• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.342-348
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• 2021

For the characterization or failure analysis of electronic devices such as PCB (printed circuit boards), the most common method is the measurement of voltage waveforms with an oscilloscope. However, because there are many types of problems that cannot be detected by voltage waveform analysis, several other methods such as X-ray transmission, infrared imaging, or eddy current measurement have been applied for these analyses. However, these methods have also been limited to general analyses because they are partially useful in detecting physical defects, such as disconnections or short circuits. Fundamentally current waveform measurements during the operation of electronic devices need to be performed, however, commercially available current sensors have not yet been developed, particularly for applications in highly integrated PCB products with sub-millimeter fine pitch. In this study, we developed a highly sensitive PHR (planar hall resistance) magnetic sensor for application in highly integrated PCBs. The developed magnetic sensor exhibited sufficient features of an ultra-small size of less than 340 ㎛, magnetic field resolution of 10 nT, and current resolution of 1 mA, which can be applicable for PCB analyses. In this work, we introduce the development process of the magnetic sensing probe and its characteristic results in detail, and aim to extend this pin-type current probe to applications such as current distribution imaging of PCBs.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.6
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• pp.569-577
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• 2010

Nonplanar surface geometries of components are frequently encountered in real ultrasonic inspection situations. Use of rigid array transducers can lead to beam defocusing and reduction of defect image quality due to the mismatch between the planar array and the changing surface. When a flexible array is used to fit the complex surface profile, the locations of array elements should be known to compute the delay time necessary for adaptive heam focusing. An alternative method is to employ the time reversal focusing technique that does not require a prior knowledge about the properties and structures of the specimen and the transducer. In this paper, a time reversal method is applied to simulate beam focusing of flexible arrays and imaging of point-like defects contained in specimens with nonplanar surface geometry. Quantitative comparisons are made for the performance of a number of array techniques in terms of the ability to focus and image three point-like reflectors positioned at regular intervals. The sinusoidal profile array studied here exhibits almost the same image quality as the flat, reference case.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.2
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• pp.32-36
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• 2001

We investigate the surface order, defects and morphology of hexagonal columnar mesophases, Having a crown ether at one end which forms the center of the column and three fluorinated tails at the other, The orientation of the columns was successfully controlled by surface anchoring: Columns were aligned perpendicularly to an evaporated carbon surface, and the planar alignment do asymmetric compounds was induced by a water surface. TEM images show that there is a high degree of perfection in the packing do the cylinders. The hexagonal columnar mesophase (F(sub)h) was confirmed by direct images and the corresponding electron diffractions, where ordered cylindrical moieties are packed on a hexagonal lattice. The column of 12F8-ABG-15C5 was much straighter, compared with that of 12F8-AG-B15C5, resulting from the degrees of regular stacking. Elementary edge dislocation, grain boundary and +1/2 disclination have been observed, although the defects are generally rare.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.2
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• pp.101-105
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• 2010

Silicon electrode and ring in a plasma etcher those are in contact with harsh plasma suffer from periodic heating and cooling during their lifetime. This causes the silicon components failure due to thermal stress remaining the persistent slip bands (PSBs) on their surfaces. The factors that determine the lifetime of silicon electrode and ring were discussed with respect to silicon ingot. The impurity level and the average defect concentration measured with glow discharge mass spectrometer (GDMS) and microwave photo-conductance decay (${\mu}$-PCD) were compared with the grade of silicon ingots those are divided to slip-free and slip-allowed ingot. Some silp-allowed samples showed planar defects along <110> direction on {001} surface. The role of these defects was suggested from the viewpoint of the lifetime of silicon components.

• Environmental Analysis Health and Toxicology
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• v.14 no.1_2
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• pp.65-73
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• 1999

Dioxins refer to a family of chemicals comprising 75 polychlorinated dibenzo-p-dioxin (PCDD) and 135 polychlorinated dibenzo-p-furan (PCDF) congeners, which may cause skin disorder, human immune system disruption, birth defects, severe hormonal imbalance, and cancer. The effects of exposure of dioxin-like compounds such as PCBs are mediated by binding to the aryl hydrocarbon receptor (AHR), which is a ligand-activated transcription factor. To grasp physicochemical factors affecting human toxicity of dioxins, six geometrical and topological indices, eleven thermodynamic variables, and quantum mechanical descriptors including ESP (electrostatic potential) were analyzed using QSAR and semi-empirical AM1 method. Planar dioxins with high lipophilicity and large surface tension show the probability that negative electrostatic potential in the lateral oxygen may make hydrogen bonding with DNA bases to be a carcinogen.

• Nuclear Engineering and Technology
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• v.4 no.3
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• pp.203-213
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• 1972

The precipitation sequence of Inconel 718 alloy, aged at $760^{\circ}C$ for times up to 200 hr, has been studied by means of electron microscopy and X-ray diffraction methods. The dominant hardening phase was identified as the metastable, body-centered tetragonal $Ni_3Nb$ Phase in the morphology of platelets. The other phases identified in the aging sequence were (Nb, Ti)C and the stable acicular phase of orthorhombic $Ni_3Nb.$ The observations were made on the interaction of dislocations with the precipitates in the underaged condition. The shearing of the precipitates and the planar defects, e.g., stacking faults on i1101 planes of the intermetallic phase, were observed.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.768-771
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• 2006

Uniformity and performance characteristics of LTPS TFTs are important parameters for making advanced active-matrix displays. In this paper, we describe an SLS-based crystallization approach for producing orientation-controlled Si films with reduced concentrations of planar defects that stand to potentially deliver unprecedented levels of device uniformity and performance. Specifically, a 2-step process referred to as hybrid SLS has been developed that produces a variety of high-quality {100} surface-oriented Si films.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.202-207
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• 2002

The soundness of honeycomb core sandwich and laminate structure used for commercial aircrafts is generally evaluated with ultrasonic inspection because the inspection is most sensitive to planar surfaces which are perpendicular to sound propagation pass and reflects sound almost 100％ to equipment. And most defects inherent in composite material curing process has good reflective surfaces. With all this advantage, unexpected obstruction to product and additional cost could be occurred when inappropriate accept/reject criteria is given. In this study the importance of inspection criteria will be discussed to show how inappropriate criteria cause unexpected results leading to high production cost and how much time must be spent to correct those improper criteria with an actual case occurred in Aerospace Division, Korean Air.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.03a
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• pp.28-31
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• 1998

Wrinkling is one of the major defects in sheet metal products and may be also attributable to the wear of the tool. The initiation and growth of the wrinkles are influenced by many factors such as stress state, mechanical properites of the sheet material, geometry of the body, and contact condition. It is difficult to analyze the wrinkling initiation and growth considering the factors because the effects of the factors are very complex and the wrinkling behavior may show wide variation for small deviation of the factors. In this study, the bifurcation theory is introduced for the finite element analysis of wrinkling initiation and growth, All the above mentioned factors are conveniently considered by finite element method. The finite element formulation is based on the incremental deformation theory and elastic-plastic material modeling. The finite element analysis is carried out using the continuum-based resultant shell elements considering the planar anisotropy of the sheet metal. The proposed method is verified by employing to column buckling problem. And then, the initiation and growth of wrinkling in deep drawing of cylindrical cup are analyzed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.5
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• pp.497-501
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• 2004

The crystal structure of the GaN film on the AIN buffer layer grown by R. F sputtering with different thickness has been studied using X-ray scattering and transmission electron microscopy(TEM). The interface roughness between the AIN buffer layer and the epitaxial GaN film, due to crossover from planar to island grains, produced edge dislocations. The strain, coming from lattice mismatch between the AIN buffer layer and the epitaxial GaN film, produced screw dislocations. The density of the edge and screw dislocation propagating from the interface between the GaN film and the AIN buffer layer affected the electric resistance of GaN film.