflow after a section chief.

• 한국표면공학회지
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• 제40권1호
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• 한국재료학회지
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• 제27권8호
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• pp.409-415
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• 2017

For enhanced cavitation erosion resistance of vessel propellers, an electroless Ni-P plating method was introduced to form a coating layer with high hardness on the surface of Cu alloy (CAC703C) used as vessel propeller material. An electroless Ni-P plating reaction generated by Fe atoms in the Cu alloy occurred, forming a uniform amorphous layer with P content of ~10 wt%. The amorphous layer transformed to (Ni3P+Ni) two phase structure after heat treatment. Cavitation erosion tests following the ASTM G-32 standard were carried out to relate the microstructural changes by heat treatment and the cavitation erosion resistance in distilled water and 3.5 wt% NaCl solutions. It was possible to obtain excellent cavitation erosion resistance through careful microstructural control of the coating layer, demonstrating that this electroless Ni-P plating process is a viable coating process for the enhancement of the cavitation erosion resistance of vessel propellers.

• 한국표면공학회지
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• 제43권2호
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.