• Title/Summary/Keyword: Plasma emission

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Photoluminescence in MgO-ZnO Nanorods Enhanced by Hydrogen Plasma Treatment

  • Park, Sunghoon;Ko, Hyunsung;Mun, Youngho;Lee, Chongmu
    • Bulletin of the Korean Chemical Society
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    • v.34 no.11
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    • pp.3367-3371
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    • 2013
  • MgO nanorods were fabricated by the thermal evaporation of $Mg_3N_2$. The influence of ZnO sheathing and hydrogen plasma exposure on the photoluminescence (PL) of the MgO nanorods was studied. PL measurements of the ZnO-sheathed MgO nanorods showed two main emission bands: the near band edge emission band centered at ~380 nm and the deep level emission band centered at ~590 nm both of which are characteristic of ZnO. The near band edge emission from the ZnO-sheathed MgO nanorods was enhanced with increasing the ZnO shell layer thickness. The near band edge emission from the ZnO-sheathed MgO nanorods appeared to be enhanced further by hydrogen plasma irradiation. The underlying mechanisms for the enhancement of the NBE emission from the MgO nanorods by ZnO sheathing and hydrogen plasma exposure are discussed.

Harmonic plasma emission by electron beam - plasma interaction

  • Rhee, Tong-Nyeol;Ryu, Chang-Mo
    • Bulletin of the Korean Space Science Society
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    • 2009.10a
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    • pp.43.1-43.1
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    • 2009
  • Electromagnetic radiation at the plasma frequency and its second harmonic, the so-called plasma emission, is fundamental process responsible for solar type II and III radio bursts. There have also been occasional observations of higher-harmonic plasma emissions in the solar-terrestrial environment. We will present that the simulation effort on characterizing the electron beam-generated plasma emission process at POSTECH. We have developed fully electromagnetic particle-in-cell (PIC) simulation code with three dimensions. We simulated harmonic plasma emission with various beam condition. Qualitative comparison with the traditional plasma frequency and second harmonic radiation theory is in good agreement. Higher harmonic emissions agree with the theory of coalescence of Langmuir and harmonic EM wave.

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Polymer (Polydimethylsiloxane (pdms)) Microchip Plasma with Electrothermal Vaporization for the Determination of Metal Ions in Aqueous Solution

  • Ryu, Won-Kyung;Kim, Dong-Hoon;Lim, H.B.;Houk, R.S.
    • Bulletin of the Korean Chemical Society
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    • v.28 no.4
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    • pp.553-556
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    • 2007
  • We previously reported a 27.12 MHz inductively coupled plasma source at atmospheric pressure for atomic emission spectrometry based on polymer microchip plasma technology. For the PDMS polymer microchip plasma, molecular emission was observed, but no metallic detection was done. In this experiment, a lab-made electrothermal vaporizer (ETV) with tantalum coil was connected to the microchip plasma for aqueous sample introduction to detect metal ions. The electrode geometry of this microchip plasma was redesigned for better stability and easy monitoring of emission. The plasma was operated at an rf power of 30-70 W using argon gas at 300 mL/min. Gas kinetic temperatures between 800-3200 K were obtained by measuring OH emission band. Limits of detection of about 20 ng/mL, 96.1 ng/mL, and 1.01 μ g/mL were obtained for alkali metals, Zn, and Pb, respectively, when 10 μ L samples in 0.1% nitric acid were injected into the ETV.

Silicon Etching Process of NF3 Plasma with Residual Gas Analyzer and Optical Emission Spectroscopy in Intermediate Pressure (잔류가스분석기 및 발광 분광 분석법을 통한 중간압력의 NF3 플라즈마 실리콘 식각 공정)

  • Kwon, Hee Tae;Kim, Woo Jae;Shin, Gi Won;Lee, Hwan Hee;Lee, Tae Hyun;Kwon, Gi-Chung
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.4
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    • pp.97-100
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    • 2018
  • $NF_3$ Plasma etching of silicon was conducted by injecting only $NF_3$ gas into reactive ion etching. $NF_3$ Plasma etching was done in intermediate pressure. Silicon etching by $NF_3$ plasma in reactive ion etching was diagnosed through residual gas analyzer and optical emission spectroscopy. In plasma etching, optical emission spectroscopy is generally used to know what kinds of species in plasma. Also, residual gas analyzer is mainly to know the byproducts of etching process. Through experiments, the results of optical emission spectroscopy during silicon etching by $NF_3$ plasma was analyzed with connecting the results of etch rate of silicon and residual gas analyzer. It was confirmed that $NF_3$ plasma etching of silicon in reactive ion etching accords with the characteristic of reactive ion etching.

An Experimental Study on the Reduction of Diesel Emission Using Low Temperature Plasma Apparatus (저온 플라즈마 장치를 이용한 디젤기관의 유해배출물질 저감에 관한 실험적 연구)

  • 김홍석;원준희;정태용
    • Transactions of the Korean Society of Automotive Engineers
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    • v.8 no.5
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    • pp.12-19
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    • 2000
  • The increasing use of vehicles is causing air-pollution problems. Diesel vehicles are preferred to gasoline vehicles, because the diesel vehicles are superior to gasoline vehicles in terms of fuel consumption, durability, power and efficiency. But the emission reduction technologies for diesel vehicle are not developed well like those for gasoline vehicles. Moreover, the NOx and smoke emitted from diesel vehicle are recognized as a main source of the air-pollution in the urban areas. The emission reduction devices have been installed for each of the emission gas components. Using plasma(i.e. electrical energy)only, the emission gas was found to be reduced. The present paper investigate the effects of a low temperature plasma device in engine performance as well as in emission reduction with the change of the applied voltage and the loading rate of the engine.

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The characteristics of AC-PDPs According to binary and ternary gas mixtures of He-Ne-Xe_

  • Lee, H.J.;Son, C.G.;Lee, S.B.;Han, Y.K.;Jeoung, S.H.;You, N.L.;Lim, J.E.;Lee, J.H.;Moon, M.W.;Oh, P.Y.;Jeoung, J.M.;Choi, E.H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1195-1198
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    • 2005
  • The improvement of efficiency is the one of the most important part in AC PDPs . To achieve high efficiency, high VUV emission efficiency and High ion induces secondary electron emission coefficient are needed. We have measured the emission spectra of vacuum ultraviolet rays and ion induced secondary electron emission coefficient of MgO protective layer in surface discharge AC-PDP with binary and ternary gas mixtures. We have investigated electro-optical characteristics of AC-PDPs to optimum gas mixture for high efficient.

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Measurement of ion-induced secondary electron emission coefficient for MgO thin film with $O_{2}$ plasma treatment

  • Jeong, H.S.;Oh, J.S.;Lim, J.Y.;Cho, J.W.;Choi, E.H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.802-805
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    • 2003
  • The ion-induced secondary electron emission coefficient ${\gamma}$ for MgO thin film with $O_{2}$ plasma treatment has been investigated by ${\gamma}$-FIB (focused ion beam) system. The MgO thin film deposited from sintered material with $O_2$ plasma treatment is found to have higher ${\gamma}$ than that without $O_{2}$ plasma treatment. The energy of $Ne^{+}$ ions used has been ranged from 100eV to 200eV throughout this experiment. It is found that the highest secondary electron emission coefficient ${\gamma}$ has been achieved for 10 minutes of $O_{2}$ plasma treatment.

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OES based PECVD Process Monitoring Accuracy Improvement by IR Background Signal Subtraction from Emission Signal (적외선 배경신호 처리를 통한 OES 기반 PECVD공정 모니터링 정확도 개선)

  • Lee, Jin Young;Seo, Seok Jun;Kim, Dae-Woong;Hur, Min;Lee, Jae-Ok;Kang, Woo Seok
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.5-9
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    • 2019
  • Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.

Extreme Ultraviolet Plasma and its Emission Characteristics Generated from the Plasma Focus in Accordance with Gas Pressure for Biological Applications

  • Kim, Jin Han;Lee, Jin Young;Kim, Sung Hee;Choi, Eun Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.178.2-178.2
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    • 2013
  • Conventional ultraviolets A,B,C are known to be very important factor of killing, changing surface properties of biological cells and materials. It is of great importance to investigate the influence of extreme ultraviolet (EUV) exposure on the biological cell. Here we have studied high density EUV plasma and its emission characteristics, which have been generated by plasma focus device with hypercycloidal pinch (HCP) electrode under various Ar gas pressures ranged from 30~500 mTorr in this experiment. We have also measured the plasma characteristics generated from the HCP plasma focus device such as electron temperature by the Boltzman plot, plasma density by the Stark broading method, discharge images by open-shuttered pin hole camera, and EUV emission signals by using the photodiode AXUV-100 Zr/C.

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Microdischarge using priming particles for reducing neon emission in AC plasma display panel with Ne-Xe-He gas mixture

  • Kim, Hyun;Jang, Sang-Hun;Tae, Heung-Sik;Chien, Sung-Il;Lee, Dong-Ho
    • Journal of Sensor Science and Technology
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    • v.15 no.4
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    • pp.284-290
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    • 2006
  • This study uses neon, xenon, and helium gas mixture microdischarge to determine the effects of priming particles on the neon emission characteristics in an alternate current plasma display panel (AC PDP). The infrared (823 nm) and neon emission (585 nm) intensities are measured and compared in the blue cells in the case of new discharge with priming particles or conventional discharge without priming particles, respectively. It is found that the priming particles can produce a plasma discharge effectively even under the weak electric field condition, thereby resulting in reducing the neon emission intensity remarkably without sacrificing the IR emission intensity. As a result, it is found that the Ne emission intensity is reduced by about 46.4 % but the blue visible emission intensity is increased by about 15.2 % when compared with the conventional discharge without priming particles.