• 한국표면공학회지
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• 제41권1호
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• 한국전기전자재료학회논문지
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• 제24권10호
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• pp.790-793
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• 2011

In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1353_1354
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• 2009

The OTFT devices had inverted staggered structures of Au/pentacene/ppMMA/ITO on PET substrate. The overall device performances of the flexible devices such as the operating voltage, the field effect mobility, the on/off ratio and the off current are somewhat worse than those of devices fabricated on glass substrates. Pentacene/ppMMA OTFT benchmarks (mobility, sub-threshold slope, on/off ratio) were comparable to that of solution cast PMMA, but below average when compared to other polymer gate dielectrics. However, threshold and drive voltages were among the lowest reported for a polymer gate dielectric, and surpassed only by ultra-thin SAM gate dielectrics.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.989-992
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• 2008

X-ray lithography is one of the most powerful processes in the fabrication of nano/micro structures with a high aspect ratio. This process enables the fabrication of ultra-thin barrier ribs for PDP using X-ray sensitive paste. In this paper, organic material including photo-monomers, photo-oligomers, binder polymer and additives as well as inorganic powders with different size were optimized to fabricate high aspect ratio barrier rib pattern for PDP.

• 한국정밀공학회지
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• 제22권8호
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• pp.159-164
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• 2005

The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 추계학술발표대회 및 제15회 신소재 심포지엄
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• pp.29.1-29.1
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• 2008

• 한국진공학회:학술대회논문집
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• 한국진공학회 2008년도 제34회 동계학술대회 초록집
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• pp.249-249
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• 2008

• 한국진공학회:학술대회논문집
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• 한국진공학회 2008년도 제34회 동계학술대회 초록집
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• pp.348-348
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• 2008

• 한국진공학회:학술대회논문집
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• 한국진공학회 2003년도 제25회 학술발표회 초록집
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• pp.159-160
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• 2003

• 한국전자현미경학회:학술대회논문집
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• 한국현미경학회 2003년도 제34차 추계학술대회
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• pp.47-48
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• 2003