• Proceedings of the KIEE Conference
• /
• 2003.07c
• /
• pp.1914-1916
• /
• 2003

최근 PDMS를 이용한 미세구조물의 제작을 통한 LOC(lap-on-a-chip) 개발에 대한 연구가 많이 진행되고 있다. 본 연구에서는 PDMS와 여러기판(유리와 실리콘) 사이의 접합 공정에 관한 연구를 하였으며, 특히 PDMS 표면의 물리적, 화학적 변화와 접합 특성과의 관계를 고찰하였다. $O_2$ 플라즈마를 사용하여 표면 처리된 기판의 표면에너지를 접촉각 측정방식으로 측정하였다. 또한 XPS를 이용하여 표면의 화학조성 변화 관찰하였으며, AFM으로 플라즈마 도즈량에 따른 표면 거칠기를 조사하였다.

• Proceedings of the KIEE Conference
• /
• 1996.11a
• /
• pp.203-205
• /
• 1996

DLC(Diamond-Like Carbon) films were prepared by Inductively Coupled Plasma(ICP) CVD system. It was confirmed that the field emission characteristics are closely related to the richness of C-H bonding incorporated in the DLC. According to Fowler-Nordheim equation, it is thought that the ability of DLC to emit electron at relatively low voltage is due to the field enhancement caused by the nodules of ${\sim}100nm$ size on the surface of DLC. The electric field to start field emission was about $1.4{\times}10^9V/m$ in case of DLC film deposited at input power of 400W and substrate bias of -100V.

• Journal of information and communication convergence engineering
• /
• v.4 no.3
• /
• pp.105-107
• /
• 2006

Amorphous silicon is a kind of optical to electric conversion material with current or voltage type after generating a numerous free electron and hole when it is injected by light. It is very effective technology to make schottky diode by bonding thin film to use optical diode. In this paper, we have fabricated optical diode device by forming chrome silicide film through thermal processing with thin film($100{\AA}$) having optimal amorphous silicon. The optimal condition is that we make a thin film by using PECVD(Plasma Enhanced Chemical Vapor Deposition) to improve reliability and characteristics of optical diode. We have obtained high quality diode by using chrome silicide optical diode from dark current and optical current measurement compared to previous method. It makes a simple process and improves a good reliability.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1526-1527
• /
• 2007

This paper presents the design, fabrication and experimental results of an electromagnetic microvalve for drug delivery systems. The microvalve consists of two silicon substrates with a silicone rubber diaphragm and a flow channel, a PDMS layer, and an electromagnetic actuator. Each substrate is fabricated by using the silicon wet etch, SU-8 mold process and $O_2$ plasma bonding.

• Bulletin of the Korean Chemical Society
• /
• v.14 no.6
• /
• pp.696-700
• /
• 1993

Gold bonding wire of 0.076 mm in diameter used in semiconductor industry, is dissoved in aqua regia. The solution is then evaporated to near dryness several times with a few drops of HCl added to prepare the final sample solution in 5% HCl. The gold matrix is separated from trace impurities by controlled potential deposition. The whole electrolysis has been carried out inside a clean bench. An optimum potential is found to be +0.25 V to give more than 99.9% Au matrix removal with better than 90 analytes remaining in the electrolyte solution. Isotope dilution calibration is employed to get the best accuracy and precision. Analytical results are presented with determination limits of the analytical method.

• The korean journal of orthodontics
• /
• v.34 no.4 s.105
• /
• pp.325-332
• /
• 2004

A self-etching primer that combines the etchant and primer in one chemical compound saves time and should be mote cost-effective to the clinician and patient. The purpose of this study was to evaluate the clinical effectiveness of a self-etching primer by measuring shear bond strengths according to various conditions and observing adhesive failure patterns. For this Investigation, 120 upper and lower premolars extracted for orthodontic purposes were used and randomly divided into six groups of twenty teeth each. Human premolars were embedded in a metal cylinder with orthodontic resin. Metal brackets and ceramic brackets were bonded with XT primer and self-etching primer by means of XT adhesive. Upon curing, plasma arc light and visible light were used. After bonding, the shear bond strength was tested by Instron universal testing machine, and the amount of residual adhesive that remained on the tooth after debonding was measured by stereoscope and assessed with an adhesive remnant index. The results were as fellows: 1. When brackets were bonded, if other conditions remained the same, there was no significant difference in shear bond strength due to the type of primer - either self-etching primer or XT primer. 2. When metal brackets were bonded, there was no significant difference in shear bond strength according to the source of light - plasma arc light or visible light - and type of primer. 3. There was a very significant difference in shear bond strength according to the type of brackets - metal or ceramic brackets. The shear bond strength of ceramic brackets was stronger than metal brackets. 4. When the adhesive failure patterns of metal brackets bonded with self-etching primer were observed by using the adhesive remnant index, the bond failure of the metal bracket occurred more frequently at the bracket-adhesive. The failure of the ceramic bracket, however, occurred more frequently at the enamel-adhesive interface. The adhesive failure patterns of metal brackets bonded with XT primer observed the same patterns. The above results suggest that self-etching primer can be clinically useful for bonding the brackets without fear of a decrease in shear bond strength.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.44 no.11
• /
• pp.20-25
• /
• 2007

In this paper, It was reported the dielectric constant in organic inorganic hybrid silica material such as SiOC film modeling of bond structure by annealing in organic properties. The organic inorganic hybrid silica material were deposited using bis-trimethylsilymethane (BTMSM, [(CH3)3Si]2CH2) and oxygen gas precursor by a plasma chemical vapor deposition (CVD). The organic inorganic hybrid silica material have three types according to the deposition condition. The dielectric constant of the films were performed MIS(Al/Si-O-C film/p-Si) structure. The C 1s spectra in organin inorganic silica materials with the flow rate ratio of O2/BTMSM=1.5 was organometallic carbon with the peak 282.9 eV by XPS. It means that organometallic carbon component is the cross-link bonding structure with good stability. The dielectric constant was the lowest at annealed films with cross-link bonding structure.

• Korean Journal of Materials Research
• /
• v.4 no.1
• /
• pp.31-36
• /
• 1994

The bonding behavior of $SiO_{2}$ thin film and glass during VCR head fabrication was investigated, varying the surface roughness of substrate and the sputtering parameter. Insufficient fillings of grooves In the $SiO_{2}$ film with glass was postulated to give rise to the generation of bubble in the glass. The surface roughness of $SiO_{2}$ film was found to depend on that of substrate. The lower the deposition rate, the smoother the surface of film. The bubble free glass after bonding could be obtained using substrate polished with 0.05$\mu\textrm{m}$ $Al_2O_3$ powder under the sputtering condition of 10% oxygen pressure.

• Journal of the Semiconductor & Display Technology
• /
• v.9 no.1
• /
• pp.41-47
• /
• 2010

The effects of thermal treatment on CNTs, which were coated with a-$CN_x$ thin film, were investigated and related to variations of chemical bonding and morphologies of CNTs and also properties of field emission induced by thermal treatment. CNTs were directly grown on nano-sized conical-type tungsten tips via the inductively coupled plasma-chemical vapor deposition (ICP-CVD) system, and a-$CN_x$ films were coated on the CNTs using an RF magnetron sputtering system. Thermal treatment on a-$CN_x$ coated CNT-emitters was performed using a rapid thermal annealing (RTA) system by varying temperature ($300-700^{\circ}C$). Morphologies and microstructures of a-$CN_x$/CNTs hetero-structured emitters were analyzed by FESEM and HRTEM. Chemical composition and atomic bonding structures were analyzed by EDX, Raman spectroscopy, and XPS. The field emission properties of the a-$CN_x$/CNTs hetero-structured emitters were measured using a high vacuum (below $10^{-7}$ Torr) field-emission measurement system. For characterization of emission stability, the fluctuation and degradation of the emission current were monitored in terms of operation time. The results were compared with a-$CN_x$ coated CNT-emitters that were not thermally heated as well as with the conventional non-coated CNT-emitters.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.6
• /
• pp.260-268
• /
• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.