• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.150-157
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• 2006

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

• Corrosion Science and Technology
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• v.18 no.5
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• pp.190-195
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• 2019

SA508 low-alloy steel for a reactor vessel was exposed to primary water in a pressurized water reactor (PWR) plant because the cladding layer of type 309 stainless steel for the RPV was removed, due to an accident in which the detachment of the thermal sleeve occurred. The major advantage of the electrochemical deposition (ECD) Ni plating technique is that the reactor pressure vessel can be repaired without significant thermal effects, and Ni has solid corrosion resistance that can withstand boric acid. The corrosion rate assessment of the damaged part was performed, and its trend was analyzed. Essential variables of the Ni plating for repair of the damaged part were derived. These conditions are applicable variables for the repair plating device, and have been carefully adjusted using the repair plating device. The process for establishing ASME technical standards called Code Case N-840 is described. The process of developing Ni-plating devices, and the electroplating procedure specification (EPS) are described.

• Journal of Institute of Convergence Technology
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• v.8 no.1
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• pp.33-39
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• 2018

The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

• Corrosion Science and Technology
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• v.18 no.4
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• pp.148-153
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• 2019

Pure nickel with a thickness of 1 mm was plated on type 304 stainless steels and low alloy steels (JIS G3131 SPHC) by electrolytic plating method in a circulating plating bath. Plating performance, mechanical properties, and surface characteristics were evaluated in terms of pretreatment process, anode material, pH, current density, and flow rate of the plating solution. Addition of hydrochloric acid during pre-treatment process improved the adhesion performance of plating. To improve plating efficiency, it is desirable to use S-nickel rather than electrolytic nickel. The use of S-nickel was also confirmed to be desirable for maintaining the pH and concentration of the plated solution. The defect of the plating using S-nickel anode produced pit on the surface. However, it is believed that proper control can be obtained by increasing the flow rate. Internal stress and hardness values of electrolytic nickel plating according to current density need to be carried out with further studies.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.1-2
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• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.38 no.4
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• pp.72-79
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• 2015

A number of plating companies have been exposed to the risk of fire due to unexpected temperature increasing of water in a plating bath. Since the companies are not able to forecast the unexpected temperature increasing of water and most of raw materials in the plating process have low ignition temperature, it is easy to be exposed to the risk of fire. Thus, the companies have to notice the changes immediately to prevent the risk of fire from plating process. Due to this reason, an agile and systematic temperature monitoring system is required for the plating companies. Unfortunately, in case of small size companies, it is hard to purchase a systematic solution and be offered consulting from one of the risk management consulting companies due to an expensive cost. In addition, most of the companies have insufficient research and development (R&D) experts to autonomously develop the risk management solution. In this article, we developed a real time remote temperature monitoring system which is easy to operate with a lower cost. The system is constructed by using Raspberry Pi single board computer and Android application to release an economic issue for the small sized plating manufacturing companies. The derived system is able to monitor the temperature continuously with tracking the temperature in the batch in a short time and transmit a push-alarm to a target-device located in a remoted area when the temperature exceeds a certain hazardous-temperature level. Therefore, the target small plating company achieves a risk management system with a small cost.

• Journal of the Korean institute of surface engineering
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• v.25 no.3
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• pp.117-125
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• 1992

In the electrolysis process of zinc plating impurity ions must be removed from zinc chloride plating solution because it's harmful to the current efficiency and the purity of zinc plating. In this study using zinc ball as a prcipitant instead of zinc dust, the fundamental data for continuous cementation process was studied. Based upon two series of experiments that consist of batch experiment with cylindrical zinc specimen and continuous experiment with zinc balls, following results have been obtained. In the continuous experiment all impurity ions have been removed within 1 hour regardless of various experimental conditions.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.211-213
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• 1999

In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result of a basic comparison test between Sn-Pb plating and Sn-Ag plating is reported.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.