• Journal of Adhesion and Interface
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• v.21 no.1
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• pp.1-5
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• 2020

Heated tool joining is a popular method for joining parts made from plastics and composite materials. The method is commonly known as butt fusion in the plastic pipe industry and this paper provides a short introduction to the basics of producing a good butt fusion joint. The function of each of the essential parts of the butt fusion equipment is described followed by a presentation of the important parameters of the bonding process in reference to a well-established interfacial pressure versus time curve. The butt fusion procedure is then outlined with good practices that detail the preparation of equipment and pipes to be joined as well as the fusion joining process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Journal of Adhesion and Interface
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• v.17 no.4
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• pp.155-162
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• 2016

• Journal of the Korean institute of surface engineering
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• v.42 no.4
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• pp.173-178
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• 2009

DLC film was synthesized on plastic injection mold(SKD11, $30\;mm\;{\times}\;19\;mm\;{\times}\;0.5\;mm$) and Si(100) wafer for 2 h at $130^{\circ}C$ under 6 mTorr using hybrid method of rf sputtering and ion source. The obtained film was analysed by Raman spectroscopy, AFM, TEM, Nano indenter and scratch tester, etc. The film was defined as an amorphous phase. In the Raman spectrum, broad peak of $sp^2$-bonded carbon attributed to graphite at $1550\;cm^{-1}$ were observed, and the ratio of ID($sp^3$ diamond intensity)/IG($sp^2$ graphite intensity) was approximately 0.54. The adhesion of DLC film was more than 80 N with scratch tester when $0.2\;{\mu}m$ thickness Cr was coated as interlayer. The micro-hardness was distributed at 35~37 GPa. The friction coefficient was 0.02~0.07, and surface roughness(Ra) was 0.34~1.64 nm. The lifetime of DLC coated plastic injection mold using as a connector part in computer was more than 2 times of non-coated mold.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.87-92
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• 2017

Poly(urethane acrylate) siloxane oligomers with Interpenetrating polymer networked nanoparticles were prepared to synthesize hard coating solution by reaction with isophorone diisocyanate(IPDI) of 1, 2, 3, 4 phr. The structures and molecular weights of the synthesized solutions were characterized by IR spectroscopy and gel permeation chromatography, respectively. In the cross-cut test for the adhesion, all the solutions showed good adhesion of 5B regardless of the content of IPDI and film thickness. The addition of 1 phr IPDI resulted in the best pencil hardness. The IPDI combined siloxane hard coating solution showed more flexibility than the siloxane solution. These results will yield the improvement in the siloxane solution using for plastic display plate.

• Tribology and Lubricants
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• v.39 no.1
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• pp.8-12
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• 2023

This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.759-762
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• 2005

A tray inserting machine is developed for automation of inserting plastic mold tray into a cardboard box. Plastic mold tray is used for protecting breakdown of glass bottles. In this paper, two types of processes to divide the plastic mold tray are proposed. As a result, adhesion method by vacuum pad is accepted. And also, static and modal analysis for the machine are carried out to check the machine design using the commercial software, CATIA V5.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.40
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• pp.42.1-42.5
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• 2018

Background: Fractures of the orbital wall are mainly caused by traffic accidents, assaults, and falls and generally occur in men aged between 20 and 40 years. Complications that may occur after an orbital fracture include diplopia and decreased visual acuity due to changes in orbital volume, ocular depression due to changes in orbital floor height, and exophthalmos. If surgery is delayed too long, tissue adhesion will occur, making it difficult to improve ophthalmologic symptoms. Thus, early diagnosis and treatment are important. Fractures of the superior orbital wall are often accompanied by skull fractures. Most of these patients are unable to perform an early ocular evaluation due to neurosurgery and treatment. These patients are more likely to show tissue adhesion, making it difficult to properly dissect the tissue for wall reconstruction during surgery. Case presentation: This report details a case of superior orbital wall reconstruction using superior orbital rim osteotomy in a patient with a superior orbital wall fracture involving severe tissue adhesion. Three months after reconstruction, there were no significant complications. Conclusion: In a patient with a superior orbital wall fracture, our procedure is helpful in securing the visual field and in delamination of the surrounding tissue.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.4
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• pp.1-14
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• 1991

In PECVD(Plasma-Enhanced Chemical Vapor Deposition) process, titanium nitride is thin and its adhesion is poor for the protective coatings. Therefore it has been studied that intermediate layer forms between substrate and TiN thin film. Using R.F. plasma nitriding, nitride layer was first formed, then TiN thin film coated by PECVD. The chemical composition of the coatings has been characterized using AES, EDS and their crystallographic structure by means of XRD. Mechanical properties such as microhardness and film adhesion have also been determined by vickers hardness test, scratch test and indentation test. As a result, there was no difference in chemical composition and structure between the TiN deposition only and the composite of TiN deposition on nitrided steel. It was found that nitrided substrate increased the hardness of TiN coatings and was beneficial in preventing the plastic deformation in the substrate. Therefore the effective load bearing capacity of the TiN coatings on nitrided steel was increased and their adhesion was improved as well. According to the results of this study, the processes that lead to the formation of composite layers characterized by good working properties, i.e., high microhardness, adhesion and resistance to deformation.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.