• Proceedings of the Korean Society of Computer Information Conference
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• 2016.01a
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• pp.137-139
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• 2016

본 논문에서는 압저항 소재 및 센서 기술과 ICT 응용 기술에 대해 소개한다. 먼저 압저항 소재의 구성 및 작동원리를 소개하고, 한국표준과학연구원에서 개발한 유연한 압저항 센서의 구성과 성능에 대해 기술한다. 또한, 개발된 압저항 센서와 ICT 기술을 융합한 스마트 안전 시스템 및 스마트 창호 침입감지 시스템에 대해 기술한다. 마지막으로, ICT기술을 기반으로 압저항 센서기술이 확장해 나아가야 할 스마트 보안 시스템 개발의 필요성을 기술한다.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.121-126
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• 2012

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is $200{\mu}m$ and $190{\mu}m$, respectively. The gap between sensing elements is only $10{\mu}m$. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with $10{\mu}m$ alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.416-418
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• 1994

In this study, a silicon piezoresistive accelerometer is designed and fabricated using $p^+$ etch stop layer. The accelerometer consists of a seismic mass and tour cantilevers, and is fabricated mainly by the anisotropic etching method using EPW as an etchant. Eight piezoresistors are properly arranged and connected to make a bridge circuit so that acceleration in only one direction may be measured. The etch stop method is adequate to the mass-production and the precise thickness control of the diaphragms as well, whet compared with the electrochemecal etch stop method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.416-417
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• 2005

In this study, we optimized the process of Si anisotropy etching by combing tetramethyl ammonium hydroxide (TMAH) etching process with ultrasonic wave technology. New ultrasonic TMAH etching apparatus was developed and it was used for fabricating a $20{\mu}m$ thick diaphragm for Si piezoresistive pressure sensors. Based on comparison study on etch rate and surface flatness, it was observed that the Si anisotropy etching methode with new ultrasonic TMAH etching apparatus (at 40 kHz/ 500 watt) was superior to conventional etching methods with TMAH or TMAH+ammonium persulfate(AP) solutions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.350-351
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• 2006

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, capacitive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. Some elastic materials exhibit a change in bulk resistivity when they are subjected to displacement by an applied pressure. This property is referred to as piezoresistivity and is a major factor influencing the sensitivity of a piezoresistive strain gage. The effect of thick film resistors was first noticed in the early 1970, as described by Holmes in his paper in 1973.

• Computers and Concrete
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• v.23 no.6
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• pp.399-408
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• 2019

Structural health monitoring is important for the safety of lives and asset management. In this study, numerical models were developed for the piezoresistive behavior of smart concrete based on finite element (FE) method. Finite element models were calibrated with experimental data collected from compression test. The compression test was performed on smart concrete cube specimens with 75 mm dimensions. Smart concrete was made of cement CEM II 42.5 R, silica fume, fine and coarse crushed limestone aggregates, brass fibers and plasticizer. During the compression test, electrical resistance change and compressive strain measurements were conducted simultaneously. Smart concrete had a strong linear relationship between strain and electrical resistance change due to its piezoresistive function. The piezoresistivity of the smart concrete was modeled by FE method. Twenty-noded solid brick elements were used to model the smart concrete specimens in the finite element platform of Ansys. The numerical results were determined for strain induced resistivity change. The electrical resistivity of simulated smart concrete decreased with applied strain, as found in experimental investigation. The numerical findings are in good agreement with the experimental results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.611-612
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• 2011

• Journal of Physiology & Pathology in Korean Medicine
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• v.19 no.6
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• pp.1673-1675
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• 2005

The pulse diagnosis is an important and universal method in Oriental medicine. Nevertheless, because of characteristic that depends on subjective sense of Oriental medicine doctor (OMD), it is not recognized by objective basis. The Korean Institute of Oriental Medicine(KIOM) and Daeyo Medi. Co. Ltd. developed the 3-D Mac using arrey piezoresistive sensors and multi-axial robot. 133 healthy subjects participated in this study, 75 males and 58 females, between 20 and 70 years of age. All subjects were relaxed in a supine position on a comfortable chair for twenty minutes before the measurement was taken. The measured position is the radial artery of subject's left wrist and the position is called Chon, Kwan and Chuck in Oriental medicine. To detect floating and sinking pulse, we established coefficient of floating and sinking(CFS). CFS means relative position of maximum pulse pressure in PH curve. The lower CFS value means that the pulse has floating tendency. There was significant diffence between CFS and diagnosis of floating-sinking pulse by OMD(p=0.020). CFS value of over 40's group was significantly larger than those of 20's and 30's(p=0.000). There was no significant difference between male and female(p=0.061).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.3
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• pp.9-14
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• 2004

In this study, Si anisotropic etching characteristics of tetramethylammonium hydroxide (TMAH)/ ammonium persulfate(AP)/isopropyl alcohol(IPA) solutions were investigated to realize the optimum structure of a diaphragm for the piezoresistive pressure sensor application. Due to its low toxicity and its high compatibility with the CMOS processing, TMAH was used as Si anisotropic etchants. The variations of Si etch rate on the etching temperature, TMAH concentration, and etching time were obtained. With increasing the etching temperature and decreasing TMAH concentrations, the Si etch rate is increased while a significant non-unifonnity exists on the etched surface because of formation of hillocks on the (100) surface. The addition of IPA to TMAH solution leads to smoother etched surfaces but, makes the Si etch rate lower. However, with the addition of AP to TMAH solution, the Si etch rate is increased and an improvement in flatness on the etching front is observed. The Si etch rate is also maximized with increasing the number of addition of AP to TMAH solution per one hour. The Si square membranes of 20${\mu}{\textrm}{m}$ thickness and l00-400${\mu}{\textrm}{m}$ one-side length were fabricated successfully by applying optimum Si etching conditions of TMAH/AP solutions.