• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2008년도 추계학술대회 초록집
• /
• pp.15-16
• /
• 2008

In case manufacturing COF, through hole should be made to be used for a pathway connecting the conductive layers of its both faces. In case Cu-plating inside of through hole with electroless plating way, contact between Cu and PI film gets bad to be fell apart from PI by the impact of applying to the electric devices. Therefore, after sputtering is applying on inner through hole, then a method to perform electroplating process. In this study, after changing sputtering condition to manufacture FCCL, we looked the changeability of the upper PI and inner hole Cu layers. Making use of RF Magnetron sputtering equipment, we coated Cu thin film and Cu-plated on it through electroplating. After cold-mounting the completed FCCL, we examined hole section through an optical microscope. From the result of test, with parameters deposition pressure and deposition time, both the thickness of the hole plated layer and PI plated upper layer increased at regular rate, increasing the thickness of Cu sputter layer. However, from the result of test in increasing RF-power, we could know the increment rate of hole plated layer is considerably greater than that of PI plated upper layer. Therefore, we finally acquired good result; if you want only to increase the plated layer of inner hole, it's much better to increase RF-power.

• 전자공학회논문지D
• /
• 제35D권7호
• /
• pp.63-71
• /
• 1998

Generally, electronic packaging designer uses HSPICE SOFTWARE TOOL to validate electric characteristics of traces layout before layout traces in PCB in hundreds Mb/s high speed digital circuits. We are in need of a plated through hole (PTH) model and a connector model to use HSPICE SOFTWARE TOOL. Those models have not been perfectly defined for HSPICE simulation. In this paper, we define a PTH model and a connector model for HSPICE simulation and discuss application range for these models. Th emodels are analytic models very applicable for HSPICE simulation and are used to analyze electric characteristic of the PTH and the connector in thetraces layout in high speed digital circuit.

• 대한전자공학회논문지SD
• /
• 제47권12호
• /
• pp.55-67
• /
• 2010

고다층 배선 기판에 형성된 개방 스터브(open stub)를 제거한 후면드릴가공홀(Back-Drilled-Hole, BDH)과 일반적인 구조인 관통홀(Plated-Through-Hole, PTH) 구조의 전기적 특성에 대한 분석을 하였으며, 고속 선호를 부품 실장면으로부터 내층의 스트립라인으로 전송하기 위해 비아홀의 급전 길이가 가장 긴 전송층을 선택하였다. 10 GHz의 광대역 주파수 내에서 실험계획법(DOE, design of experiment)을 적용하여 비아홀 구조 내에 외층과 급전층 사이의 비아홀의 길이, 접지층에 형성된 천공(anti-pad)의 크기와 급전층에 형성된 패드 (pad)의 크기가 최대 반사 손실 반전력 주파수와 삽입 손실에 미치는 영향을 분석하였다. 이로 부터 거시적 모델(macro model)을 위한 회귀 실험식을 추출하여 실험 결과와 비교 평가하였고, 실험 영역 외에서도 측정 결과와 5% 이내의 오차를 보이고 있음을 확인하였다.

• Corrosion Science and Technology
• /
• 제8권4호
• /
• pp.148-152
• /
• 2009

The failure of a Zn-plated carbon steel pipe that served as a fire sprinkler was investigated in terms of the pipe's corrosion products. The pipes leaked through holes formed beneath the tubercles. The formation of oxygen concentration cell involves colonization of metal surface by aerobic bacteria or other slime formers, and anodic reaction beneath tubercle is accelerated by the presence of SRB, leading to the formation of hole beneath tubercle.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2000년도 추계학술대회논문집A
• /
• pp.481-485
• /
• 2000

A new type of compliant press-fit pin has been developed and evaluated for use packaging of electronic telecommunications equipments. Main requirements for design are defined the upper limit of pin insertion force and the lower limit of pin retention force. Upper limit of pin insertion force is set to protect the copper plate of the inner PTH wall. Lower limit of pin retention force is set to satisfy a wire-wrapping specification. Results are represented by insertion force and retention force variations according to the front angle, rear angle and material, etc.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제17권4호
• /
• pp.280-288
• /
• 2017

Purpose: PBA buried in underwater requires high reliability because of its mission critical characteristic and harsh operational environment during its life cycle. Therefore, various reliability improvement activities are necessary. The defect on PBA manufacturing process have been studied, as a result, many activities and standards have been presented. However, there are less studies regarding failure pattern on physical features based on design. In this paper, we studied a possible failure patten based on physical features that is related with manufacturing process of PBA. And reliability improvement design based on PoF (Physical of Failure) were intruduced in this paper. Methods: A reliability prediction simulation were performed on the components A and B of the H system using Sherlock Software which is a PoF commercial tool from DFR solution. Solder fatigue and PTH fatigue analysis based on thermal cycling profiles and random vibration was analyzed on three earthquake response spectrum. Result: It was validated that life time and reliability improvement design through solder fatigue and PTH fatigue analysis in case of component. For compoenet B, random vibration fatigue was additionally analyzed and validated reliability for earthquakes profile. Conclusion: In design stage prior to manufacturing, PoF can be analyzed, and it is possible to make a reliability improvement/validated design using design data. This study can be applied in every design step and contribute to make more stable development product.

• 박물관보존과학
• /
• 제21권
• /
• pp.53-66
• /
• 2019

본 연구는 강원도 영월 하송리 유적에서 출토된 금속유물의 보존처리 과정과 표면성분분석 결과를 제시하였다. 금동소형풍탁 1점, 풍설 2점, 호리병 형태 소형 청동병 1점을 대상으로 XRF를 이용한 표면 성분분석을 진행하였고, 호리병 형태 소형청동병은 X-ray를 통한 내부구조관찰을 실시하였다. 금동소형풍탁과 풍설은 같은 위치에서 출토되었으나, 금동소형풍탁은 도금층이 확인되는데 반해, 풍설은 부식층이 표면에 고착되어 가시적으로 확인되지 않았다. 분석결과 금동소형풍탁은 Cu-Sn-Pb 3원계 합금 청동소지에 Au를 수은 아말감으로 도금하여 제작하였음을 확인하였다. 풍설은 소지가 구리이며, 소량의 금성분이 검출되었다, 호리병 형태 소형 청동병은 형태적으로 비슷한 고려시대 화폐인 은병(銀甁)인지 여부를 확인하고자 표면 성분분석과 함께 X-ray 촬영을 실시하였다. X-ray 촬영 결과 저부의 가운데 부분에 작은 구멍을 막았던 것으로 보이는 흔적이 확인되었으며, 전체적인 표면분석 결과에서는 은이 검출되지 않아 은병이 아닌 청동유물임을 알 수 있었다.