• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1997년도 춘계학술대회
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• pp.35-38
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• 1997

The interfacial bonding energy between laser surface treated HA layer and Ti alloy substrate was investigated using a mechanical push-out tester. The initial slope of shear-stress and reduced displacement curves, maximum interfacial bond strength and bonding energy were calculated from results of the push-out test. The calculated initial slpoes are 38 MPa for the Ti alloy(A), 65 MPa for the sandblast finished specimen(B), 95 MPa for the HA plasma spray coated specimen and 49 MPa for the laser surface treated specimen(D). The maximum interfacial bonding strength are 3 MPa for the A, 19 MPa for the B, 20 MPa for the C, 10 MPa for the D. The interfacial bonding energies are $3.3\times10^{-9}J/mm^2$ for the A, $15.5\times10^{-9}J/mm^2$ for the B, $15.6\times10^{-9}J/mm^2$ for the C and $18.3\times10^{-9}J/mm^2$ for the D. Microscopic observation shows that the breaking of the laser treated specimen had been occured through the boundary between HA layer and polymer resin, but the untreated specimen had been occured through the inside of HA coating layer.

• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.367-372
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• 2020

As packaging processes for atomic gyroscope vapor cells, the glass tube tip-off process, anodic bonding, and paste sealing have been widely studied. However, there are stability issues in the alkali metal which are caused by impurity elements and leakage during high-temperature processes. In this study, we investigated the applicability of a vapor cell low-temperature packaging process by depositing Au on a Pyrex cell in addition to forming an Au-Sn thin film on a cap to cover the cell, followed by laser irradiation of the Au/Au-Sn interface. The mechanism of the thin film bonding was evaluated by XRD, while the packaging reliability of an Ne gas-filled vapor cell was characterized by variation of plasma discharge behavior with time. Furthermore, we confirmed that the Rb alkaline metal inside the vapor cell showed no color change, indicating no oxidation occurred during the process.

• 한국안광학회지
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• 제8권2호
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• pp.91-97
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• 2003

마이크로웨이브 플라즈마 화학증착법을 이용하여 C-H계에서 메탄 농도를 변화시키면서 각각의 농도 변화에 따른 증착상의 변화 거동을 관찰하였는데 메탄 농도가 증가함에 따라 성장 속도는 증가하지만 다이아몬드 박막내 비다이아몬드 성분의 양이 많아지며 결정성이 떨어졌다. Raman 분광으로부터 D 피크($sp^3$)와 G 피크($sp^2$)의 상대적인 세기로부터 $sp^3/sp^2$, 수소함량에 대한 경향성을 알 수가 있었으며 FTIR 분광으로부터 수소함량은 16~37%, $sp/sp^2$은 0.22~1.14로 변화하였다. 이들 결과로부터 최적의 제작조건은 메탄 분압비 13.8%임을 알 수가 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1474-1475
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• 2008

본 논문에서는 nanoporous Pt (Platinum) 전극을 이용한 무효소 혈당센서의 생체 적합성 및 전류응답 특성 향상을 위해 다양한 패키징 방법이 제안되었다. 생체적합성을 갖는 Nafion 멤브레인을 dipping, spin coating, chemical bonding 방법으로 패키징 한 후, 다양한 글루코오스 농도의 혈장, 전혈에서 특성을 분석, 비교하였다. 단백질 등이 포함되지 않은 환경에서 spin coating 방법으로 패키징한 센서의 전류응답 특성은 가장 좋았지만, 혈장 및 전혈에서는 dipping, chemical bonding 방법으로 패키징한 센서의 전류응답 특성에 미치지 못했다. Nafion film을 센서와 chemical bonding한 센서의 혈장에서 sensitivity 는 0.32 ${\mu}A/mM{\cdot}cm^2$ 이었다. 한편, 전혈에서 bare 센서가 급격한 bio-fouling 현상을 보이는 반면 패키징한 센서는 글루코오스 농도에 따라 일정한 전류변화를 보였다. 이는 Nafion을 이용하여 패키징한 무효소 혈당 센서가 생체환경에 적합할 뿐 아니라 생체이식형 및 연속 측정 가능한 시스템에 적용 가능함을 보여준다.

• 한국환경과학회지
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• 제23권9호
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• pp.1627-1634
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• 2014

Odor control technology include absorption, adsorption, incineration and biological treatments. But, most of processes have some problems such as secondary organic acids discharge at the final odor treatment facility. In order to solve the problems for effective treatment of organic acids in odor, it is necessary to develop a new type advanced odor control technology. Some of the technology are plasma only process and plasma hybrid process as key process of the advanced technology. In this study, odor removal performance was compared DBD(Dielectric Barrier Discharge)plasma process with PCHP(plasma catalysis hybrid process) by gaseous ammonia, formaldehyde and acetic acid. Plasma only process by acetic acid obtained higher treatment efficiency above 90%, and PCHP reached its efficiency up to 96%. Acetic acid is relatively easy pollutant to control its concentration other than sulfur and nitrogen odor compounds, because it has tendency to react with water quickly. To test of the performance of DBD plasma process by applied voltage, the tests were conducted to find the dependence of experimental conditions of the applied voltage at 13 kV and 15 kV separately. With an applied voltage at 15 kV, the treatment efficiency was achieved to more higher than 13 kV from 83% to 99% on ammonia, formaldehyde and acetic acid. It seems to the odor treatment efficiency depends on the applied voltage, temperature, humidity and chemical bonding of odors.

• 한국염색가공학회지
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• 제1권1호
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• pp.7-18
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• 1989

The distinguishing characteristic of the glow discharge is that chemical reaction induced by partially ionized gases are limited only to the substrate surface. Most studies have been done on the plasma etching and polymerization. The graft polymerization in vapour phase by cold plasma has been rarely investigated. In this study the system of tub3ar reaction chamber with capacitively coupled electrode of alternative current of 60 Hz was employed for the graft polymerization. The graft polymerization of Acylic Acid(AA) onto the poly (ethylene terephthalate) (PET) was carried out by treatment of PET film and fabric by cold plasma (glow discharge of argon gas), followed by the supply of AA vapour. The graft yield was about 1 wt%. The surface property was determined by contact angle, the surface tension was evaluated by zisman’s plot and equation of surface tension mesurement. The results were as follows: 1. In order to obtain lower contact angle, it was effective to avoid the vicinity of electrodes for a setting position of substrate. 2. Contact angle affected on the monomer pressure and its duration of exposure to the acid vapour. 3. Polymer radical formation was influenced by the changes of the value of current density and plasma treatment time. 4. Total surface tension of plasma grafted PET film increased. With an increase in the carboxylic acid content, the dispersion force decreased, while, the polar force and hydrogen bonding force increased. 5. The contact angle decreased from $75^\circ$ to around $30^\circ$ by plasma grafting. There was no ageing effect on the contact angle after 4 months.

• 한국표면공학회지
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• 제36권5호
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.7-11
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• 2002

In this study, Au thin films were etched with a $Cl_2/Ar$ gas combination in an in an inductively coupled plasma. The etch properties were measured for different gas mixing ratios of $Cl_2/(Cl_2+Ar)$ while the other process conditions were fixed at rf power (700 W), dc bias voltage (150 V), and chamber pressure (15 mTorr). The highest etch rate of the Au thin film was 3500 $\AA/min$ and the selectivity of Au to $SiO_2$ was 4.38 at a $Cl_2/(Cl_2+Ar)$ gas mixing ratio of 0.2. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. There is Au-Cl bonding by chemical reaction between Cl and Au. During the etching of Au thin films in $Cl_2/Ar$ plasma, Au-Cl bond is formed, and these products can be removed by the physical bombardment of Ar ions. In addition, Optical emission spectroscopy (OES) were investigated to analyze radical density of Cl and Ar in plasma. The profile of etched Au investigated with scanning electron microscopy (SEM).

• Journal of Welding and Joining
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• 제32권5호
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• pp.65-71
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• 2014

Atmospheric plasma spraying (APS) is world-widely used process in the automotive industry as a method to provide wear resistance coatings for engine cylinder bore, using various materials. The weight of engine blocks can be considerably decreased by removing cast iron liners, which can finally result in the improvement of fuel efficiency. In this study, five kinds of powder materials, 1.2C steel powder and 1.2C steel powder mixed with 5, 10, 15, 20 wt.%. molybdenum powder, were deposited by atmospheric plasma spraying in order to investigate the effect of molybdenum on the wear resistance of coatings. Microstructural analysis showed that molybdenum splats were well distributed in 1.2C steel matrix with intimate bonding. The molybdenum added coatings showed better tribological properties than 1.2C steel coating. However, above the 15 wt.%. blending fraction, wear resistance was somewhat degraded with poor roughness of worn surface due to the brittle fracture occurred in molybdenum splats. Consequently, compared to conventional liner material, gray cast iron, 10 wt. pct. molybdenum blended 1.2C steel coating showed much better tribological properties and therefore it looks very feasible to replace gray cast iron liner.

• 전자공학회논문지A
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• 제30A권1호
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• pp.31-43
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• 1993

Thermal behavior and $O_{2}$ plasma effects on residue and penetrated impurities formed by reactive ion etching (RIE) in CHF$_{3}$/C$_{2}$F$_{6}$ have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) techniques. Decomposition of polymer residue film begins between 200-300.deg. C, and above 400.deg. C carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal above 800.deg. C under nitrogen atmosphere and out-diffusion of penetrated impurities is observed. The residue layer has been removed with $O_{2}$ plasma exposure of etched silicon and its chemical bonding states have been changed into F-O, C-O etc.. And $O_{2}$ plasma exposure results in the decrease of penetrated impurities.