Rotary Cathode Tin Plating on Strip Type Semiconductors

Strip 형 반도체 부품상에 회전음극 방법에 의한 주석도금에 관한 고찰

A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.