Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
권호 표지

A Study on Working Condition of the Pb Free Plating Process Using the Plating Soluction of Sn/Cu

Sn/Cu 도금액을 이용한 무연 도금공정의 작업조건에 관한 연구

  • 전택종 (충남대학교 대학원 기계공학과) ;
  • 고준빈 (한밭대학교 기계설계공학과) ;
  • 이동주 (충남대학교 기계공학과)
  • Published : 2009.04.15
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, we found that it is important to have a specific management of standards which are the $12{\pm}3{\mu}m$ of plating thickness and $2{\pm}1%$ of tuning. To verify these standards, we checked the plating thickness and density of tuning through marginal valuation of each and checked size of a plating particle, adhesion of solder and condition of reflow after a section chief.

Keywords

References

  1. Shin, K. H., Kim, H. T., and Jang, D. Y., 2007, "An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages," Transactions of the Korean Society of Machine Tool Engineers, Vol. 16, No. 5, pp. 134-135.
  2. Won, K. G., 1989, Plating solution analysis method, Dongmyngsa, Republic of Korea, pp. 144.
  3. Yeom, H. T., Lee, J. S., 2001, Metal surface treatment, Dongmyngsa, Republic of Korea, pp. 153-188.
  4. Lau, J. H., 1991, Solder joint reliability, Van Nostrand Reinhold, New York, pp. 406-449.
  5. Sunwoo, A. J., Morris, J. W., and Lucey, G. K., 1992, "The growth of Sn-Cu inter-metallics at a pre-tinned copper/solder interface," Metall. Trans. A, Vol. 23, pp. 1323-1332. https://doi.org/10.1007/BF02665064
  6. Ganesan, S. and Pecht, M., 2004, Lead-free Electronics 2004 Edition, CACE EPSC Press, Maryland, USA, pp. 45-63.
  7. Jung, J. P., Shin, Y. E., and Im, S. S., 2001, Pb-free Micro Soldering, Samsungbooks, Republic of Korea, pp. 45-77.