• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.41-57
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• 2004

The industry activities incorporating with research institute in developing manufacturing process. Academics are quite active in fundamental studies, alloy development, as well as international activities. Government, Associations, and Academics assist in knowledge spreading and training.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.508-513
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• 1994

For Pb-20wt%Cu alloys, severe macrosegregation due to density difference of the resulting phases in normal directional solidification has been minimized and a uniformly aligned dendritic structure has been produced by axially rotating the sample of 5mm diameter in conjunction with horizontal directional solidification. Under the constant growth velocity of $20{\mu}m/sec$, increasing the rotation rate from 0.18 to 12rpm results in a transition from an aligned columnar to an equiaxed Cu-dendritic structure. With a constant rotation rate of 0.18rpm, increasing the growth velocity from 10 to $50{\mu}m/sec$ also has promoted a transition from columnar to equiaxed structure.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.10
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• pp.1337-1345
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• 2001

Numerical investigation is made to study the effects of thermosolutal convection on the formation of macrosegregation in a Pb-Sn alloy solidification process in a two dimensional confined rectangluar mold. The basic equations are sovled using the Contrinum Model theory with the SIMPE algorithm during the solidification process. In addition, to track the liquid-solid interface with time variations, the moving boundary condition was adopted and moving irregular interface shapes were treated with the time-dependent, boundary-fitted coordinate system. As the temperature reduces from the liquidus to the solidus, the liquid concentration of Sn, the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients occurs in the mushy region and forms the complicated macrosegregation maps. belated to this phenomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are examined.

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.353-354
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.351-352
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• 2005

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Journal of Conservation Science
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• v.1 no.1 s.1
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• pp.27-39
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• 1992

Metallurgical studies of the bronze artifacts excavated from Miruksa Temple were performed by chemical analysis and metallographic observation. Alloy systems of the bronze artifacts were classified into two groups of Cu-Sn and Cu-Sn-Pb, according to the items. The contents of impurities such as Sb, As, Ni and Fe in bronze artifacts are within the limiting range of the mod ern standard bronze castings. Chemical compositions of the kitchen utensils such as bronze vessels and dishes in the Unified Silla dynasty, are in the follow ing range, Cu : 74.8-79.4% and Sn : 18.6-21.1%. Chemical composition of the Buddha-image in Koryo dynasty are 820Cu-7.0Sn-10.3Pb, showing increased Pb content and decreased Sn content. The results of chemical analysis suggest that the chemical compositions were good controlled. Any casting defects such as voids and shrinkage holes are not found microscopically, indicating high casting skill. Zinc atoms are not contained in the all bronze artifacts of Miruksa Temple site. This is the common facts founded in the east asian bronze artifacts of Korea, China and Japan. It is comparable with the European bronze of Cu-Sn-Pb-Zn system, after the Middle Age.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.435-443
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• 1990

By using the centrifugal atomization, which is one of the rapid solidification processes, Al-5,10wt%Pb alloys which are monotectic alloys were melted at 150K over two liquid phase line in the phase diagram. The melted alloy was poured on the rotating disk, being made into atomized powders, and then the solidified microstructure and morphology of the powder were investigated. This study converted the produced powders into strips by strained powder rolling. According to sintering temperature, the microstructure and hardness were investigated. The solidified structure of the powders were almost cellular dendritic structure. Pb particles ($2.0-3.0{\mu}m$) were fairl distributed in the Al matrix. Powder shapes were irregular. Rolling property and the compacting was good, respectively, because of increasing mechanical interlocking and surface area in the small size powders. With increasing temperature, the boundarys of powders were in porous form due to the diffusion. Pb particles which were surrounding the pores were inverse-segregated at the surface of the powders. With increasing of sintering temperature, the hardness of the powders and the strips decreased. In particular rolling-strip, the hardness abruptly decreased due to the release of work-hardening.

• Journal of the Korean Solar Energy Society
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• v.34 no.1
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• pp.98-104
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• 2014

Photovoltaic (PV) cell is considered as one of the finest ways to utilize the solar power. A study of improving solar cell's efficiency is important because the lifetime of solar cell is determined by photovoltaic module technology. Therefore, oxidation (and/or corrosion) of solder materials will be one of the primary yield and long-term reliability risk factor. Recently, the development of lead-free solder alloy has been done actively about lead-free solder alloys of the thermodynamic and mechanical properties. However, the oxidation behavior have rarely been investigated In this study, the oxidations of 60 wt% Sn-40 wt% Pb, 62 wt% Sn-36 wt% Pb -2 wt% Ag, 50wt% Sn-48 wt% Bi-2 wt% Ag alloys for the interconnect ribbon after exposure in atmosphere at $100^{\circ}C$ for several times were investigated. The wettability of 62 wt% Sn-36 wt% Pb-2 wt% Ag and 50 wt% Sn-48 wt% Bi-2 wt% Ag solders was also studied to compare with that of 60 wt% Sn-40 wt% Pb alloy. The results howed that the zero cross time and the wetting time of 50 wt% Sn-48 wt% Bi-2 wt% Ag solder were better than other two samples. The surface of tested samples was analyzed by XPS. The XPS result showed that in all samples, SnO grew first and then the mixture of SnO and $SnO_2$ was detected. $SnO_2$ grew predominantly for the long time aging. Moreover XPS depth profile analysis has found surface enrichment of tin oxide.