• Journal of the Korea Society of Computer and Information
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• v.7 no.3
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• pp.49-55
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• 2002

This paper proposes speaker recognition algorithm which includes both the pitch parameter and the fuzzy. This study proposes a pitch detection method for the peak and valley pitch detection function by means of comparing spectra which utilizes the transform characteristics between time and frequency. It measures the similarity to the original spectrum while arbitrarily varying the period in the time domain. It heavily weights the error due to the changing characteristics of the phonemes, while it is strong against noise. In this paper, makes reference pattern using membership function and performs vocal track recognition of common character using fuzzy pattern matching in odor to include time variation width for non-linear utterance time.

• Journal of the Korea Society of Computer and Information
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• v.5 no.3
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• pp.51-57
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• 2000

This paper proposes speaker recognition algorithm which includes both the pitch and the fuzzy. This study proposes a pitch detection method for the peak and valley pitch detection function by means of comparing spectra which utilizes the transform characteristics between time and frequency. It measures the similarity to the original spectrum while arbitrarily varying the period in the time domain. It heavily weights the error due to the changing characteristics of the phonemes, while it is strong against noise. In this paper, makes reference pattern using membership function and performs vocal track recognition of common character using fuzzy pattern matching in order to include time variation width for non-linear utterance time.

• Tribology and Lubricants
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• v.25 no.5
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• pp.342-347
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• 2009

This paper presents EHL analysis for rough surfaces with directional roughness. Three different types of surfaces with pure longitudinal roughness, pure transversal roughness and isotropic roughness are generated. For the surfaces with longitudinal and transversal roughness, two cases are analyzed; one is a case of asperity peak on a spherical contact center, the other one is of valley on a spherical contact center. As a results, the surface with pure transversal roughness gives higher pressure and smaller minimum film thickness than the surface with pure longitudinal roughness, and the surface with isotropic roughness has similar EHL behavior with the surface with pure transversal roughness.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.157-164
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• 2001

The grinding for hard-to-machine materials, such as ceramics, super alloys etc., has proven to be a very difficult and consuming process utilizing ordinary methods. In order to conduct high efficiency machining of such materials, grinding processes using metallic bond diamond wheels and applying electrolytic in-process dressing(ELID) have been attempted on a surface grinding machine. In this study, the effects of grinding parameters, and grit sizes have been evaluated in view of surface roughness, grinding force as well as step difference in simultaneous grinding of different materials. The study and experimental results are presented in this paper.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.34-37
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• 2004

In the present research, a ultra-precision diamond cutting of thermo-plastic materials, polycarbonate (PC) and cyclic olefin polymer (COC), is carried out by applying a method named ultrasonic elliptical vibration cutting developed by the authors. It is experimentally proved that good optical surfaces are obtained by applying the elliptical vibration cutting in cases of machining of flat surfaces and grooves as compared with the conventional diamond cutting. The maximum surface roughness in peak to valley value obtained is less than 60 nm and 20 nm for PC and ZEONEX, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.5
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• pp.318-323
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• 2000

The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2005.04a
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• pp.135-138
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• 2005

최근에 ELLAM 기법을 이용한 오염물 거동 문제를 많은 사람들이 다루어 오고 있다. ELLAM 기법은 기존의 Eulerian-Lagrangian 방식에서 일어나는 질량보존 문제점과 일반경계조건의 체계적인 적용 한계점을 극복하였다. 그러나 본 연구에서는 이 방식의 장단점을 네 개의 예제를 통하여 다른 모델들과 비교 검토하여 ELLAM의 수치적 고찰을 수행하고자 한다. 예제 수행 결과 Mesh Peclet Number가 무한대일때 ELLAM은 수치확산 및 수치진동과 같은 수치오차로 인해 음수의 농도 값을 갖거나 1 보다 큰 농도를 갖는 경향을 보인다. 그러나 Mesh Peclet Number 50 일때는 전체적으로 해석해와 잘 일치함을 볼 수 있다. 반면, LEZOOMPC(Lagrangian-Eulerian ZOOMing Peak and valley Capturing)는 항상 좋은 결과를 보여주고 있다. 따라서 위의 결과를 종합하여 볼 패 ELLAM의 단점은 LEZOOMPC의 성질을 이용하여 개선 및 보완될 수 있음을 간접적으로 시사해준다. 즉 LEZOOMPC에서 사용되는 선택적 국부 격자 세립화 과정을 이용하면 ELLAM에시 일어나는 다양한 수치오차를 줄일 수 있을 것이라고 판단된다.

• Current Optics and Photonics
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• v.3 no.3
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• pp.236-242
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• 2019

An Nd:YAG slab structure was designed for a high-power zigzag slab laser amplifier based on computational simulation of the wavefront distortion. For the simulation, the temperature distribution in the slab was calculated at first by thermal analysis. Then, the optical path length (OPL) was obtained by a ray tracing method for the corresponding refractive index variation inside the slab. After that, the OPL distribution of the double-pass amplified beam was calculated by summing the results obtained for the first and second passes. The amount of wavefront distortion was finally obtained as the peak-to-valley value of the OPL distribution. As a result of this study, the length and position of the gain medium were optimized by minimizing the transverse wavefront distortion. Under the optimized conditions, the transverse wavefront distortion of the double-pass amplified beam was less than $0.2{\mu}m$ for pump power of 14 kW.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.89-96
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• 2006

In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.